Systems and methods for supporting a high thermal gradient between a qubit plane and a control system for the qubit plane using a superconducting rigid-flex circuit
Systems and methods for supporting a high thermal gradient between a qubit plane and a control system for the qubit plane are described. A system includes a qubit plane associated with a first rigid circuit portion of a superconducting rigid-flex circuit and a control system associated with a second rigid circuit portion of the superconducting rigid-flex circuit. The superconducting rigid-flex circuit includes a flexible circuit portion for interconnecting the first rigid circuit portion with the second rigid circuit portion. The system further includes a first cooling system operable to maintain an operating temperature for the qubit plane and the first rigid circuit portion of the superconducting rigid-flex circuit at or below 100 milli-kelvin. The system further includes a second cooling system operable to maintain an operating temperature for the control system and the second rigid circuit portion of the superconducting rigid-flex circuit at or below 10 kelvin.
1. A system comprising:
a qubit plane having at least one qubit chip associated with a first rigid circuit portion of a superconducting rigid-flex circuit;
a first cooling system operable to maintain an operating temperature for the qubit plane and the first rigid circuit portion of the superconducting rigid-flex circuit at or below 100 milli-kelvin;
a control system having at least one control chip associated with a second rigid circuit portion of the superconducting rigid-flex circuit;
a second cooling system operable to maintain an operating temperature for the control system and the second rigid circuit portion of the superconducting rigid-flex circuit at or below 10 kelvin, allowing the at least one control chip to dissipate heat to the second cooling system within a thermal budget commensurate with an amount of power required to provide control signals to control qubits within the at least one qubit chip; and
a flexible circuit portion of the superconducting rigid-flex circuit for interconnecting the first rigid circuit portion of the superconducting rigid-flex circuit with the second rigid circuit portion of the superconducting rigid-flex circuit.
2. The system of claim 1 , wherein the first cooling system comprises a dilution refrigerator, a pumped helium-3 system, or a pumped helium-4 system and the second cooling system comprises a cold plate.
3. The system of claim 1 , wherein the superconducting rigid-flex circuit comprises a single printed circuit board.
4. The system of claim 1 , wherein the flexible circuit portion of the superconducting rigid-flex circuit is formed such that at least a subset of a plurality of interconnect layers formed within the flexible circuit portion extend into each of the first rigid circuit portion and the second rigid circuit portion, allowing for an interconnection between the first rigid circuit portion and the second rigid circuit portion.
5. The system of claim 4 , wherein the subset of the plurality of interconnect layers comprises a superconducting metal.
6. The system of claim 1 , wherein the qubits comprise topological qubits that are operated within a magnetic field, and wherein the second rigid circuit portion is mounted on a cold finger surrounded by a magnet.
7. The system of claim 1 , wherein the first cooling system is independent from the second cooling system.
8. A method comprising:
providing a qubit plane having at least one qubit chip associated with a first rigid circuit portion of a superconducting rigid-flex circuit;
using a first cooling system maintaining an operating temperature for the qubit plane and the first rigid circuit portion of the superconducting rigid-flex circuit at or below 100 milli-kelvin;
providing a control system having at least one control chip associated with a second rigid circuit portion of the superconducting rigid-flex circuit;
using a second cooling system maintaining an operating temperature for the control system and the second rigid circuit portion of the superconducting rigid-flex circuit at or below 10 kelvin, allowing the control chips to dissipate heat to the second cooling system within a thermal budget commensurate with an amount of power required to provide control signals to control qubits within the at least one qubit chip; and
providing a flexible circuit portion of the superconducting rigid-flex circuit for interconnecting the first rigid circuit portion of the superconducting rigid-flex circuit with the second rigid circuit portion of the superconducting rigid-flex circuit.
9. The method of claim 8 , wherein the first cooling system comprises a dilution refrigerator, a pumped helium-3 system, or a pumped helium-4 system and the second cooling system comprises a cold plate.
10. The method of claim 8 , wherein the superconducting rigid-flex circuit comprises a single printed circuit board.
11. The method of claim 8 , wherein the flexible circuit portion of the superconducting rigid-flex circuit is formed such that at least a subset of a plurality of interconnect layers formed within the flexible circuit portion extend into each of the first rigid circuit portion and the second rigid circuit portion, allowing for an interconnection between the first rigid circuit portion and the second rigid circuit portion.
12. The method of claim 11 , wherein the subset of the plurality of interconnect layers comprises a superconducting metal.
13. The method of claim 8 , wherein the qubits comprise topological qubits that are operated within a magnetic field, and wherein the second rigid circuit portion is mounted on a cold finger surrounded by a magnet.
14. The method of claim 8 , wherein the first cooling system is independent from the second cooling system.
15. A system configured to operate in a cryogenic environment, wherein the cryogenic environment having a vacuum with a pressure in a range of 10 −3 Torr to 10 −10 Torr, the system comprising:
a qubit plane having qubit chips associated with a first rigid circuit portion of a superconducting rigid-flex circuit;
a first cooling system operable to maintain an operating temperature for the qubit plane and the first rigid circuit portion of the superconducting rigid-flex circuit at or below 100 milli-kelvin;
a control system having control chips associated with a second rigid circuit portion of the superconducting rigid-flex circuit;
a second cooling system operable to maintain an operating temperature for the control system and the second rigid circuit portion of the superconducting rigid-flex circuit at or below 10 kelvin, allowing the control chips to dissipate heat to the second cooling system within a thermal budget commensurate with an amount of power required to provide control signals to control qubits within the qubit chips;
a flexible circuit portion of the superconducting rigid-flex circuit for interconnecting, and yet thermally isolating, the first rigid circuit portion of the superconducting rigid-flex circuit with the second rigid circuit portion of the superconducting rigid-flex circuit; and
a third cooling system operable to maintain an operating temperature of the flexible circuit portion within a range of 100 milli-kelvin to 10 kelvin.
16. The system of claim 15 , wherein the second cooling system comprises a cold plate and each of the first cooling system and the third cooling system comprises a dilution refrigerator, a pumped helium-3 system, or a pumped helium-4 system.
17. The system of claim 15 , wherein the superconducting rigid-flex circuit comprises a single printed circuit board.
18. The system of claim 17 , wherein the flexible circuit portion of the superconducting rigid-flex circuit is formed such that at least a subset of a plurality of interconnect layers formed within the flexible circuit portion extend into each of the first rigid circuit portion and the second rigid circuit portion, allowing for an interconnection between the first rigid circuit portion and the second rigid circuit portion.
19. The system of claim 18 , wherein the subset of the plurality of interconnect layers comprises a superconducting metal.
20. The system of claim 15 , wherein the qubits comprise topological qubits that are operated within a magnetic field, and wherein the second rigid circuit portion is mounted on a cold finger surrounded by a magnet.