Vertical memory devices
Aspects of the disclosure provide a semiconductor device and method. An example method include forming a stack of layers on a substrate, the stack of layers including a source sacrificial layer, a conductive layer, gate sacrificial layers and insulating layers; forming a staircase into the stack of layers in a staircase region that is adjacent to an array region; forming channel structures in the array region, a channel structure including a channel layer surrounded by one or more insulating layers and extending into the stack of layers; replacing the source sacrificial layer with a source layer in conductive connection with the channel layer, the source layer and the conductive layer forming a common source layer; replacing the gate sacrificial layers with gate layers; and forming a first contact structure in the staircase region, the first contact structure forming a conductive connection with the common source layer.
1. A method for fabricating a semiconductor device, comprising:
forming a stack of layers on a substrate, the stack of layers comprising a source sacrificial layer, a conductive layer, and alternating gate sacrificial layers and insulating layers, wherein the conductive layer is stacked on the source sacrificial layer and directly contacts the source sacrificial layer, and the alternating gate sacrificial layers and insulating layers are stacked on the conductive layer and directly contact the conductive layer;
forming a staircase into the stack of layers in a staircase region that is adjacent to an array region;
forming channel structures in the array region, a channel structure comprising a channel layer surrounded by one or more insulating layers and extending into the stack of layers;
replacing the source sacrificial layer with a source layer in conductive connection with the channel layer, the source layer and the conductive layer forming a common source layer;
replacing the gate sacrificial layers with gate layers; and
forming a first contact structure in the staircase region, the first contact structure forming a conductive connection with the common source layer.
2. The method of claim 1 , wherein forming the stack of layers further comprising:
depositing a metal layer on the source sacrificial layer, as the conductive layer.
3. The method of claim 2 , wherein the metal layer comprises at least one of titanium (Ti), cobalt (Co), nickel (Ni), and platinum (Pt).
4. The method of claim 1 , further comprising:
forming a gate line cut structure with a bottom conductive layer in conductive connection with the common source layer.
5. The method of claim 4 , further comprising:
etching a gate line cut trench into the stack of layers with the conductive layer being an etch stop layer.
6. The method of claim 5 , further comprising:
replacing, through the gate line cut trench, the source sacrificial layer with the source layer;
forming a metal silicide layer at a bottom of the gate line cut trench; and
filling the gate line cut trench with insulating material.
7. The method of claim 1 , wherein forming the first contact structure in the staircase region further comprises:
etching a contact hole for forming the first contact structure, with the conductive layer being an etch stop layer.
8. The method of claim 1 , further comprising:
forming the first contact structure based on a mask comprising a first pattern for the first contact structure and a second pattern for forming a second contact structure to a gate layer.
9. The method of claim 1 , further comprising:
forming a second contact structure at a border of an erase block away from array regions of the erase block.
10. The method of claim 1 , further comprising:
forming metal wires that connect the first contact structure with other contact structures to the common source layer, the metal wires being routed away from the array region.
11. The method of claim 1 , wherein the substrate is a first substrate of a first die with memory cells formed on a face side of the first die, the method further comprises:
bonding a second die with the first die, the second die comprising a driving circuit disposed on a face side of the second die, first bonding structures on the face side of the first die and second bonding structures on the face side of the second die being bonded together, the driving circuit being coupled to the first contact structure via at least a first bonding structure and a second bonding structure.
12. The method of claim 11 , wherein the method further comprises:
reducing a thickness of the first die from a back side of the first die opposite to the face side of the first die; and
forming pad structures on the back side of the first die.
13. The method of claim 12 , wherein the method further comprises:
reducing a thickness of the second die from a back side of the second die opposite to the face side of the second die; and
forming pad structures on the back side of the second die.
14. A method for fabricating a semiconductor device, comprising:
forming a first sacrificial layer and a first conductive layer, wherein the first conductive layer is stacked on the first sacrificial layer and directly contacts the first sacrificial layer;
forming an initial stack of layers over the first conductive layer, the initial stack of layers comprising insulating layers and second sacrificial layers that are stacked alternatingly, wherein the initial stack of layers is stacked on the first conductive layer and directly contacts the first conductive layer;
forming a staircase structure into the initial stack of layers in a staircase region that is adjacent to an array region;
forming a channel structure in the array region, the channel structure comprising a channel layer surrounded by one or more insulating layers and extending through the initial stack of layers, the first conductive layer, and the first sacrificial layer;
replacing the first sacrificial layer with a source layer in connection with the channel layer, the source layer and the first conductive layer forming a common source layer;
replacing the second sacrificial layers with gate layers; and
forming a contact structure extending along a stacked direction of the gate layers and the insulating layers, the contact structure being in connection with the common source layer.
15. The method of claim 14 , wherein the first conductive layer comprises a metal layer.
16. The method of claim 14 , further comprising:
forming a well before forming the first sacrificial layer and the first conductive layer, wherein the first sacrificial layer is disposed on the well.
17. The method of claim 16 , wherein the channel structure extends into the well.
18. The method of claim 16 , wherein the well comprising N-type doped polysilicon or P-type doped polysilicon.
19. The method of claim 14 , further comprising:
forming a step into the first sacrificial layer and the first conductive layer, in the process of forming the staircase structure into the initial stack of layers.
20. The method of claim 14 , wherein:
the gate layers and the insulating layers stack alternatingly to form a stack, the stack being divided into blocks by a gate line cut structure across the array region and the staircase region; and
the contact structure comprises a first contact structure and a second contact structure, the first contact structure disposed in the staircase region and the second contact structure disposed at a border of one block of the blocks.