Sensor driving device including SMA wires
A sensor driving device according to an embodiment includes a fixed part including a first substrate on which a first lead pattern part and a first pad are formed; a moving part spaced apart from the fixed part and including a sensor; and a wire part disposed between the moving part and the fixed part, wherein the wire part includes a first wire part of a shape memory alloy having both ends connected to the first pad and moving the moving part with respect to the fixed part; and a second wire part having one end connected to the first lead pattern part and the other end connected to the moving part to elastically support the moving part.
1 . A sensor driving device comprising:
a fixed part including a first substrate on which a plurality of first pads are provided;
a moving part spaced apart from the fixed part and including a sensor; and
a wire part disposed between the moving part and the fixed part,
wherein the wire part includes:
a first wire part of a shape memory alloy having both ends connected to the plurality of first pads and configured to move the moving part with respect to the fixed part; and
a second wire part having one end connected to the fixed part and an other end connected to the moving part to elastically support the moving part with respect to the fixed part, and
wherein the first wire part is configured to move the moving part in a first axis direction perpendicular to an optical axis direction, move the moving part in a second axis direction perpendicular to the first axis direction and the optical axis direction, and rotate the moving part in the optical axis direction as a rotation axis.
2 . The sensor driving device of claim 1 , wherein the moving part includes a second substrate on which the sensor is disposed, and
wherein the second substrate includes a hinge part to which the first wire part is coupled.
3 . The sensor driving device of claim 2 , wherein the first wire part includes a plurality of wires, and
wherein the hinge part includes a plurality of hinges corresponding to a number of the plurality of wires of the first wire part.
4 . The sensor driving device of claim 2 , wherein the moving part includes a third substrate connected to the second substrate, and
wherein the third substrate includes an opening in which the second substrate is disposed.
5 . The sensor driving device of claim 4 , wherein the first substrate includes a first lead pattern part,
wherein the third substrate includes a second lead pattern part,
wherein one end of the second wire part is connected to the first lead pattern part, and
wherein the other end of the second wire part is connected to one end of the second lead pattern part.
6 . The sensor driving device of claim 5 , wherein the second substrate includes a second pad, and
wherein an other end of the second lead pattern part is connected to the second pad.
7 . The sensor driving device of claim 5 , wherein the second lead pattern part includes:
a body part;
a coupling part coupled to the other end of the second wire part; and
a connecting part connecting the body part and the coupling part.
8 . The sensor driving device of claim 5 , wherein the first lead pattern part includes a plurality of first lead patterns,
wherein the second lead pattern part includes a plurality of second lead patterns,
wherein the second wire part includes a plurality of second wires, and
wherein a number of the plurality of second wires is equal to or less than a number each of the plurality of first lead patterns and the plurality of second lead patterns.
9 . The sensor driving device of claim 6 , wherein the third substrate includes an insulating layer on which the second lead pattern part is disposed, and
wherein one end of the second lead pattern part connected to the second wire part and the other end of the second lead pattern part connected to the second pad do not overlap the insulating layer in the optical axis direction.
10 . The sensor driving device of claim 7 , wherein the connecting part of the second lead pattern part includes a bending region.
11 . The sensor driving device of claim 1 , wherein the plurality of first pads includes:
a plurality of first-first pads disposed on the first substrate in the first axis direction; and
wherein the first wire part includes a first-first wire having both ends connected to the plurality of first-first pads.
12 . The sensor driving device of claim 11 , wherein the first substrate includes an open region, and
wherein the plurality of first-first pads are disposed on a first side of the open region and a second side facing the first side, respectively.
13 . The sensor driving device of claim 12 , wherein the plurality of first pads includes:
a plurality of first-second pads disposed on the first substrate in the second axis direction; and
wherein the first wire part includes a first-second wire having both ends connected to the plurality of first-second pads.
14 . The sensor driving device of claim 13 , wherein the first substrate includes an open region, and
wherein the plurality of first and second pads are respectively disposed on a third side of the open region and a fourth side facing the third side.
15 . The sensor driving device of claim 14 , wherein the plurality of first pads includes a plurality of first-third pads disposed between the plurality of first-first pads and the plurality of first-second pads, and
wherein the first wire part includes a first-third wire having both ends connected to the plurality of first-third pads.
16 . The sensor driving device of claim 15 , comprises:
a driving part for controlling a current applied to the first wire part and configured to move the moving part with respect to the fixed part.
17 . The sensor driving device of claim 16 , wherein the driving part is configured to:
control a current applied to the first-first wire to move the moving part in the second axis direction,
control a current applied to the first-second wire to move the moving part in the first axis direction, and
control a current applied to the first-third wires to rotate the moving part.
18 . A camera module comprising:
an image sensor;
a lens module disposed on the image sensor;
a first actuator configured to drive the lens module; an
a second actuator configured to drive the image sensor;
wherein the first actuator includes:
a fixed part including a first substrate on which a plurality of first pads are provided;
a moving part spaced apart from the fixed part and including a sensor; and
a wire part disposed between the moving part and the fixed part,
wherein the wire part includes:
a first wire part of a shape memory alloy having both ends connected to the plurality of first pads and configured to move the moving part with respect to the fixed part; and
a second wire part having one end connected to the fixed part and the other end connected to the moving part to elastically support the moving part with respect to the fixed part,
wherein the moving part includes a second substrate including a hinge part on which the sensor is disposed and to which the first wire part is coupled, and
wherein the first wire part is configured to move the moving part in a first axis direction perpendicular to an optical axis direction, move the moving part in a second axis direction perpendicular to the first axis direction and the optical axis direction, and rotate the moving part in the optical axis direction as a rotation axis.
19 . The camera module of claim 18 , wherein the first wire part includes:
at least one first-first wire configured to move the moving part in the first axis direction; and
at least one first-second wire configured to move the moving part in the second axis direction.
20 . The camera module of claim 19 , wherein the first wire part further includes:
at least one wire first-third configured to rotate the moving part in the optical axis direction as the rotation axis.