Granted Patent B2

US 12,469,773 · App. 18/059,465 · Granted Nov 11, 2025

Inventors: Chayathorn Saklang (Bangplee, TH); Namrata Kanth (Mesa, AZ); Stephen Ryan Hooper (Queen Creek, AZ); Scott M. Hayes (Chandler, AZ)

Assignee: NXP USA, Inc.

H01L23/49593H01L21/4825H01L21/4842H01L21/565H01L23/3107H01L23/49503H01L23/4952H01L23/49555

Abstract

Claims (22)

1 . A method of manufacturing a semiconductor device, the method comprising:

affixing a semiconductor die to a die pad region of a first battery lead of a leadframe, the first battery lead of the leadframe separated from a second battery lead of the leadframe;

encapsulating with an encapsulant the semiconductor die and portions of the first and second battery leads of the leadframe;

affixing a battery to an exposed portion of the first battery lead of the leadframe, a first terminal of the battery conductively connected to the first battery lead; and

bending an exposed portion of the second battery lead of the leadframe to overlap a top surface portion of the battery, a second terminal of the battery conductively connected to the second battery lead.

2 . The method of claim 1 , wherein the affixed battery is located directly over the encapsulated semiconductor die.

3 . The method of claim 1 , wherein the bent exposed portion of the second battery lead of the leadframe is configured to secure the battery over the encapsulated semiconductor die.

4 . The method of claim 1 , wherein the exposed portion of the first battery lead of the leadframe is exposed through a backside surface of the encapsulated semiconductor die.

5 . The method of claim 1 , further comprising connecting a first bond pad of the semiconductor die to the first battery lead of the leadframe by way of a first bond wire and connecting a second bond pad of the semiconductor die to the second battery lead of the leadframe by way of a second bond wire.

6 . The method of claim 1 , wherein the battery is configured to supply an operating voltage and current to the encapsulated semiconductor die.

7 . The method of claim 1 , further comprising bending the exposed portion of the first battery lead of the leadframe to overlap a top surface portion of the encapsulated semiconductor die before affixing the battery.

8 . The method of claim 7 , wherein the battery is secured between a portion of the first battery lead of the leadframe overlapping the top surface portion of the encapsulated semiconductor die and a portion of the second battery lead of the leadframe overlapping the top surface of the battery.

9 . The method of claim 1 , wherein the first battery lead of the leadframe is configured for connection to a negative terminal of the battery and the second battery lead of the leadframe is configured for connection to a positive terminal of the battery.

10 . A method of manufacturing a semiconductor device, the method comprising:

affixing a semiconductor die to a die pad region of a first battery lead of a leadframe, the first battery lead of the leadframe separated from a second battery lead of the leadframe;

encapsulating with an encapsulant the semiconductor die and portions of the first and second battery leads of the leadframe;

affixing a battery to an exposed portion of the first battery lead of the leadframe, the affixed battery located directly over the encapsulated semiconductor die; and

bending an exposed portion of the second battery lead of the leadframe to overlap a top surface portion of the battery, a portion of the exposed portion of the second battery lead configured to secure the battery over the encapsulated semiconductor die.

11 . The method of claim 10 , wherein the exposed portion of the first battery lead of the leadframe is exposed through a backside surface of the encapsulated semiconductor die.

12 . The method of claim 10 , wherein affixing the battery to the exposed portion of the first battery lead of the leadframe includes forming a conductive connection between the exposed portion of the first battery lead of the leadframe and a negative terminal of the battery.

13 . The method of claim 10 , further comprising connecting a first bond pad of the semiconductor die to the first battery lead of the leadframe by way of a first bond wire and connecting a second bond pad of the semiconductor die to the second battery lead of the leadframe by way of a second bond wire before encapsulating with the encapsulant.

14 . The method of claim 10 , further comprising bending the exposed portion of the first battery lead of the leadframe to overlap a top surface portion of the encapsulated semiconductor die before affixing the battery.

Assignments (1)

Continuity (1)

References Cited (15)