Foot massage device
A foot massage device includes a housing, a foot receiving pocket coupled to the housing, a massage assembly disposed in the housing, and a thermal application assembly which is assembled to the foot receiving pocket, wherein the thermal application assembly has a top thermal contact surface which is exposed in the foot receiving pocket, wherein the thermal application assembly has a cooling mode for allowing the top thermal contact surface to provide a cooling treatment to the foot of the user.
1 . A foot massage device for a foot of a user, comprising:
a housing having an opening;
a pocket assembly which comprises a foot receiving pocket which is coupled to said opening for placing the foot of the user;
a massage assembly disposed in said housing; and
a thermal application assembly which is assembled to said foot receiving pocket, wherein said thermal application assembly comprises a top thermal contact surface which is exposed in said foot receiving pocket, wherein said thermal application assembly has a cooling mode for allowing said top thermal contact surface to provide a cooling treatment to the foot of the user;
wherein said thermal application assembly is configured to deliver localized cooling to a heel of the foot of the user, wherein said foot receiving pocket is made of a flexible material and has a mounting opening, wherein said thermal application assembly is penetrated through said mounting opening to configure said top thermal contact surface be exposed in said foot receiving pocket.
2 . The foot massage device according to claim 1 , wherein said foot receiving pocket has a foot receiving cavity, said top thermal contact surface of said thermal application assembly is extended into said foot receiving cavity.
3 . The foot massage device according to claim 2 , further comprising a coupling frame which is mounted at said mounting opening of said foot receiving pocket, wherein said thermal application assembly comprises a mounting frame which is detachably coupled with said coupling frame.
4 . The foot massage device according to claim 3 , wherein said coupling frame is made of a thermal insulation material.
5 . The foot massage device according to claim 3 , wherein said coupling frame and said mounting frame are engaged with each other by one or more coupling holes and one or more corresponding retaining protrusions.
6 . The foot massage device according to claim 3 , wherein said thermal application assembly comprises a top heat conduction element, a bottom heat conduction element, and a semiconductor thermoelectric module positioned between said top heat conduction element and said bottom heat conduction element, wherein said top thermal contact surface is a top surface of said top heat conduction element, wherein said coupling frame has a central through hole which allows said top heat conduction element to pass therethrough to extend into said foot receiving pocket.
7 . The foot massage device according to claim 2 , wherein said thermal application assembly comprises a top heat conduction element, a bottom heat conduction element, and a semiconductor thermoelectric module positioned between said top heat conduction element and said bottom heat conduction element, wherein said top thermal contact surface is a top surface of said top heat conduction element.
8 . The foot massage device according to claim 7 , wherein said thermal application assembly further has a fan chamber located under said bottom heat conduction element and comprises a fan unit disposed in said fan chamber.
9 . The foot massage device according to claim 8 , wherein said mounting frame has one or more through holes which are communicated to said fan chamber, wherein said top thermal contact surface is positioned above said one or more through holes, so that the foot of the user which is retained above said top thermal contact surface will not block said through holes.
10 . The foot massage device according to claim 9 , wherein said one or more through holes are distributed around said top heat conduction element along a circumferential direction.
11 . The foot massage device according to claim 9 , wherein said mounting frame comprises an outer frame, an inner frame having a central opening for housing said semiconductor thermoelectric module, and a plurality of ridges extended between said inner frame and said outer frame to define said one or more through holes between said inner frame and said outer frame.
12 . The foot massage device according to claim 9 , wherein said thermal application assembly further comprises a bottom baffle plate which is position under said fan unit and have a plurality of bottom vent holes communicated to said fan chamber.
13 . The foot massage device according to claim 12 , wherein said housing comprises a lower housing body which comprises a plurality of support protrusions provided at a bottom side thereof for supporting said housing on an environment surface and allow said bottom vent holes to be spaced apart from the environment surface, wherein said housing has one or more side vent holes communicated to said fan chamber.
14 . The foot massage device according to claim 7 , wherein said housing has two said openings, said pocket assembly comprises two said foot receiving pockets which are respectively detachably coupled to said two openings, wherein two said thermal application assemblies are respectively detachably assembled on said two foot receiving pockets.
15 . The foot massage device according to claim 7 , further comprising a control assembly which comprises a power source, wherein said power source comprises a motor having an output shaft, said massage assembly comprises a sole massage head, a toe massage head, a first transmission unit, and a second transmission unit, wherein said first transmission units comprises a first gear element coupled to said output shaft, a second gear element coupled to said first gear element, and a driving arm connected to said second gear element for driving rotation movement of the corresponding sole massage head, wherein said second transmission unit comprises a third gear element which is meshed and engaged with said second gear element, said toe massage head is meshed and engaged with said third gear element so as to allow said toe massage head to be driven to rotate by said motor, the corresponding first transmission unit and the corresponding second transmission unit.
16 . The foot massage device according to claim 7 , wherein said thermal application assembly further has a heating mode to deliver localized heating to the heel of the foot of the user.
17 . The foot massage device according to claim 16 , wherein said top heat conduction element is configured to be cooled to −5° C.˜15° C. when said thermal application assembly is in said cooling mode, and is heated to 40° C.˜80° C. when said thermal application assembly is in said heating mode, wherein a time period for reaching a preset temperature is 5 s˜60 s.
18 . A foot massage device for a foot of a user, comprising:
a housing having an opening;
a pocket assembly which comprises a foot receiving pocket which is coupled to said opening for placing the foot of the user;
a massage assembly disposed in said housing;
a thermal application assembly which is assembled to said foot receiving pocket, wherein said thermal application assembly comprises a top thermal contact surface which is exposed in said foot receiving pocket, wherein said thermal application assembly has a cooling mode for allowing said top thermal contact surface to provide a cooling treatment to the foot of the user; and
a power source, wherein said massage assembly comprises one or more massage heads under said foot receiving pocket and one or more transmission units for coupling with said power source for driving the corresponding massage heads, wherein said massage assembly comprises a top massage plane defined by said one or more massage heads, wherein said top massage plane is higher than said top thermal contact surface of said thermal application assembly.