IP Library Granted Patent US 12,397,549
Granted Patent B2
US 12,397,549 · App. 18/329,376 · Granted Aug 26, 2025

Electrowetting for drop-on-demand metal additive manufacturing

Inventors: Horea Ilies (Farmington, CT); Jiangce Chen (Farmington, CT)
Assignee: University of Connecticut
B41J2/14B33Y30/00B33Y50/02B41J2002/14395
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Quick Facts
Patent No.
US 12,397,549
App. No.
18/329,376
Granted
Aug 26, 2025
Kind
B2
Abstract

An apparatus for generating a droplet of a liquid metal material in a metal additive manufacturing process includes a nozzle configured to eject the droplet of the liquid metal material, the nozzle including a conductive solid. The apparatus also includes a voltage source configured to apply voltage between the conductive solid and the liquid metal material to modify a contact angle between an inner wall of the nozzle and the liquid metal material within the nozzle. The apparatus also includes a controller configured to modify the voltage from the voltage source to modify the contact angle and generate the droplet of the liquid metal material.

Claims (17)

1. A computer-based system for generating a droplet of a liquid metal material in a metal additive manufacturing process, the computer-based system comprising:

an electronic controller configured to

maintain the liquid metal material within a nozzle at a stable contact angle; and

modify the contact angle between an inner wall of the nozzle and the liquid metal material within the nozzle to move the liquid metal material out of the nozzle and generate the droplet of liquid metal material,

wherein the electronic controller is configured to increase the contact angle to decrease the wettability of the inner wall of the nozzle and release the droplet from the nozzle.

2. The computer-based system of claim 1 , wherein the nozzle comprises a conductive solid, and wherein the inner wall of the nozzle is coated with a thin layer of a dielectric material such that the dielectric material is located between the conductive solid and the liquid metal material.

3. The computer-based system of claim 1 , wherein the liquid metal material is one of mercury, aluminum, or an aluminum alloy.

4. The computer-based system of claim 1 , wherein the electronic controller is configured to decrease the contact angle to increase the amount of liquid metal that is moved out of the nozzle.

5. The computer-based system of claim 1 , wherein the electronic controller is configured to firstly decrease the contact angle to increase the amount of liquid metal that is moved out of the nozzle and then secondly increase the contact angle to decrease the wettability of the inner wall of the nozzle and release the droplet from the nozzle.

6. The computer-based system of claim 5 , wherein the electronic controller is configured to, after increasing the contact angle to decrease the wettability of the inner wall of the nozzle and release the droplet from the nozzle, decrease the contact angle to the stable contact angle.

7. The computer-based system of claim 1 , wherein the electronic controller is configured to apply voltage between a conductive solid and the liquid metal material in the nozzle.

8. The computer-based system of claim 7 , wherein the nozzle is the conductive solid such that the electronic controller is configured to apply voltage between the nozzle and the liquid metal material in the nozzle.

9. The computer-based system of claim 1 , wherein the electronic controller is configured to modify the contact angle for a time duration between 0.01-0.20 seconds.

10. The computer-based system of claim 1 , wherein the nozzle is a first nozzle of a plurality of nozzles in a cluster of printing heads, wherein the electronic controller is configured to generate the droplet of the first nozzle independent of the remaining plurality of nozzles.

11. The computer-based system of claim 10 , wherein the electronic controller is configured to control each of the plurality of nozzles to dispense a different liquid metal material.

12. The computer-based system of claim 1 , wherein the system is provided as a kit for retrofit of another system.

13. The computer-based system of claim 12 , wherein the kit comprises a voltage source, the nozzle, and one of the electronic controller and a set of machine executable instructions stored on non-transitory machine readable media.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 12, 2023
From: ILIES, HOREA; CHEN, JIANGCE
To: UNIVERSITY OF CONNECTICUT
Reel/Frame 064229/0438 →
Continuity (2)
Provisional Application 63349290 · Jun 6, 2022
Related Publication 20230391079A1 · Dec 7, 2023
References Cited (35)
US 10850272B2 · Umapathi et al. · 2020 [cited by applicant]
US 10969350B2 · Ros et al. · 2021 [cited by applicant]
US 11020736B2 · Abate et al. · 2021 [cited by applicant]
US 11167288B2 · Gach et al. · 2021 [cited by applicant]
US 11192108B2 · Breinlinger et al. · 2021 [cited by applicant]
US 11607724B2 · Sukhotskiy et al. · 2023 [cited by applicant]
US 20050116069A1 · Murata · 2005 [cited by examiner]
US 20100024725A1 · Lennon et al. · 2010 [cited by applicant]
US 20130284956A1 · Kwon · 2013 [cited by examiner]
US 20140322451A1 · Barton · 2014 [cited by examiner]
US 20150273577A1 · Vader et al. · 2015 [cited by applicant]
US 20170087632A1 · Mark · 2017 [cited by examiner]
Berge, B. English Abstract of “Electrocapillarite et mouillage de films isolants par l'eau.” Comptes Rendus de L'Academie des Sciences Paris, Serie, II 317 (1993): 157-163. [cited by applicant]
Christopher, G. F. et al. “Microfluidic methods for generating continuous droplet streams.” Journal of Physics D: Applied Physics 40.19 (2007): R319. [cited by applicant]
Eaker, C. B., et al. “Liquid metal actuation by electrical control of interfacial tension.” Applied Physics Reviews 3.3 (2016): 031103. [cited by applicant]
Gilani, N., et al. “Insights into drop-on-demand metal additive manufacturing through an integrated experimental and computational study.” Additive Manufacturing 48 (2021): 102402. [cited by applicant]
Gu, H. et al. “Droplets formation and merging in two-phase flow microfluidics.” International Journal of molecular sciences 12.4 (2011): 2572-2597. [cited by applicant]
Gu, Hao, et al. “Electrowetting-enhanced microfluidic device for drop generation.” Applied Physics Letters 93.18 (2008): 183507. [cited by applicant]
He, B., et al. “The roles of wettability and surface tension in droplet formation during inkjet printing.” Scientific reports 7.1 (2017): 11841. [cited by applicant]
Jakeway, S. C., et al. “Miniaturized total analysis systems for biological analysis.” Fresenius' journal of analytical chemistry 366 (2000): 525-539. [cited by applicant]
Jiang, Y., et al. “Electrowetting-assisted direct ink writing for low-viscosity liquids.” Journal of Manufacturing Processes 69 (2021): 173-180. [cited by applicant]
Lippmann G. et al. Relations entre les ph'enom'enes 'electriques et capillaires. PhD thesis, Gauthier-Villars Paris, France, 1875. [cited by applicant]
Malloggi, F., et al. “Electrowetting—A versatile tool for controlling microdrop generation.” The European Physical Journal E 26 (2008): 91-96. [cited by applicant]
Merdasi, A. et al. “Electrowetting induced droplet generation in T-junctions.” Journal of Heat Transfer 143.5 (2021): 052103. [cited by applicant]
Mugele, F. et al. “Electrowetting: from basics to applications.” Journal of physics: condensed matter 17.28 (2005): R705. [cited by applicant]
Murr, L. E. et al. “3D metal droplet printing development and advanced materials additive manufacturing.” Journal of Materials Research and Technology 6.1 (2017): 77-89. [cited by applicant]
Orme, M. et al. “Molten aluminum micro-droplet formation and deposition for advanced manufacturing applications.” Aluminum Transactions 3.1 (2000): 95-103. [cited by applicant]
Plog, J., et al. “Control of direct written ink droplets using electrowetting.” Langmuir 35.34 (2019): 11023-11036. [cited by applicant]
Plog, J., et al. “Drop Manipulation by Electrowetting for 3D Printing.” APS Division of Fluid Dynamics Meeting Abstracts. 2019. [cited by applicant]
Sukhotskiy, V. et al. “Magnetohydrodynamic drop-on-demand liquid metal 3D printing.” 2017 International Solid Freeform Fabrication Symposium. University of Texas at Austin, 2017. [cited by applicant]
Wan, Z. et al. “Reversible electrowetting of liquid-metal droplet.” (2007): 388-394. [cited by applicant]
Watson, A.M. et al. “Electrowetting-assisted selective printing of liquid metal.” Advanced Engineering Materials 21.10 (2019): 1900397. [cited by applicant]
Watson, A. M., et al. “Focus-tunable low-power electrowetting lenses with thin parylene films.” Applied optics 54.20 (2015): 6224-6229. [cited by applicant]
Yarin, A. L. “Wetting for self-healing and electrowetting for additive manufacturing.” Current Opinion in Colloid & Interface Science 51 (2021): 101378. [cited by applicant]
Zhong, S.-Y., et al. “Effect of process parameters on copper droplet ejecting by pneumatic drop-on-demand technology.” Journal of materials processing technology 214.12 (2014): 3089-3097. [cited by applicant]