IP Library Granted Patent US 12,426,413
Granted Patent B2
US 12,426,413 · App. 18/161,318 · Granted Sep 23, 2025

Circuit and system integration onto a microdevice substrate

Inventors: Gholamreza Chaji (Waterloo, CA); Ehsanollah Fathi (Waterloo, CA); Bahareh Sadeghimakki (Kitchener, CA); Hossein Zamani Siboni (Waterloo, CA)
Assignee: VueReal Inc.
H10H20/852H01L25/0753H10D86/40H10D86/60H10H20/84H10H20/8514H10H20/856H10H20/857H10H20/0361H10H20/0363H10H20/0364
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Quick Facts
Patent No.
US 12,426,413
App. No.
18/161,318
Granted
Sep 23, 2025
Kind
B2
Abstract

An integrated optical display system includes a backplane with appropriate electronics, and an array of micro-devices. A touch sensing structure may be integrated into the system. In one embodiment, an integrated circuit and system is integrated on top of micro-devices transferred to a substrate. Openings in a planarization layer (or layers) may be provided to connect the micro-devices with electrodes and other circuitry. Light reflectors may be used to redirect the light, and color conversion layers or color filters may be integrated before the micro-devices or on the substrate surface opposite to the surface of micro-devices.

Claims (9)

1. An optoelectronic device comprising:

a device substrate;

a plurality of layers on a top surface of the device substrate, the plurality of layers having a top layer and a bottom layer, each layer of the plurality of layers having exposed side surfaces, the plurality of layers including one or more conductive layers and one or more active layers;

one or more extension layers surrounding the exposed side surfaces of at least the one or more active layers of the plurality of layers, the one or more extension layers being oblique to the top surface of the device substrate, at least one of the one or more extension layers contacting the device substrate;

a bonding pad coupled to the bottom layer and/or the top layer and extending over at least one of the one or more extension layers; and

a dielectric layer formed around the bonding pad and extending over a top surface of the one or more extension layers, wherein the dielectric layer is a distinct layer from the one or more extension layers and the dielectric layer does not contact exposed side surfaces of the one or more extension layers.

2. The optoelectronic device of claim 1 , wherein the one or more extension layers comprise at least one of: another dielectric layer, a reflective layer or a color conversion layer.

3. The optoelectronic device of claim 1 , wherein one or more of the one or more extension layers is a polymer.

4. The optoelectronic device of claim 1 , wherein a width of one or more of the one or more extension layers is between 100 nm to two micrometers.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 30, 2023
From: CHAJI, GHOLAMREZA; FATHI, EHSANOLLAH; SADEGHIMAKKI, BAHAREH; SIBONI, HOSSEIN ZAMANI
To: VUEREAL INC.
Reel/Frame 062534/0314 →
Continuity (8)
Division 16542026 · Aug 15, 2019
Continuation In Part 15892523 · Feb 9, 2018
Provisional Application 62808578 · Feb 21, 2019
Provisional Application 62768812 · Nov 16, 2018
Provisional Application 62746300 · Oct 16, 2018
Provisional Application 62482939 · Apr 7, 2017
Provisional Application 62456739 · Feb 9, 2017
Related Publication 20230178528A1 · Jun 8, 2023
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