IP Library Granted Patent US 12,401,334
Granted Patent B2
US 12,401,334 · App. 17/551,369 · Granted Aug 26, 2025

Semiconductor integrated circuit

Inventor: Isao Sakakida (Nisshin, JP)
Assignees: DENSO CORPORATION; MIRISE Technologies Corporation
H03F3/45188H01L23/66H03F1/223H03F3/195H01L2223/6655
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Quick Facts
Patent No.
US 12,401,334
App. No.
17/551,369
Granted
Aug 26, 2025
Kind
B2
Abstract

A semiconductor integrated circuit includes an input terminal, an output terminal, and a multi-stage connection unit including multiple MOS transistors connected in multiple stages between the input terminal and the output terminal. The MOS transistors include an input stage transistor connected to the input terminal and an output stage transistor connected to the output terminal. A thickness of a gate dielectric of the output stage transistor is equal to a thickness of a gate dielectric of the input stage transistor, and a gate length of the output stage transistor is longer than a gate length of the input stage transistor.

Claims (23)

1. A semiconductor integrated circuit comprising:

an input terminal;

an output terminal; and

a multi-stage connection unit configured to receive a high-frequency signal and including a plurality of metal oxide semiconductor transistors connected in a plurality of stages between the input terminal and the output terminal, wherein

the plurality of MOS transistors includes an input stage transistor connected to the input terminal and an output stage transistor connected to the output terminal,

each of the input stage transistor and the output stage transistor has a gate dielectric, and a thickness of the gate dielectric of the output stage transistor is equal to a thickness of the gate dielectric of the input stage transistor,

the output stage transistor has a gate length longer than a gate length of the input stage transistor,

the multi-stage connection unit forms a differential amplifier circuit, and

the multi-stage connection unit includes a pair of the input stage transistors and a pair of capacitances cross-coupled to the pair of the input stage transistors.

2. The semiconductor integrated circuit according to claim 1 , wherein

the multi-stage connection unit is a cascode connection unit in which the input stage transistor is a common-source transistor, and the output stage transistor is a common-gate transistor.

3. The semiconductor integrated circuit according to claim 1 , wherein

the plurality of MOS transistors only includes the input stage transistor and the output stage transistor.

4. The semiconductor integrated circuit according to claim 1 , wherein

a gate length of the MOS transistor in each of the plurality of stages is set based on a relationship with an allowable voltage between a source and a drain.

5. The semiconductor integrated circuit according to claim 4 , wherein

the drain of the output stage transistor is configured to be applied with a voltage exceeding a standard power supply voltage.

6. The semiconductor integrated circuit according to claim 1 , wherein

a total gate width of the output stage transistor is longer than a total gate width of the input stage transistor.

7. The semiconductor integrated circuit according to claim 1 , wherein

a total gate width of the output stage transistor is shorter than a total gate width of the input stage transistor.

8. The semiconductor integrated circuit according to claim 1 , wherein

the semiconductor integrated circuit restricts a breakdown or a deterioration due to a hot carrier injection.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 15, 2021
From: SAKAKIDA, ISAO
To: DENSO CORPORATION; MIRISE TECHNOLOGIES CORPORATION
Reel/Frame 058394/0512 →
Priority Claims (1)
JP 2020-213996 · Dec 23, 2020 · national
Continuity (1)
Related Publication 20220200553A1 · Jun 23, 2022
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