Semiconductor structure and manufacturing method of the same
A semiconductor device, a back-side deep trench isolation (BDTI) structure of a semiconductor device, and method of manufacturing a semiconductor structure are provided. The semiconductor device, comprising: a pixel region disposed within a substrate and comprising an image sensing element configured to convert electromagnetic radiation into an electrical signal; and one or more BDTI structures extending from a first-side of the substrate to positions within the substrate; wherein the one or more of BDTI structures comprise one or more ferroelectric materials.
1. A semiconductor device, comprising:
a pixel region disposed within a substrate and comprising an image sensing element configured to convert electromagnetic radiation into an electrical signal;
one or more back-side deep trench isolation (BDTI) structures extending from a first side of the substrate to positions within the substrate; and
one or more front-side isolation structures extending from a second side of the substrate to positions within the substrate, wherein the second side of the substrate opposites to the first side of the substrate,
wherein the one or more BDTI structures comprise a ferroelectric layer including one or more ferroelectric materials, and a cap layer formed over the ferroelectric layer and including metals, metal nitrides or combinations thereof; and
wherein a bottom of the image sensing element is coplanar with the second side of the substrate.
2. The semiconductor device of claim 1 , wherein the one or more ferroelectric materials have a dielectric constant equal to or greater than 3.9.
3. The semiconductor device of claim 1 , wherein the one or more ferroelectric materials extend along an interface between the one or more BDTI structures and the substrate.
4. The semiconductor device of claim 1 , wherein the one or more BDTI structures further comprise one or more dielectric layers, and wherein the one or more ferroelectric materials vertically and laterally separate the one or more dielectric layers from the substrate.
5. The semiconductor device of claim 1 , wherein the one or more ferroelectric materials laterally extend over the first side of the substrate between adjacent BDTI structures.
6. The semiconductor device of claim 1 , wherein the one or more ferroelectric materials have a thickness between about 0.1 nm to about 50 nm.
7. The semiconductor device of claim 1 ,
wherein the image sensing element comprises a photodiode having a first region with a first doping type and a second region with a second doping type that is different than the first doping type.
8. The semiconductor device of claim 1 , wherein the one or more BDTI structures vertically extend from the first side of the substrate to a position that laterally isolate the image sensing element.
9. The semiconductor device of claim 1 , further comprising:
a line stack arranged on a second side of the substrate and comprising a plurality of metal interconnect layers arranged within one or more inter-level dielectric layers, so that the bottom of the image sensing element abuts an uppermost inter-level dielectric layer of the one or more inter-level dielectric layers.
10. A back-side deep trench isolation (BDTI) structure of a semiconductor device, comprising
a substrate;
a pixel region disposed within the substrate and comprising an image sensing element configured to convert electromagnetic radiation into an electrical signal;
a BDTI structure extending from a first side of the substrate to a position within the substrate; and
a front-side isolation structure extending from a second side of the substrate to a position within the substrate, wherein the second side of the substrate opposites to the first side of the substrate,
wherein the BDTI structure comprises an undoped dielectric layer, a doped dielectric layer formed on the undoped dielectric layer, and a cap layer formed over the doped dielectric layer and including metals, metal nitrides or combinations thereof,
wherein the doped dielectric layer vertically and laterally separates the undoped dielectric layer from the substrate, and
wherein a bottom of the image sensing element is coplanar with a second side of the substrate opposite to the first side of the substrate.
11. The BDTI structure of claim 10 , wherein the doped dielectric layer has an orthorhombic crystal structure.
12. The BDTI structure of claim 10 , wherein the undoped dielectric layer is amorphous.
13. The BDTI structure of claim 10 , wherein the undoped dielectric layer comprises hafnium oxide, lead zirconate titanate (PZT), lanthanum oxide, aluminium oxide, zirconium oxide, titanium oxide, tantalum oxide, yttrium oxide, strontium titanate (STO), barium titanate (BTO), barium zirconate, hafnium zirconate, hafnium-lanthanum oxide, hafnium-silicon oxide, lanthanum-silicon oxide, aluminium-silicon oxide, hafnium-tantalum oxide, hafnium-titanium oxide, or barium strontium titanate (BST).
14. The BDTI structure of claim 10 , wherein the doped dielectric layer comprises hafnium oxide, lead zirconate titanate (PZT), lanthanum oxide, aluminium oxide, zirconium oxide, titanium oxide, tantalum oxide, yttrium oxide, strontium titanate (STO), barium titanate (BTO), barium zirconate, hafnium zirconate, hafnium-lanthanum oxide, hafnium-silicon oxide, lanthanum-silicon oxide, aluminium-silicon oxide, hafnium-tantalum oxide, hafnium-titanium oxide, or barium strontium titanate (BST).
15. The BDTI structure of claim 10 , wherein a dopant of the doped dielectric layer comprises a metal element.
16. The BDTI structure of claim 10 , wherein a dopant of the doped dielectric layer comprises Si, Zr, Al, La, Y, Gd or Sr.
17. The BDTI structure of claim 16 , wherein a concentration of the dopant with respect to the doped dielectric layer is about 1 to about 99 atomic %.
18. A back-side deep trench isolation (BDTI) structure of a semiconductor device, comprising
a substrate;
a pixel region disposed within the substrate and comprising an image sensing element;
a BDTI structure extending from a first side of the substrate to a position within the substrate, and
a front-side isolation structure extending from a second side of the substrate to a position within the substrate, wherein the second side of the substrate opposites to the first side of the substrate,
wherein the BDTI structure comprises a paraelectric layer, a ferroelectric layer and a cap layer formed between the paraelectric layer and the ferroelectric layer and including metals, metal nitrides or combinations thereof,
wherein the ferroelectric layer vertically and laterally separates the paraelectric layer from the substrate, and
wherein a bottom of the image sensing element is coplanar with a second side of the substrate opposite to the first side of the substrate.
19. The BDTI structure of claim 18 , wherein the ferroelectric layer extends over the first side of the substrate.
20. The BDTI structure of claim 18 , wherein the paraelectric layer extends over the first side of the substrate.