In-situ conditioner disk cleaning during CMP
A polishing system includes a platen to hold a polishing pad, a carrier head to hold a substrate against the polishing pad, a conditioner including a conditioner head to hold a conditioner disk against the polishing pad, a motor to move the conditioner head laterally movable relative to the platen, a conditioning disk cleaning station positioned adjacent the platen to clean the conditioning disk, and a controller configured to cause the motor to, during polishing of the substrate, move the conditioner head back and forth between a first position with the conditioner head over the polishing pad and a second position with the conditioner head in the conditioner disk cleaning station.
1 . A polishing system, comprising:
a platen to hold a polishing pad;
a carrier head to hold a substrate against the polishing pad;
a conditioner including a conditioner head to hold a conditioner disk against the polishing pad;
a motor to move the conditioner head laterally movable relative to the platen;
a conditioning disk cleaning station positioned adjacent the platen to clean the conditioner disk; and
a controller configured to cause the motor to
during polishing of the substrate, move the conditioner head back and forth between a first position with the conditioner head over the polishing pad and a second position with the conditioner head in the conditioner disk cleaning station, and
after polishing of the substrate, move the conditioner head to a third position, wherein the third position comprises a cleaning cup configured to contain a cleaning liquid for rinsing or cleaning the conditioner head.
2 . The polishing system of claim 1 , wherein the conditioning disk cleaning station includes a brush positioned to contact the conditioner disk when the conditioner head is in the conditioning disk cleaning station.
3 . The polishing system of claim 2 , wherein the brush is a disk having a planar face to contact the conditioner disk.
4 . The polishing system of claim 2 , wherein the brush is a cylinder having a cylindrical outer face to contact the conditioner disk.
5 . The polishing system of claim 2 , wherein the brush has a sponge-like surface.
6 . The polishing system of claim 2 , wherein the brush has bristles.
7 . The polishing system of claim 2 , wherein a top surface of the brush is coplanar with a polishing surface of the polishing pad.
8 . The polishing system of claim 1 , wherein the conditioning disk cleaning station includes one or more nozzles to direct a fluid onto the conditioner disk when the conditioner head is in the conditioning disk cleaning station.
9 . The polishing system of claim 8 , wherein the fluid comprises water.
10 . The polishing system of claim 8 , wherein the fluid comprises air or nitrogen.
11 . The polishing system of claim 1 , wherein the conditioner comprises an actuator configured to move the conditioner disk vertically.
12 . The polishing system of claim 11 , wherein the controller is configured to cause the actuator to maintain the conditioner disk at a consistent height as the conditioner head moves from the first position to the second position.
13 . The polishing system of claim 1 , wherein the controller is configured to cause the motor to, during polishing of the substrate, move the conditioner head to the second position in less than all sweeps of the conditioner head.
14 . The polishing system of claim 13 , wherein the controller is configured to cause the motor to, during polishing of the substrate, move the conditioner head to the second position periodically.
15 . A method of chemical mechanical polishing, comprising:
bringing a substrate into contact with a polishing pad;
during polishing of the substrate, sweeping a conditioner disk between a first position in contact with the polishing pad and a second position in a conditioning disk cleaning station; and
after polishing of the substrate, moving the conditioner disk to a third position in a cleaning cup.
16 . The method of claim 15 , comprising maintaining the conditioner disk at a consistent height as the conditioner disk moves from the first position to the second position.
17 . The method of claim 15 , comprising, during polishing of the substrate, moving the conditioner disk to the second position with each sweep of the conditioner disk.
18 . The method of claim 15 , comprising, during polishing of the substrate, moving the conditioner disk to the second position in less than all sweeps of the conditioner disk.
19 . The method of claim 15 , comprising scrubbing the conditioner disk with a brush in the conditioning disk cleaning station.
20 . A polishing system, comprising:
a platen to hold a polishing pad;
a carrier head to hold a substrate against the polishing pad;
a conditioner including a conditioner head to hold a conditioner disk against the polishing pad;
a motor to move the conditioner head laterally movable relative to the platen;
a conditioning disk cleaning station positioned adjacent the platen to clean the conditioner disk; and
a controller configured to cause the motor to, during polishing of the substrate, move the conditioner head back and forth between a first position with the conditioner head over the polishing pad and a second position with the conditioner head in the conditioner disk cleaning station with each sweep of the conditioner head.