Pouch molding apparatus and method
A pouch molding apparatus and method involves deforming a pouch so that a larger amount of clearance is secured to increase the capacity of the pouch, thereby improving the pouch molding process to increase the depth and capacity of a pouch cup part. The pouch molding apparatus includes a die and a punch. The die has a die groove recessed therein in a shape configured to mold a pouch. The punch is disposed above the die groove, wherein the punch includes a body part configured to be inserted into the die groove together with a pouch film disposed between the die and the punch, and pressing parts are provided on opposite sides of the body part to press the pouch film toward an inner surface of the die groove.
1. A pouch molding apparatus for manufacturing a secondary battery, by molding a cup part having an accommodation space for accommodating an electrode assembly, comprising:
a die including a die groove recessed therein and in a shape configured to mold a pouch; and
a punch disposed above the die groove,
wherein the punch comprises:
a body part configured to be advanced along a vertical direction so as to be inserted into the die groove together with a pouch film disposed between the die and the punch;
a first pressing part and a second pressing part each disposed on opposite sides of the body part, at least one of the first and second pressing parts configured to move transverse to the vertical direction so as to press the pouch film toward an inner surface of the die groove; and
a heating part moveable laterally with the first and second pressing parts so as to heat the pouch film.
2. The pouch molding apparatus of claim 1 , wherein a bottom surface of the body part and a bottom surface of each of the first and second pressing parts are disposed on one plane.
3. The pouch molding apparatus of claim 1 , wherein each of the first and second pressing parts comprise:
a horizontal portion disposed above the body part; and
a vertical portion extending downward from one side of the horizontal portion and disposed on an outer surface of the body part to press an inner surface of the pouch film.
4. The pouch molding apparatus of claim 3 , wherein a bottom surface of each of the horizontal portions are spaced apart from a top surface of the body part.
5. The pouch molding apparatus of claim 3 , wherein the punch further comprises a linear motion guide disposed between a top surface of the body part and a bottom surface of one of the horizontal portions, the linear motion guide configured to guide movement of one of the first or second pressing parts.
6. The pouch molding apparatus of claim 1 , wherein the heating part is disposed adjacent to one of the first or second pressing parts such that the heating part is configured to apply heat to the pouch film.
7. The pouch molding apparatus of claim 6 , wherein the heating part is disposed on an outer side of one of the first or second pressing parts opposite to the body part.
8. The pouch molding apparatus of claim 1 , further comprising a cylinder disposed above the body part, the cylinder configured to move one of the first or second pressing parts toward the inner surface of the die groove.
9. The pouch molding apparatus of claim 8 , further comprising an elevator connected to an upper portion of the punch, the elevator configured to move the punch toward and/or away from the die groove,
wherein the cylinder is coupled to the elevator.
10. The pouch molding apparatus of claim 8 , wherein the punch further comprises a coupling part configured to couple the cylinder to one of the first or second pressing parts.
11. A pouch molding method comprising:
disposing a pouch film between a die having a die groove and a punch disposed above the die groove;
molding the pouch film by advancing a body part of the punch into the die groove together with the pouch film along a vertical direction; and
moving a plurality of pressing parts disposed on opposite sides of the body part transverse to the vertical direction so as to press the plurality of pressing parts into the pouch film toward an inner surface of the die groove and a heating part laterally with the first and second pressing parts so as to heat the pouch film.
12. The pouch molding method of claim 11 , further comprising applying heat to the pouch film through the heating part while pressing the heating part against the pouch film.
13. The pouch molding method of claim 11 , wherein the plurality of pressing parts press the pouch film toward the inner surface of the die groove for a predetermined time.
14. The pouch molding apparatus of claim 1 , wherein the heating part is disposed on a side of one of the first or second pressing parts opposite to the body part such that the heating part is configured to apply heat directly to the surface of the pouch film.
15. The pouch molding apparatus of claim 1 , wherein the heating part is arranged to make direct contact with the pouch film.
16. The pouch molding method of claim 11 , wherein the heating part is disposed on a side of one of the plurality of pressing parts opposite to the body part such that the heating part is configured to apply heat directly to the surface of the pouch film.