Encapsulating a metal inlay with thermosetting resin and method for making a metal transaction card
A method of making a smartcard may comprise: providing a metal layer (ML) having a module opening (MO) extending from a front surface of the metal layer to a rear surface thereof; providing a sacrificial layer (SL) on the front surface of the metal layer; filling (from behind) the module opening with thermosetting resin (TR); allowing the thermosetting resin to cure (harden); removing the sacrificial layer; and from the front surface of the metal layer, milling a cavity in the cured (hardened) thermosetting resin for receiving a transponder chip module (TCM). A chip module may be implanted in the milled-out cavity, wherein the thermosetting resin provides mechanical support to the chip module and electrical insulation of the chip module from the metal layer. The smartcard may be “dual-interface”.
1 . A method of making a smartcard comprising:
providing a metal layer (ML) having a module opening (MO) extending from a front surface of the metal layer to a rear surface thereof;
providing a sacrificial layer (SL) on the front surface of the metal layer, wherein the sacrificial layer covers at least the module opening; and
from the rear surface of the metal layer, filling the module opening with thermosetting resin (TR);
further comprising:
allowing the thermosetting resin to cure (harden);
removing the sacrificial layer; and
from the front surface of the metal layer, milling a cavity in the cured (hardened) thermosetting resin for receiving a transponder chip module (TCM).
2 . The method of claim 1 , further comprising:
disposing a graphic print layer on the front surface of the metal layer.
3 . The method of claim 2 , further comprising:
applying a transparent coat of rigid ink (hard coat) for scratch protection over the graphic print layer.
4 . The method of claim 3 , further comprising:
disposing a laser-reactive, protective gloss or matte coating over the transparent coat.
5 . The method of claim 4 , further comprising:
providing laser markings on the protective coating.
6 . The method of claim 1 , further comprising:
implanting the transponder chip module in the milled-out cavity.