Carrier measurement device, carrier measurement method, and carrier management method
A carrier measuring device includes a rotary table, a table drive motor, an upper thickness sensor, a lower thickness sensor and a slide unit. The rotary table includes a carrier receiver configured to horizontally house a carrier formed with a hole in which a semiconductor wafer is held, the hole being eccentric with respect to the carrier. The table drive motor rotates the rotary table around a center axis thereof as a rotation axis. The upper thickness sensor and the lower thickness sensor are positioned above and below the carrier, respectively, and measure a thickness of the carrier in a non-contact manner. The slide unit slides the rotary table in a horizontal direction. The carrier receiver is formed to be capable of housing the carrier in a manner that a center of the hole coincides with a center of the rotary table.
1. A carrier measuring device configured to measure a thickness of a carrier having a hole in which a disc-shaped semiconductor wafer is to be held, the hole being eccentric with respect to the carrier, the carrier measuring device comprising:
a rotary table comprising a carrier receiver configured to horizontally house the carrier;
a table drive motor configured to rotate the rotary table around a center axis thereof as a rotation axis;
an upper thickness sensor and a lower thickness sensor configured to be positioned above and below the carrier, respectively, and measure the thickness of the carrier in a non-contact manner; and
a slide unit configured to slide, in a horizontal direction, one or both of: the rotary table; and the upper thickness sensor and the lower thickness sensor, wherein
the carrier receiver is formed to be capable of housing the carrier in a manner that a center of the hole of the carrier coincides with a center of the rotary table.
2. The carrier measuring device according to claim 1 , further comprising a sensor frame attached with the upper thickness sensor and the lower thickness sensor between which the rotary table is capable of passing through in the horizontal direction.
3. The carrier measuring device according to claim 2 , wherein
the upper thickness sensor and the lower thickness sensor are attached to the sensor frame in a manner to be respectively positioned above and below a straight line passing through the center of the rotary table and a center of the carrier receiver, and
the slide unit slides one or both of the rotary table and the sensor frame in the horizontal direction parallel to the straight line.
4. A carrier measurement method for measuring, by using the carrier measuring device according to claim 1 , a thickness of a disc-shaped carrier having a hole in which a disc-shaped semiconductor wafer is to be held, the hole being eccentric with respect to the carrier, the carrier measurement method comprising:
first measuring the thickness of the carrier at a predetermined point while sliding, in the horizontal direction, one or both of: the rotary table in which the carrier is housed; and the upper thickness sensor and the lower thickness sensor; and
second measuring a thickness of a hole surrounding portion that surrounds the hole of the carrier while rotating the rotary table in which the carrier is housed.
5. A carrier management method for managing, on a basis of measurement results obtained through measurement using the carrier measuring device according to claim 1 , a plurality of disc-shaped carriers each having a hole in which a disc-shaped semiconductor wafer is to be held, the hole being eccentric with respect to the corresponding carrier, the carrier management method comprising:
first measuring the thickness of each of the carriers at a predetermined point while sliding, in the horizontal direction, one or both of: the rotary table in which the carrier is housed; and the upper thickness sensor and the lower thickness sensor;
classifying the carriers falling within a predetermined range of the thickness into the same class on a basis of the measurement results in the first measuring;
selecting a predetermined number of carriers from the carriers belonging to the same class to determine a carrier set to be used in the same batch in double-side polishing of the semiconductor wafers;
second measuring a thickness of a hole surrounding portion that surrounds the hole of each of the carriers of the carrier set while rotating the rotary table in which the carriers are housed; and
ranking the carrier set on a basis of the measurement results in the first and second measuring according to a specification required for the semiconductor wafers.
6. The carrier management method according to claim 5 , wherein in the ranking, a roll-off amount of the hole surrounding portion of each of the carriers is calculated on a basis of the measurement results in the second measuring and the carrier set is ranked on a basis of the measurement results in the first measuring and the roll-off amounts of the hole surrounding portions.