Calibration device for AC/DC systems
View Patent ↗The present disclosure relates to calibration devices for alternating current (AC) and direct current (DC) systems. The calibration device includes a circuit with a first reference (ref 1 ) sensor that has a ref 1 input and a ref 1 output. The circuit has a first device under test (DUT 1 ) sensor with a DUT 1 input and a DUT 1 output. The circuit has a coupler, where the ref 1 output and the DUT 1 output are connected to a first input and a second input of the coupler respectively and the coupler has a coupler output. A ref 1 heating element is adjacent to and electrically isolated from the ref 1 sensor and a DUT 1 heating element is adjacent to and electrically isolated from the DUT 1 sensor. A ref 1 power source is connected to the ref 1 heating element, and a DUT 1 power source is connected to the DUT 1 heating element.
1. A circuit comprising:
a first reference (ref 1 ) sensor with a ref 1 input and a ref 1 output;
a first device under test (DUT 1 ) sensor with a DUT 1 input and a DUT 1 output;
a coupler, wherein the ref 1 output and the DUT 1 output are connected to a first input and a second input of the coupler respectively and the coupler has a coupler output;
a ref 1 heating element adjacent to and electrically isolated from the ref 1 sensor;
a DUT 1 heating element adjacent to and electrically isolated from the DUT 1 sensor;
a ref 1 power source connected to the ref 1 heating element; and
a DUT 1 power source connected to the DUT 1 heating element.
2. The circuit of claim 1 , wherein the ref 1 sensor and the DUT 1 sensor are electrically isolated from the ref 1 power source and DUT 1 power source.
3. The circuit of claim 2 , wherein the ref 1 heating element is thermally coupled to the ref 1 sensor and the DUT 1 heating element is thermally coupled to the ref 1 sensor.
4. The circuit of claim 2 , wherein the ref 1 sensor is configured to detect a change in temperature from the ref 1 heating element and the DUT 1 sensor is configured to detect a change in temperature from the DUT 1 heating element.
5. The circuit of claim 1 , further comprising:
a second reference (ref 2 ) sensor with a ref 2 input and a ref 2 output, wherein the ref 2 output is connected to a third input of the coupler; and
a ref 2 heating element adjacent to the ref 2 sensor.
6. The circuit of claim 5 , wherein the ref 1 sensor, the ref 2 sensor, and the DUT 1 sensor are substantially thermally decoupled from one another.
7. A circuit comprising:
a first reference (ref 1 ) optical ring resonator laterally offset from a ref 1 waveguide bus wherein the ref 1 waveguide bus has a ref 1 input separated from a ref 1 output by the ref 1 optical ring resonator;
a second reference (ref 2 ) optical ring resonator laterally offset from a ref 2 waveguide bus wherein the ref 2 waveguide bus has a ref 2 input separated from a ref 2 output by the ref 2 optical ring resonator;
a ref 1 heating element adjacent to the ref 1 optical ring resonator;
a ref 2 heating element adjacent to the ref 2 optical ring resonator;
a ref 1 power source connected to the ref 1 heating element; and
an analysis circuitry wherein the ref 1 output and the ref 2 output are connected to the analysis circuitry.
8. The circuit of claim 7 , wherein the ref 1 optical ring resonator is optically coupled to the ref 1 waveguide bus and the ref 2 optical ring resonator is optically coupled to the ref 2 waveguide bus.
9. The circuit of claim 7 , further comprising a ref 2 power source connected to the ref 2 heating element.
10. The circuit of claim 7 , further comprising:
a first device under test (DUT 1 ) optical ring resonator laterally offset from a DUT 1 waveguide bus wherein the DUT 1 waveguide bus has a DUT 1 input separated from a DUT 1 output by the DUT 1 optical ring resonator, wherein the DUT 1 output is connected to the analysis circuitry;
a DUT 1 heating element adjacent to the DUT 1 optical ring resonator; and
a DUT 1 power source connected to the DUT 1 heating element.
11. The circuit of claim 10 , further comprising a first directional coupler, wherein the ref 1 output and the ref 2 output are connected to a first input and a second input of the first directional coupler respectively and the first directional coupler has a first coupler output; and
a second directional coupler, wherein the DUT 1 output is connected to a first input of the second directional coupler and the first coupler output is connected to a second input of the second directional coupler and the second directional coupler has a second directional coupler output connected to the analysis circuitry.
12. The circuit of claim 11 , wherein the ref 1 optical ring resonator receives a ref 1 signal, the ref 2 optical ring resonator receives a ref 2 signal, and the DUT 1 optical ring resonator receives a DUT 1 signal;
wherein a frequency of the ref 1 signal is shifted at the second directional coupler output when the ref 1 heating element is powered by the ref 1 power source relative to when the ref 1 power source is off; and
a frequency of the DUT 1 signal is shifted at the second directional coupler output when the DUT 1 heating element is powered by the DUT 1 power source relative to when the DUT 1 power source is off.
13. The circuit of claim 11 , wherein the ref 1 heating element, the ref 2 heating element, and the DUT 1 heating element are substantially a same geometry.
14. The circuit of claim 10 , wherein the ref 1 optical ring resonator is configured to detect a change in temperature from the ref 1 heating element and the DUT 1 optical ring resonator is configured to detect a change in temperature from the DUT 1 heating element.
15. The circuit of claim 10 , wherein the ref 1 power source is a direct current (DC) power source and the DUT 1 power source is an alternating current (AC) power source.
16. The circuit of claim 10 , wherein the ref 1 optical ring resonator, the ref 2 optical ring resonator, and the DUT 1 optical ring resonator are substantially a same geometry.
17. A circuit comprising:
a first reference (ref 1 ) sensor;
a second reference (ref 2 ) sensor;
a first device under test (DUT 1 ) sensor;
a ref 1 resistive element surrounding a portion of the ref 1 sensor;
a ref 2 resistive element surrounding a portion of the ref 2 sensor;
a DUT 1 resistive element surrounding a portion of the DUT 1 sensor;
a ref 1 power source connected to the ref 1 resistive element;
a DUT 1 power source connected to the DUT 1 resistive element; and
an analysis circuitry, wherein the ref 1 sensor, ref 2 sensor, and DUT 1 sensor are connected to the analysis circuitry and wherein the ref 1 sensor, the ref 2 sensor, and the DUT 1 sensor are electrically isolated from the ref 1 power source and the DUT 1 power source.
18. The circuit of claim 17 , wherein the ref 1 sensor is thermally coupled to the ref 1 resistive element and the ref 1 sensor is substantially thermally decoupled from the ref 2 sensor, the DUT 1 sensor, the ref 2 resistive element, and the DUT 1 resistive element.
19. The circuit of claim 17 , wherein the ref 1 sensor, the ref 2 sensor, and the DUT 1 sensor are optical or microwave sensors.
20. The circuit of claim 17 , wherein the ref 1 sensor, the ref 2 sensor, and the DUT 1 sensor are one of a ring resonator, a cavity resonator, a quantum dot, or a light source.