IP Library Granted Patent US 12,334,674
Granted Patent B2
US 12,334,674 · App. 17/470,646 · Granted Jun 17, 2025

DIMM retention assembly for compression mount technology and land grid array connector loading

Inventors: Xiang Li (Portland, OR); George Vergis (Portland, OR); Phil Geng (Washougal, WA)
Assignee: Intel Corporation
H01R13/6272G06F1/185H01R12/73H01R12/737H05K7/1409
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Quick Facts
Patent No.
US 12,334,674
App. No.
17/470,646
Granted
Jun 17, 2025
Kind
B2
Abstract

A memory module, a motherboard, and a latch assembly coupled to the memory module and the motherboard are described, the latch assembly including a connector coupled to the motherboard, a first lever coupled to the connector via a first pivot point, an load member extending through an opening in the first lever, a second lever coupled to the load member via a second pivot point, and a spring to bias the load member away from the opening in the first lever. The latch assembly may be used as a dual inline memory module (DIMM) retention assembly for compression mount technology (CMT) and land grid array (LGA) connector loading.

Claims (27)

1. A computing system comprising:

a memory module;

a motherboard; and

a latch assembly coupled to the memory module and the motherboard, the latch assembly including:

a connector coupled to the motherboard,

a first lever coupled to the connector via a first pivot point,

an L-shaped load member extending through an opening in the first lever,

a second lever coupled to the L-shaped load member via a second pivot point, and

a spring to bias the L-shaped load member away from the opening in the first lever, wherein the spring is located so as to coil around a portion of the L-shaped load member.

2. The computing system of claim 1 , wherein the L-shaped load member includes a protrusion extending away from the spring.

3. The computing system of claim 2 , wherein in a latched position, the first lever rotates toward the memory module and the spring engages the protrusion with a recess in the memory module.

4. The computing system of claim 1 , wherein in an open position, the second lever causes the L-shaped load member to compress the spring and the first lever rotates away from the memory module.

5. The computing system of claim 1 , wherein the connector is a land grid array connector.

6. The computing system of claim 1 , wherein the connector is a compression mount technology connector.

7. The computing system of claim 1 , wherein the first lever is an L-shaped lever and the second lever is a longitudinal lever.

8. A latch assembly comprising:

a connector;

a first lever coupled to the connector via a first pivot point;

an L-shaped load member extending through an opening in the first lever;

a second lever coupled to the L-shaped load member via a second pivot point; and

a spring to bias the L-shaped load member away from the opening in the first lever, wherein the spring is located so as to coil around a portion of the L-shaped load member.

9. The latch assembly of claim 8 , wherein the L-shaped load member includes a protrusion extending away from the spring.

10. The latch assembly of claim 9 , wherein in a latched position, the first lever rotates toward a memory module and the spring engages the protrusion with a recess in the memory module.

11. The latch assembly of claim 8 , wherein in an open position, the second lever causes the L-shaped load member to compress the spring and the first lever rotates away from a memory module.

12. The latch assembly of claim 8 , wherein the connector is a land grid array connector.

13. The latch assembly of claim 8 , wherein the connector is a compression mount technology connector.

14. The latch assembly of claim 8 , wherein the first lever is an L-shaped lever and the second lever is a longitudinal lever.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 29, 2021
From: LI, XIANG; VERGIS, GEORGE; GENG, PHIL
To: INTEL CORPORATION
Reel/Frame 057636/0157 →
Continuity (1)
Related Publication 20210408724A1 · Dec 30, 2021
References Cited (5)
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