Method for soldering an electronic component to a circuit board by jetting liquefied solder into a through hole
A method for soldering an electronic component to a circuit board involves jetting liquefied solder. A laser beam melts a solid solder ball to produce a liquefied solder ball before the ball is jetted. The liquefied solder ball is jetted towards a through hole in the circuit board such that a portion of the liquefied solder ball flows into an annular gap between a pin and sides of the through hole. The pin is attached to the electronic component and passes through the through hole. As the liquefied solder ball is jetted towards the through hole, the laser beam is directed at the ball so as to keep it liquefied. How much of the solder ball remains outside the through hole after liquefied solder has flowed into the annular gap is determined. The filling degree of the annular gap is determined based on how much solder remains outside the hole.
1. An apparatus for soldering an electronic component to a circuit board, comprising:
a capillary that constricts towards its outlet;
an electromechanical device adapted to direct the capillary towards a through hole in the circuit board;
a first laser adapted to supply energy to a solid solder ball in the capillary so as to produce a liquefied solder ball, wherein an inner diameter of the outlet of the capillary is smaller than a diameter of the solid solder ball, and wherein the liquefied solder ball is jetted towards the through hole when a pressurized gas is supplied into the capillary; and
an image processor adapted to determine a volume of the liquefied solder ball that remains outside the through hole after the liquefied solder ball is jetted towards the through hole and a portion flows into the through hole, wherein the apparatus determines a filling degree of the through hole based on how much of the liquefied solder ball remains outside the through hole and on a predetermined total volume of the liquefied solder ball before the liquefied solder ball is jetted.
2. The apparatus of claim 1 , wherein the liquefied solder ball is jetted towards the through hole from a first side of the circuit board that is opposite to a second side of the circuit board onto which the electronic component is mounted.
3. The apparatus of claim 1 , wherein the first laser emits a laser beam axially through the capillary.
4. The apparatus of claim 1 , further comprising:
an infrared temperature sensor adapted to measure a temperature of the liquefied solder ball, wherein the apparatus stops the first laser from supplying energy when the temperature of the liquefied solder ball exceeds an upper temperature threshold, and wherein the apparatus restarts the supplying of energy when the temperature of the liquefied solder ball falls below a lower temperature threshold.
5. The apparatus of claim 1 , further comprising:
a second laser adapted to supply energy to a pin of the electronic component that protrudes through the through hole so as to heat the pin, wherein the first laser emits light having a wavelength that is different than that of the light emitted by the second laser, and wherein the wavelength of the light emitted by the second laser is matched to an absorption characteristic of the pin.
6. The apparatus of claim 1 , wherein the circuit board has a back surface, wherein the electromechanical device is adapted to direct the capillary towards the through hole at an angle relative to the back surface, and wherein the angle is 30° to 60°.
7. The apparatus of claim 1 , wherein the apparatus is adapted to heat the circuit board to a temperature of 60° C. to 90° C. before the liquefied solder ball is jetted towards the through hole.
8. The apparatus of claim 1 , wherein the solid solder ball has a diameter of 0.8 mm to 2.0 mm, and wherein the diameter of the solid solder ball is 1.0 to 1.4 of the diameter of the through hole.
9. An apparatus for soldering an electronic component to a circuit board, comprising:
a capillary that constricts towards its outlet;
an electromechanical device adapted to direct the capillary towards a through hole in the circuit board;
a first laser adapted to supply energy to a solid solder ball in the capillary so as to produce a liquefied solder ball, wherein an inner diameter of the outlet of the capillary is smaller than a diameter of the solid solder ball, wherein when a pressurized gas is supplied into the capillary the liquefied solder ball is jetted towards an annular gap between a pin and sides of the through hole, wherein the pin is attached to the electronic component and passes through the through hole in the circuit board; and
an image processor adapted to determine how much of the liquefied solder ball remains outside the through hole after a portion of the liquefied solder ball has flowed into the annular gap, wherein the apparatus determines a filling degree of the through hole based on how much of the liquefied solder ball remains outside the through hole and on a predetermined total volume of the liquefied solder ball before the liquefied solder ball is jetted towards the annular gap.
10. The apparatus of claim 9 , wherein the liquefied solder ball is jetted towards the annular gap from a first side of the circuit board that is opposite to a second side of the circuit board onto which the electronic component is mounted.
11. The apparatus of claim 9 , wherein the first laser emits a laser beam axially through the capillary.
12. The apparatus of claim 9 , further comprising:
an infrared temperature sensor adapted to measure a temperature of the liquefied solder ball, wherein the apparatus stops the first laser from supplying energy when the temperature of the liquefied solder ball exceeds an upper temperature threshold, and wherein the apparatus restarts the supplying of energy when the temperature of the liquefied solder ball falls below a lower temperature threshold.
13. The apparatus of claim 9 , further comprising:
a second laser adapted to supply energy to the pin so as to heat the pin, wherein the first laser emits light having a wavelength that is different than that of the light emitted by the second laser, and wherein the wavelength of the light emitted by the second laser is matched to an absorption characteristic of the pin.
14. The apparatus of claim 9 , wherein the circuit board has a back surface, and wherein the electromechanical device is adapted to direct the capillary towards the through hole at an angle relative to the back surface, and wherein the angle is 30° to 60°.
15. The apparatus of claim 9 , wherein the apparatus is adapted to heat the circuit board to a temperature of 60° C. to 90° C. before the liquefied solder ball is jetted towards the annular gap.
16. The apparatus of claim 9 , wherein the solid solder ball has a diameter of 0.8 mm to 2.0 mm, and wherein the diameter of the solid solder ball is 1.0 to 1.4 of the diameter of the through hole.
17. An apparatus for soldering an electronic component to a circuit board, comprising:
a capillary that constricts towards its outlet;
an electromechanical device adapted to direct the capillary towards a through hole in the circuit board;
a first laser adapted to supply energy to a solid solder ball in the capillary so as to produce a liquefied solder ball, wherein an inner diameter of the outlet of the capillary is smaller than a diameter of the solid solder ball, wherein when a pressurized gas is supplied into the capillary the liquefied solder ball is jetted towards an annular gap between a pin and sides of the through hole, wherein the pin is attached to the electronic component and passes through the through hole in the circuit board; and
a second laser adapted to supply energy to the pin so as to heat the pin, wherein the first laser emits light having a wavelength that is different than that of the light emitted by the second laser, and wherein the wavelength of the light emitted by the second laser is matched to an absorption characteristic of the pin.
18. The apparatus of claim 17 , further comprising:
an image processor adapted to determine how much of the liquefied solder ball remains outside the through hole after the liquefied solder ball is jetted towards the annular gap and a portion flows into the through hole, wherein the apparatus determines a filling degree of the through hole based on how much of the liquefied solder ball remains outside the through hole and on a predetermined total volume of the liquefied solder ball before the liquefied solder ball is jetted.
19. The apparatus of claim 17 , further comprising:
an infrared temperature sensor adapted to measure a temperature of the liquefied solder ball, wherein the apparatus stops the first laser from supplying energy when the temperature of the liquefied solder ball exceeds an upper temperature threshold, and wherein the apparatus restarts the supplying of energy when the temperature of the liquefied solder ball falls below a lower temperature threshold.
20. The apparatus of claim 17 , wherein the apparatus is adapted to heat the circuit board to a temperature of 60° C. to 90° C. before the liquefied solder ball is jetted towards the annular gap.