Ceramic-insulated multi-metal substrate structure with integrated coating film for high-performance light-emitting devices
A light-emitting device of the present invention includes a plurality of substrates, an insulating portion, and an insulating upper surface coating film. The plurality of metal substrates are placed side by side to be separated from one another. The insulating portion is made of ceramic and fills the clearance. The insulating upper surface coating film is formed so as to integrally cover respective one substrate surfaces of the plurality of substrates and has an opening portion that spreads over the one substrate surface of one substrate among the plurality of substrates and the one substrate surface of another substrate adjacent to the one substrate across the clearance. The opening portion exposes an element placing region for placing an element.
1. A substrate structure comprising:
a plurality of substrates that are placed side by side to be separated from one another with a clearance interposed therebetween and are each made of metal;
an insulating portion made of ceramic that is formed so as to fill the clearance; and
an insulating upper surface coating film formed so as to integrate the plurality of substrates and integrally cover the upper surfaces of the plurality of substrates and having an opening portion that spreads over the upper surface of one substrate among the plurality of substrates and the upper surface of another substrate adjacent to the one substrate across the clearance, the opening portion exposing an element placing region for placing an element,
wherein the planar shape of the integrated substrates is a rectangle, the plurality of substrates are made of copper or an alloy with copper as a main material, the insulating portion is made of glass body having a siloxane bond and containing the metal oxide of alumina, zirconia, or silica, the clearances between the respective substrates and the insulating portions that fill the clearances have a crank shape in top view, and the edges of the bottom surface of the substrates along the clearances are recessed so that the binding areas between the respective substrates and the insulating portions are increased.
2. The substrate structure according to claim 1 , wherein
the insulating upper surface coating film is a polyimide resin.
3. A light-emitting device comprising:
a substrate structure including a plurality of substrates that are placed side by side to be separated from one another with a clearance interposed therebetween and are each made of metal, an insulating portion made of ceramic that is formed so as to fill the clearance, and an insulating upper surface coating film formed so as to integrally cover the upper surfaces of the plurality of substrates and having an opening portion that spreads over the upper surface of one substrate among the plurality of substrates and the upper surface of another substrate adjacent to the one substrate across the clearance, the opening portion exposing an element placing region for placing an element; and
a plurality of light-emitting elements arranged in a region exposed by the opening portion,
wherein the planar shape of the substrate structure is a rectangle, the plurality of substrates are made of copper or an alloy with copper as a main material, the insulating portion is made of glass body having a siloxane bond and containing the metal oxide of alumina, zirconia, or silica, the clearances between the respective substrates and the insulating portions that fill the clearances have a crank shape in top view, and the edges of the bottom surface of the substrates along the clearances are recessed so that the binding areas between the respective substrates and the insulating portions are increased.
4. The light-emitting device according to claim 3 ,
wherein the insulating upper surface coating film covers outer peripheral edge of the upper surface of the substrate structure, the light-emitting device comprises a frame body mounted on the surface coating film and formed along outer peripheral edge of the upper surface of the substrate structure.
5. The light-emitting device according to claim 3 , wherein
the plurality of light-emitting elements each include a supporting substrate, a semiconductor layer including a light-emitting layer formed on each upper surface of the supporting substrates, and an electrode formed on the supporting substrate.
6. The light-emitting device according to claim 3 , further comprising:
a wavelength converter extending across the plurality of light-emitting elements; and
a light reflective filler formed so as to cover side surfaces of the plurality of light-emitting elements and the wavelength converter.
7. A manufacturing method of the substrate structure according to claim 1 , comprising:
preparing a substrate base material made of copper or an alloy with copper as a main material;
forming the insulating upper surface coating film so as to cover the upper surface of the substrate base material;
dividing the substrate base material into a plurality of substrates from a surface facing the upper surface so as to be placed side by side to be separated from one another with a clearance interposed therebetween;
forming an insulating portion made of ceramic in the clearance between the respective plurality of substrates; and
forming an opening portion in the insulating upper surface coating film, the opening portion spreading over the one substrate surface of one substrate among the plurality of substrates and the one substrate surface of another substrate adjacent to the one substrate across the clearance, the opening portion exposing an element placing region for placing an element.
8. The manufacturing method of a substrate structure according to claim 7 , wherein
the forming of the insulating upper surface coating film includes attaching a polyimide resin preliminarily formed in a sheet shape to the one substrate surface of the substrate base material to form the insulating upper surface coating film.
9. The manufacturing method of a substrate structure according to claim 7 , wherein
the forming of the insulating portion includes forming the insulating portion by filling a ceramic sprayed film in the clearance by ceramic spraying.
10. The manufacturing method of a substrate structure according to claim 7 , wherein
the forming of the insulating portion includes filling and curing an inorganic adhesive in the clearance to form the insulating portion.
11. The manufacturing method of a substrate structure according to claim 8 , wherein
the forming of the opening portion includes irradiating a laser from the one substrate surface to the insulating upper surface coating film to form the opening portion.
12. The light-emitting device according to claim 1 , a fine unevenness is provided on the sides of the respective substrates facing the clearance.
13. The light-emitting device according to claim 4 , wherein the plurality of light-emitting elements each include a supporting substrate, a semiconductor layer including a light-emitting layer formed on each upper surface of the supporting substrates, and an electrode formed on the supporting substrate.
14. The light-emitting device according to claim 12 , further comprising:
a wavelength converter extending across the plurality of light-emitting elements; and
a light reflective filler formed so as to cover side surfaces of the plurality of light-emitting elements and the wavelength converter.
15. The light-emitting device according to claim 3 , a fine unevenness is provided on the sides of the respective substrates facing the clearance.
16. The light-emitting device according to claim 4 , the outer peripheral edge of the frame body is arranged inside the outer peripheral edge of the substrate structure and spaced from the outer peripheral edge of the substrate structure except for the corners so that the frame body has extending portions extended from the four corners of the frame body to the four corners of the substrate structure.
17. The light-emitting device according to claim 12 , the outer peripheral edge of the frame body is arranged inside the outer peripheral edge of the substrate structure and spaced from the outer peripheral edge of the substrate structure except for the corners so that the frame body has extending portions extended from the four corners of the frame body to the four corners of the substrate structure.