Optics ring modulator including grating pillar

1. A silicon photonics modulator comprising:

a substrate;

a PN junction disposed on the substrate, the PN junction formed by a first L-shaped region doped with a p-type doping abutting a second L-shaped region doped with an n-type doping;

a first plurality of regions doped with the p-type doping arranged adjacent to the first L-shaped region on the substrate, the first plurality of regions each having different doping concentrations which are greater than a doping concentration of the first L-shaped region;

a second plurality of regions doped with the n-type doping arranged adjacent to the second L-shaped region on the substrate, the second plurality of regions each having different doping concentrations which are greater than a doping concentration of the second L-shaped region;

a first electrical contact disposed on one of the first plurality of regions having the highest p-type doping;

a second electrical contact disposed on one of the second plurality of regions having the highest n-type doping; and

multiple grating pillars disposed on at least one of the first plurality of regions or the second plurality of regions, each of the multiple grating pillars doped with the n-type doping or the p-type doping, and each of the multiple grating pillars spaced apart from the first and second L-shaped regions and spaced apart from one another, wherein the multiple grating pillars are configured to decrease electrical resistance between the first electrical contact and the second electrical contact.

2. The silicon photonics modulator of claim 1 , wherein:

each L-shaped region includes a first portion having a first height relative to a surface of the substrate;

each L-shaped region includes a second portion extending perpendicularly from the first portion, the second portion having a second height relative to the surface of the substrate, wherein the second height is greater than the first height;

the first plurality of regions have the first height and are arranged adjacent to the first portion of the first L-shaped region;

the second plurality of regions have the first height and are arranged adjacent to the first portion of the second L-shaped region; and

the first portion of the first L-shaped region and the second L-shaped region, the first plurality of regions, and the second plurality of regions, lie in a plane parallel to the substrate.

3. The silicon photonics modulator of claim 2 , wherein each of the multiple grating pillars extends perpendicularly from a corresponding one of the first plurality of regions or the second plurality of regions.

4. The silicon photonics modulator of claim 2 , wherein each of the multiple grating pillars has the second height.

5. The silicon photonics modulator of claim 1 , wherein:

the multiple grating pillars comprise four grating pillars;

a first one of the four grating pillars has a same doping concentration as the first L-shaped region of the PN junction; and

a second one of the four grating pillars has a different doping concentration than the first one of the four grating pillars.

6. The silicon photonics modulator of claim 1 , wherein:

the silicon photonics modulator comprises an optical ring modulator; and

the first plurality of regions are located on a side of the PN junction facing a center of a circular waveguide of the silicon photonics modulator.

7. The silicon photonics modulator of claim 6 , wherein the multiple grating pillars are disposed only on one or more of the first plurality of regions.

8. The silicon photonics modulator of claim 1 , wherein each of the multiple grating pillars is doped with a same concentration of doping as the corresponding region from which the grating pillar extends.

9. The silicon photonics modulator of claim 1 , wherein at least one of the multiple grating pillars is doped with a different concentration of doping as the corresponding region from which the grating pillar extends.

10. The silicon photonics modulator of claim 1 , wherein:

the first plurality of regions and the first L-shaped region define a total of three different concentrations of p-type doping; and

the second plurality of regions and the second L-shaped region define a total of three different concentrations of n-type doping.

11. The silicon photonics modulator of claim 1 , wherein:

a first one of the multiple grating pillars has a same concentration of doping as the first L-shaped region or the second L-shaped region; and

the first one of the multiple grating pillars is spatially located between the first L-shaped region and other ones of the multiple grating pillars.

12. The silicon photonics modulator of claim 11 , wherein a second one of the multiple grating pillars has a same concentration of doping as one of the first plurality of regions.

13. The silicon photonics modulator of claim 1 , wherein:

the PN junction is a first PN junction; and

at least one of the multiple grating pillars includes both p-doping and n-doping, to define a second PN junction.

14. The silicon photonics modulator of claim 1 , wherein a height of each of the multiple grating pillars is greater than a width of each respective grating pillar.

15. The silicon photonics modulator of claim 14 , wherein each of the multiple grating pillars have a same height and a same width.

16. The silicon photonics modulator of claim 1 , wherein an electrical resistance of each grating pillar among the multiple grating pillars is less than an electrical resistance of each region among the first plurality of regions and among the second plurality of regions which is disposed intermediate a pair of grating pillars among the multiple grating pillars.

17. The silicon photonics modulator of claim 1 , wherein each of the multiple grating pillars extends perpendicularly relative to a surface of the substrate.

18. The silicon photonics modulator of claim 1 , wherein:

the silicon photonics modulator comprises an optical ring modulator; and

the PN junction is a PN junction of a circular waveguide of the optical ring modulator.

19. An optical communication device comprising a cascaded ring transmitter chip having multiple optical ring modulators including the optical ring modulator of claim 18 , wherein:

the cascaded ring transmitter chip is configured to transmit data using wavelength multiplexing;

each of the multiple optical ring modulators is disposed adjacent a bus waveguide and optically coupled with the bus waveguide; and

each of the multiple optical ring modulators is configured to individually modulate an optical signal at a specific wavelength.

20. A method of manufacturing a silicon photonics modulator, the method comprising:

selectively coating a silicon substrate with photoresist according to a specified lithography pattern;

etching the silicon substrate after coating the silicon substrate with photoresist, to define in the silicon substrate a junction structure and multiple grating pillars, each of the multiple grating pillars spaced apart from the junction structure and spaced apart from one another;

doping the multiple grating pillars, a first portion of the junction structure, and a first plurality of regions of the silicon substrate with p-type doping, the first plurality of regions each having different doping concentration which are greater than a doping concentration of the first portion of the junction structure;

doping a second portion of the junction structure, and a second plurality of regions of the silicon substrate with n-type doping, the second plurality of regions each having different doping concentrations which are greater than a doping concentration of the second portion of the junction structure, wherein the first portion and the second portion of the junction structure define a PN junction of a waveguide;

forming a first electrical contact on one of the first plurality of regions having the highest p-type doping; and

forming a second electrical contact on one of the second plurality of regions having the highest n-type doping,

wherein each of the multiple grating pillars is spaced apart from the first portion and the second portion, and wherein the multiple grating pillars are configured to decrease electrical resistance between the first electrical contact and the second electrical contact.

21. The method of claim 20 , wherein the waveguide is circular.

22. The method of claim 20 , wherein:

etching the silicon substrate includes etching portions of the silicon substrate to define the junction structure extending perpendicularly from a top surface of the first plurality of regions, with a top surface of the junction structure at a first height relative to the top surface of the first plurality of regions; and

etching the silicon substrate includes etching portions of the silicon substrate to define the multiple grating pillars extending perpendicularly from the first plurality of regions, with a top surface of each of the multiple grating pillars at the first height relative to the top surface of the first plurality of regions.