IP Library Granted Patent US 12,374,854
Granted Patent B2
US 12,374,854 · App. 18/129,615 · Granted Jul 29, 2025

Laser-based integrated light source

Inventors: Sten Heikman (Goleta, CA); Terry Towe (Goleta, CA); Sudeep Khanal (Goleta, CA)
Assignee: KYOCERA SLD Laser, Inc.
H01S5/0087H01S5/02224H01S5/02257H01S5/02325H01S5/02469H01S5/02476H01S5/2201H01S5/32H01S5/3203H01S5/34333F21V29/70F21Y2115/30H01S5/0216H01S5/0217H01S5/0222
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Quick Facts
Patent No.
US 12,374,854
App. No.
18/129,615
Granted
Jul 29, 2025
Kind
B2
Abstract

A laser-based light source includes a material arranged on a package base adjacent to a laser diode chip and an optical element coupled to the material. The optical element is aligned to receive electromagnetic radiation from the laser diode chip. The optical element includes a wavelength conversion material and is configured to receive at least a portion of the electromagnetic radiation emitted by the laser diode chip. A reflective material surrounds sides of the optical element.

Claims (39)

1. A laser-based light source, comprising:

a package base;

a laser diode chip coupled to the package base, the laser diode chip configured to output a laser beam of electromagnetic radiation from an output facet; the laser diode chip configured to emit the electromagnetic radiation at a first wavelength;

a material element coupled to the package base and arranged on the package base adjacent to the laser diode chip, the material element having a reflective surface;

an optical element coupled directly to a top surface of the material element, wherein;

a groove extends between a portion of the material element and a portion of the optical element from a side of the material element, a side of the optical element, or both,

the groove is aligned with the laser diode chip to receive the electromagnetic radiation from the laser diode chip, and

the reflective surface of the material element is arranged to reflect light from the laser diode chip upward;

and the material element configured to direct at least a portion of the electromagnetic radiation in the groove into the optical element, the optical element including a wavelength conversion material configured to convert at least a fraction of the electromagnetic radiation in the laser beam with the first wavelength to a second wavelength that is longer than the first wavelength; and

a reflective material layer surrounding sides of the optical element, the reflective material layer configured to reflect portions of the electromagnetic radiation incident on the sides of the optical element, wherein the optical element is configured to emit a light from a top surface, the light including a first portion having the first wavelength and a second portion having the second wavelength.

2. The laser-based light source of claim 1 , further comprising one or more additional laser diode chips and one or more additional grooves, each of the one or more additional laser diode chips aligned with one of the additional grooves, wherein the one or more additional laser diode chips are configured to emit electromagnetic radiation at the first wavelength.

3. The laser-based light source of claim 1 , further comprising one or more additional laser diode chips and one or more additional grooves, each of the one or more additional laser diode chips aligned with one of the additional grooves, wherein at least one of the one or more additional laser diode chips is configured to emit electromagnetic radiation at a wavelength different from the first wavelength.

4. The laser-based light source of claim 1 , wherein the groove is formed in a top of the material element and extends from a side surface of the material element, the groove reflecting a least a portion of the electromagnetic radiation in an upward direction toward the optical element.

5. The laser-based light source of claim 1 , wherein the material element is thermally conductive and includes silicon (Si), silicon carbide (SiC), germanium (Ge), gallium arsenide (GaAs), sapphire, ceramic aluminum nitride (AlN), ceramic aluminum oxide (Al 2 O 3 , ceramic boron nitride (BN), aluminum (Al), or copper (Cu), and the reflective surface includes a reflective coating on the material element.

6. The laser-based light source of claim 1 , wherein the wavelength conversion material is dispersed throughout the optical element.

7. The laser-based light source of claim 1 , wherein an upper portion of the optical element includes an optical homogenizer configured to improve color uniformity of the light emitted from the top surface of the optical element.

8. The laser-based light source of claim 1 , wherein at least one of sides, a top, or a bottom of the groove are covered with a reflective coating.

9. The laser-based light source of claim 1 , wherein a gap extends between at least some sides of the optical element and the reflective material layer.

10. The laser-based light source of claim 1 , further comprising a scattering material in the groove, the scattering material in the groove configured to scatter at least a portion of the electromagnetic radiation from the laser diode chip into the optical element.

11. The laser-based light source of claim 1 , wherein the groove includes sidewalls having flat planes or sidewalls having curved sections.

12. The laser-based light source of claim 1 , wherein the reflective material layer includes a reflective coating on inside walls of the reflective material layer.

13. The laser-based light source of claim 1 , wherein the optical element includes at least one of scattering features, diffractive features, or photonic crystal structures configured to provide color uniformity of the light emitted from the top surface of the optical element.

14. A surface mount device (SMD) comprising the laser-based light source of claim 1 .

15. A laser-based light source, comprising:

a package base;

a laser diode chip coupled to the package base, the laser diode chip configured to output a laser beam of electromagnetic radiation from an output facet; the laser diode chip configured to emit the electromagnetic radiation at a first wavelength;

a material element coupled to the package base and arranged on the package base adjacent to the laser diode chip, the material element having a reflective surface;

an optical element coupled directly to a top surface of the material element, wherein a groove extends along a bottom of the optical element;

a light guide aligned with the output facet of the laser diode chip on one end and aligned with the groove on another end, the light guide configured and arranged to guide at least a portion of the electromagnetic radiation from the laser diode chip to the groove in the optical element, wherein the optical element includes a wavelength conversion material and is configured to receive at least a portion of the electromagnetic radiation emitted into the optical element, the wavelength conversion material being configured to convert at least a fraction of the electromagnetic radiation in the laser beam with the first wavelength to a second wavelength that is longer than the first wavelength; and

a reflective material layer surrounding sides of the optical element, the reflective material layer configured to reflect portions of the electromagnetic radiation incident on the sides of the optical element, wherein the optical element is configured to emit a light from a top surface, the light including a first portion having the first wavelength and a second portion having the second wavelength.

16. The laser-based light source of claim 15 , the groove extending between a portion of the material element and a portion of the optical element, a second laser diode chip and a second light guide, wherein the light guide is aligned with a first end of the groove, and the second light guide is aligned with a second end of the groove, the second light guide configured and arranged to guide second electromagnetic radiation from the second laser diode chip to the groove in an optically transparent material.

17. The laser-based light source of claim 15 , wherein the material element is thermally conductive and includes silicon (Si), silicon carbide (SiC), germanium (Ge), gallium arsenide (GaAs), sapphire, ceramic aluminum nitride (AlN), ceramic aluminum oxide (Al 2 O 3 , ceramic boron nitride (BN), aluminum (Al), or copper (Cu)), and the reflective surface includes a reflective coating on the material element.

18. The laser-based light source of claim 15 , wherein the wavelength conversion material is dispersed throughout the optical element.

19. The laser-based light source of claim 15 , wherein an upper portion of the optical element includes on optical homogenizer configured to improve color uniformity of the light emitted from the top surface of the optical element.

20. The laser-based light source of claim 15 , wherein a gap extends between at least some sides of the optical element and the reflective material layer.

21. The laser-based light source of claim 15 , further comprising a scattering material in the groove, the scattering material in the groove configured to scatter the electromagnetic radiation from the laser diode chip into the optical element.

22. A surface mount device (SMD) comprising the laser-based light source of claim 15 .

23. The laser-based light source of claim 15 , wherein the reflective material layer includes a reflective coating on inside walls of the reflective material layer.

24. The laser-based light source of claim 15 , wherein the optical element includes at least one of scattering features, diffractive features, or photonic crystal structures configured to provide color uniformity of the light emitted from the top surface of the optical element.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 23, 2023
From: HEIKMAN, STEN; TOWE, TERRY; KHANAL, SUDEEP
To: KYOCERA SLD LASER, INC.
Reel/Frame 063731/0090 →
Continuity (4)
Continuation In Part 17445938 · Aug 25, 2021
Continuation In Part 17163903 · Feb 1, 2021
Continuation 14829927 · Aug 19, 2015
Related Publication 20230238767A1 · Jul 27, 2023
References Cited (71)
US 6791103B2 · Nakamura et al. · 2004 [cited by applicant]
US 7667238B2 · Erchak et al. · 2010 [cited by applicant]
US 8106414B2 · Sugiyama · 2012 [cited by examiner]
US 9025635B2 · Goutain et al. · 2015 [cited by applicant]
US 9318875B1 · Goutain · 2016 [cited by applicant]
US 9595813B2 · Raring et al. · 2017 [cited by applicant]
US 10079470B2 · Kozuru et al. · 2018 [cited by applicant]
US 10879673B2 · Raring et al. · 2020 [cited by applicant]
US 10938182B2 · Raring et al. · 2021 [cited by applicant]
US 11437774B2 · Rudy et al. · 2022 [cited by applicant]
US 11437775B2 · Raring et al. · 2022 [cited by applicant]
US 20030107316A1 · Murakami · 2003 [cited by examiner]
US 20040105481A1 · Ishida et al. · 2004 [cited by applicant]
US 20040263074A1 · Baroky et al. · 2004 [cited by applicant]
US 20060018351A1 · Matsubara et al. · 2006 [cited by applicant]
US 20060139926A1 · Morioka et al. · 2006 [cited by applicant]
US 20060221021A1 · Hajjar et al. · 2006 [cited by applicant]
US 20070012940A1 · Suh et al. · 2007 [cited by applicant]
US 20070029571A1 · Hanaoka et al. · 2007 [cited by applicant]
US 20080054280A1 · Reginelli et al. · 2008 [cited by applicant]
US 20080089089A1 · Hama et al. · 2008 [cited by applicant]
US 20090003400A1 · Nagahama et al. · 2009 [cited by applicant]
US 20090103581A1 · Bessho · 2009 [cited by applicant]
US 20100246159A1 · Wada · 2010 [cited by applicant]
US 20100295438A1 · Ott et al. · 2010 [cited by applicant]
US 20120039072A1 · Lell et al. · 2012 [cited by applicant]
US 20120051377A1 · Liang et al. · 2012 [cited by applicant]
US 20130001627A1 · Kinoshita et al. · 2013 [cited by applicant]
US 20130176705A1 · Ohta · 2013 [cited by applicant]
US 20130207148A1 · Kräuter et al. · 2013 [cited by applicant]
US 20130208442A1 · Reiherzer · 2013 [cited by applicant]
US 20140168942A1 · Kishimoto et al. · 2014 [cited by applicant]
US 20140340918A1 · Suckling et al. · 2014 [cited by applicant]
US 20160268770A1 · Tazawa et al. · 2016 [cited by applicant]
US 20160290584A1 · Nomura et al. · 2016 [cited by applicant]
US 20170040768A1 · Waclawik · 2017 [cited by examiner]
US 20170051883A1 · Raring et al. · 2017 [cited by applicant]
US 20170051884A1 · Raring et al. · 2017 [cited by applicant]
US 20180284334A1 · Keating et al. · 2018 [cited by applicant]
US 20210151956A1 · Raring · 2021 [cited by examiner]
US 20210226410A1 · Raring et al. · 2021 [cited by applicant]
US 20220115839A1 · Singer · 2022 [cited by examiner]
US 20220231479A1 · Raring et al. · 2022 [cited by applicant]
US 20220320819A1 · Rudy et al. · 2022 [cited by applicant]
US 20220376462A1 · Heikman · 2022 [cited by applicant]
CN 108139054 · 2018 [cited by applicant]
CN 217178318U · 2022 [cited by applicant]
CN 218300556U · 2023 [cited by applicant]
DE 112005003083T5 · 2007 [cited by examiner]
EP 1571715A1 · 2005 [cited by applicant]
EP 2672178A2 · 2013 [cited by applicant]
EP 3338023 · 2018 [cited by applicant]
EP 3987220A1 · 2022 [cited by applicant]
JP 2015022954A · 2015 [cited by applicant]
JP 3237794 · 2022 [cited by applicant]
JP 7082043 · 2022 [cited by applicant]
KR 102521474B1 · 2023 [cited by applicant]
WO 2017031446A1 · 2017 [cited by applicant]
U.S. Appl. No. 17/103,587 Non-Final Office Action mailed Aug. 14, 2023, 23 pages. [cited by applicant]
U.S. Appl. No. 14/829,927 Notice of Allowance mailed Oct. 28, 2020, 16 pages. [cited by applicant]
U.S. Appl. No. 14/829,927 Non-Final Office Action mailed Sep. 26, 2017, 44 pages. [cited by applicant]
U.S. Appl. No. 14/829,927 Non-Final Office Action mailed May 12, 2020, 28 pages. [cited by applicant]
U.S. Appl. No. 14/829,927 Non-Final Office Action mailed Mar. 21, 2019, 26 pages. [cited by applicant]
U.S. Appl. No. 14/829,927 Final Office Action mailed Jul. 26, 2018, 39 pages. [cited by applicant]
U.S. Appl. No. 17/163,903 Non-Final Office Action mailed Sep. 27, 2023, 27 pages. [cited by applicant]
U.S. Appl. No. 17/163,903 Final Office Action mailed Apr. 23, 2024, 28 pages. [cited by applicant]
U.S. Appl. No. 17/163,903 Advisory Action mailed Jul. 23, 2024, 4 pages. [cited by applicant]
U.S. Appl. No. 17/698,976 Non-Final Office Action mailed Jun. 27, 2024, 21 pages. [cited by applicant]
U.S. Appl. No. 17/445,938 Non-Final Office Action mailed Jun. 27, 2024, 21 pages. [cited by applicant]
U.S. Appl. No. 17/445,938 Notice of Allowance mailed Dec. 20, 2024, 12 pages. [cited by applicant]
U.S. Appl. No. 18/737,845, Non-Final Office Action, Mailed On Apr. 29, 2025, 13 pages. [cited by applicant]