IP Library › Granted Patent US 12,361,987
Granted Patent B1
US 12,361,987 · App. 18/302,667 · Granted Jul 15, 2025

Non-volatile storage of secure data in 6T SRAM cells using hot carrier injection

Inventors: Zachary Irving Belateche (Pasadena, CA); Vincent Cheung (Pasadena, CA); Chandler Mills Watson (Pasadena, CA); Sean Patrick Hackett (Pasadena, CA)
Assignee: BTQ Technologies Corp.
G11C7/1096G11C7/1087G11C7/12
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,361,987
App. No.
18/302,667
Granted
Jul 15, 2025
Kind
B1
Abstract

A processor has a Static Random Access Memory (SRAM) array with individual SRAM cells, each individual SRAM cell has six transistors including a first access transistor, a second access transistor, a first N-Channel Metal-Oxide Semiconductor (NMOS) transistor cross-coupled with a first P-Channel Metal-Oxide Semiconductor (PMOS) transistor forms a first inverter, and a second NMOS transistor cross-coupled with a second PMOS transistor forms a second inverter. The processor has a write driver. A global Hot Carrier Injection (HCI) driving circuit programs at least one individual SRAM cell by driving low the source of the first PMOS transistor and the source of the second PMOS transistor while driving high the source of the first NMOS transistor and the source of the second NMOS transistor while the write driver drives low a first bit line to the first access transistor, such that a large current flows through the first NMOS transistor from source to drain causing hot carriers to be injected into oxide of the first NMOS transistor and thereby alter the threshold voltage of the first NMOS transistor for stability over changing environmental conditions.

Claims (10)

1. A processor, comprising:

a Static Random Access Memory (SRAM) array with individual SRAM cells, each individual SRAM cell comprising six transistors including a first access transistor, a second access transistor, a first N-Channel Metal-Oxide Semiconductor (NMOS) transistor cross coupled with a first P-Channel Metal-Oxide Semiconductor (PMOS) transistor to form a first inverter, a second NMOS transistor cross-coupled with a second PMOS transistor to form a second inverter;

a write driver; and

a global Hot Carrier Injection (HCI) driving circuit to program at least one individual SRAM cell by driving low the source of the first PMOS transistor and the source of the second PMOS transistor while driving high the source of the first NMOS transistor and the source of the second NMOS transistor while the write driver drives low a first bit line to the first access transistor, such that a large current flows through the first NMOS transistor from source to drain causing hot carriers to be injected into oxide of the first NMOS transistor and thereby alter the threshold voltage of the first NMOS transistor for stability over changing environmental conditions.

2. The processor of claim 1 further comprising a write buffer driving high a second bit line to the second access transistor causing a small current through the first PMOS transistor.

3. The processor of claim 2 wherein the second NMOS transistor and the second PMOS transistor remain off during the program.

4. The processor of claim 1 further comprising split word line drivers connected to the SRAM array.

5. The processor of claim 1 further comprising sense amplifiers connected to the SRAM array.

6. The processor of claim 1 further comprising a column logic connected to the SRAM array.

7. The processor of claim 1 further comprising an inter-column routing circuit connected to the SRAM array.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 25, 2024
From: RADICAL SEMICONDUCTOR, INC.
To: INSOLVENCY SERVICES GROUP, INC.
Reel/Frame 069018/0868 →
BILL OF SALE Recorded Oct 25, 2024
From: INSOLVENCY SERVICES GROUP INC.
To: BTQ TECHNOLOGIES CORP.
Reel/Frame 069238/0807 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 18, 2023
From: BELATECHE, ZACHARY IRVING; CHEUNG, VINCENT; WATSON, CHANDLER MILLS; HACKETT, SEAN PATRICK
To: RADICAL SEMICONDUCTOR, INC.
Reel/Frame 064939/0349 →
Continuity (1)
Provisional Application 63333003 · Apr 20, 2022
References Cited (23)
US 7148404B2 · Hogenhaug · 2006 [cited by examiner]
US 7158404B2 · Lai · 2007 [cited by examiner]
US 7359275B1 · Wu · 2008 [cited by examiner]
US 7471570B2 · Morton · 2008 [cited by examiner]
US 9153594B2 · Jain · 2015 [cited by examiner]
US 9286970B2 · Kuo · 2016 [cited by examiner]
US 9460760B2 · Jayaraman · 2016 [cited by examiner]
US 9786357B2 · Abu-Rahma · 2017 [cited by examiner]
US 10269419B2 · Kulkarni · 2019 [cited by examiner]
US 10283191B1 · Pathak · 2019 [cited by examiner]
US 12046276B2 · Yang · 2024 [cited by examiner]
US 20070028076A1 · Wezelenburg · 2007 [cited by applicant]
US 20090073776A1 · Kodama · 2009 [cited by examiner]
US 20100329068A1 · Sasaki et al. · 2010 [cited by applicant]
US 20130122672A1 · Or-Bach et al. · 2013 [cited by applicant]
US 20140247673A1 · Muralimanohar et al. · 2014 [cited by applicant]
US 20160189769A1 · Jeloka et al. · 2016 [cited by applicant]
US 20190305971A1 · Li · 2019 [cited by examiner]
US 20190312728A1 · Poeppelmann · 2019 [cited by applicant]
US 20210072986A1 · Yudanov et al. · 2021 [cited by applicant]
US 20210342676A1 · Hoang et al. · 2021 [cited by applicant]
US 20220036942A1 · Wang et al. · 2022 [cited by applicant]
US 20220229663A1 · Martinez et al. · 2022 [cited by applicant]