Touch panel
There is provided a touch panel that displays an image in which a plurality of functional buttons are arranged. The plurality of buttons include a long-touch button a function of which can be rendered active after the button is continuously touched for a predetermined time period, and attendant on the long-touch button, a count-down signal notifying a time period remaining before a timing at which the function can be rendered active is displayed.
1. A semiconductor wafer dicing apparatus comprising:
a control unit including a computer, and
a touch panel that displays an image in which a plurality of functional buttons is arranged, and
a cutting unit having a cutting blade for cutting a semiconductor wafer,
wherein at least one functional button of the plurality of functional buttons is associated with processing of a workpiece in the semiconductor wafer dicing apparatus, wherein the workpiece is the semiconductor wafer,
wherein the plurality of functional buttons includes a long-touch button which renders a function active after the button is continuously touched for a predetermined time period, and attendant on the long-touch button, a count-down signal notifying a time period remaining before a timing at which the function can be rendered active is displayed, and
wherein attendant on the long-touch button executes the function comprising a procedure for replacing the cutting blade of the semiconductor wafer dicing apparatus,
wherein the function is rendered active in a case in which the timing has come and a finger is moved away from the long-touch button,
wherein the function is not rendered active in a case in which the finger is moved away from the long-touch button before the timing comes,
wherein the function is not rendered active in a case in which the timing has come, the finger is slid from the long-touch button without being moved away from the touch panel, and the finger is moved away from the touch panel at a position spaced from the long-touch button, and
wherein a length of the time period remaining before the timing comes changes every time the long-touch button is touched.
2. The semiconductor wafer dicing apparatus according to claim 1 , wherein a color of the count-down signal changes every time the long-touch button is touched.
3. The semiconductor wafer dicing apparatus according to claim 1 , wherein the count-down signal is displayed in such a manner as to go around the long-touch button.
4. The semiconductor wafer dicing apparatus according to claim 1 , wherein the count-down signal display region is outlined along an inner perimeter and an outer perimeter of the count-down signal display region when the count-down signal is displayed, and
wherein the inner perimeter of the count-down signal display region is coincident with the perimeter of the long touch button.
5. The semiconductor wafer dicing apparatus according to claim 1 , wherein a process being carried out by the processing apparatus is suspended when the function is rendered active.
6. The semiconductor wafer dicing apparatus according to claim 1 , wherein the long-touch button is circular and the count-down display region is donut shaped around the long-touch button.
7. The semiconductor wafer dicing apparatus according to claim 6 , wherein the count-down signal is gradually elongated in a clockwise manner around the long touch button.
8. The semiconductor wafer dicing apparatus according to claim 1 , wherein the length of the time period before the timing comes increases or decreases randomly every time the long-touch button is touched.