Granted Patent B2

US 12,356,539 · App. 18/248,631 · Granted Jul 8, 2025

Inventors: Mohsen Yousefbeiki (Gosselies Select, BE); Rafik Addaci (Gosselies Select, BE)

Assignees: AGC GLASS EUROPE; AGC INC.; AGC FLAT GLASS NORTH AMERICA, INC.; AGC VIDROS DO BRADIL LTDA

H05K1/0237H01P3/08H05K1/0353H05K3/4614H05K2201/0145

Abstract

Claims (27)

1. A laminated assembly comprising:

first and second dielectric panels laminated together by a polymeric-based interlayer, each of the first and the second dielectric panels having an internal surface, and the internal surfaces of the first and second dielectric panels facing each other;

at least first and second conductive elements, the first conductive element disposed on the internal surface of the first dielectric panel, the first and second conductive elements being isolated from each other; and

an RF interface board, having an inner and an outer part; the inner part being at least partially laminated with the first and the second dielectric panels by the polymeric based interlayer comprising

a dielectric support having a first and a second surface; and

at least a first and a second RF transmission strips disposed on the dielectric support, the first and the second RF transmission strips being electrically isolated from each other,

wherein a first surface and a second surface of the inner part of the RF interface board are substantially flat and parallel to each other, and

wherein the first RF transmission strip is electrically connected to the first conductive element at an inner part of the dielectric support and the second RF transmission strip is electrically connected to the second conductive element at the inner part of the dielectric support.

2. The laminated assembly according to claim 1 , wherein the second RF transmission strip of the RF interface board is on the first surface of the dielectric support.

3. The laminated assembly according to claim 1 , wherein the second RF transmission strip of the RF interface board is on the second surface of the dielectric support.

4. The laminated assembly according to claim 1 , wherein the RF interface board comprises a third RF transmission strip disposed on the dielectric support and isolated from the first and second RF transmission strips.

5. The laminated assembly according to claim 1 , wherein the second conductive element is disposed on the internal surface of the first dielectric panel and the second conductive element is electrically isolated from the first conductive element.

6. The laminated assembly according to claim 1 , wherein the second conductive element is disposed on the internal surface of the second dielectric panel.

7. The laminated assembly according to claim 6 , wherein the second RF transmission strip is on the second surface of the inner part of the RF interface board.

8. The laminated assembly according to claim 1 , wherein the at least first and second conductive elements are coating systems comprising at least a conductive layer.

9. The laminated assembly according to claim 1 , wherein the polymeric-based interlayer is a COP or ionomer-based interlayer.

10. The laminated assembly according to claim 1 , wherein the first and/or the second dielectric panel is a PET-based panel.

11. A method for electrically connecting a laminated assembly according to claim 1 , wherein the method comprises connecting a shield of a coaxial cable to the first RF transmission strip at an outer part of the dielectric support and a core of the coaxial cable to the second RF transmission strip at the outer part of the dielectric support.

12. A method for electrically connecting a laminated assembly according to claim 1 , comprising connecting a commercially-available connector to the first RF transmission strip and to the second RF transmission strip disposed on the dielectric support.

13. An RF interface board for connecting a connector or soldering a cable to transmit and/or receive an RF signal to an outside of a laminated assembly, the laminated assembly comprising:

first and second dielectric panels laminated together by a polymeric-based interlayer, each of the first and the second dielectric panels having an internal surface, and the internal surfaces of the first and second dielectric panels facing each other; and

at least first and second conductive elements, the first conductive element being disposed on the internal surface of the first dielectric panel and the two conductive elements being isolated from each other,

the RF interface board having an inner and an outer part, comprising

a dielectric support having first and second surfaces, and

at least first and second RF transmission strips disposed on the dielectric support, the first and the second RF transmission strips being electrically isolated from each other, the first and the second RF transmission strips configured to be connected to an RF connector or to an RF module at an outer part of the RF transmission strips and each configured to be connected to a different conductive element at an inner part of the RF transmission strips, the first RF transmission strip being on the first surface of the dielectric support,

wherein the first and the second surfaces of the dielectric support are substantially parallel and substantially flat, and

wherein the inner part of the RF interface board is at least partially laminated with the first and the second dielectric panels by the polymeric based interlayer.

Assignments (1)

Priority Claims (1)

Continuity (1)

References Cited (28)