Heat dissipation apparatus and electronic device
Disclosed are a heat dissipation apparatus and an electronic device. The heat dissipation apparatus may include: a cooling component, comprising at least two cooling plates in which a flow channel for containing a working medium is arranged; and a first tube, through which the cooling plates are connected, allowing the flow channels of the cooling plates to be communicated with each other, at least part of the first tube being an extendable corrugated tube.
1 . A heat dissipation apparatus, comprising:
a cooling component, comprising at least two cooling plates in which a flow channel for containing a working medium is arranged; and
a first tube, through which the at least two cooling plates are connected, allowing the flow channel of the at least two cooling plates to be communicated with each other, at least part of the first tube being an extendable corrugated tube;
a second tube; and
a third tube;
wherein, each of the at least two cooling plates is provided with a liquid inlet and a liquid outlet which are communicated with the flow channel, the second tube is arranged at the liquid inlet and the liquid outlet, respectively, and the at least two cooling plates are connected through the first tube and the second tube, and the first tube, the second tube, and the flow channel between the at least two cooling plates that are connected in parallel and adjacent to each other are connected to form a closed fluid loop, and the third tube is used to pump the working medium into the closed fluid loop.
2 . The heat dissipation apparatus of claim 1 , wherein a middle part of the first tube is the extendable corrugated tube, and two ends of the first tube are straight tubes.
3 . The heat dissipation apparatus of claim 1 , wherein corrugations of the extendable corrugated tube are of annular or helical shape.
4 . The heat dissipation apparatus of claim 1 , wherein both the first tube and the second tube are metal tubes.
5 . The heat dissipation apparatus of claim 4 , wherein the first tube and the second tube are connected by welding.
6 . The heat dissipation apparatus of claim 1 , further comprising a heat-conducting layer configured to conduct heat between the at least two cooling plates and a chip.
7 . The heat dissipation apparatus of claim 2 , wherein corrugations of the extendable corrugated tube are of annular or helical shape.
8 . An electronic device, comprising:
at least two chips; and
a heat dissipation apparatus, comprising:
a cooling component, comprising at least two cooling plates in which a flow channel for containing a working medium is arranged; and
a first tube, through which the at least two cooling plates are connected, allowing the flow channel of the at least two cooling plates to be communicated with each other, at least part of the first tube being an extendable corrugated tube;
a second tube; and
a third tube;
wherein, each of the at least two cooling plates is provided with a liquid inlet and a liquid outlet which are communicated with the flow channel, the second tube is arranged at the liquid inlet and the liquid outlet, respectively, and the at least two cooling plates are connected through the first tube and the second tube, and the first tube, the second tube, and the flow channel between the at least two cooling plates that are connected in parallel and adjacent to each other are connected to form a closed fluid loop, and the third tube is used to pump the working medium into the closed fluid loop;
wherein the at least two cooling plates are attached to the at least two chips and configured to dissipate heat of the at least two chips.
9 . The electronic device of claim 8 , wherein a middle part of the first tube is the extendable corrugated tube, and two ends of the first tube are straight tubes.
10 . The electronic device of claim 9 , wherein corrugations of the extendable corrugated tube are of annular or helical shape.
11 . The electronic device of claim 8 , wherein corrugations of the extendable corrugated tube are of annular or helical shape.
12 . The electronic device of claim 8 , wherein both the first tube and the second tube are metal tubes.
13 . The electronic device of claim 12 , wherein the first tube and the second tube are connected by welding.
14 . The electronic device of claim 8 , wherein the heat dissipation apparatus further comprises a heat-conducting layer configured to conduct heat between the at least two cooling plates and the at least two chips.