Acentric non-round electrical interconnections
Structures for an electrical interconnection and methods of forming a structure for an electrical interconnection. The structure comprises a bond pad and an electrical interconnection including a pillar positioned on a portion of the bond pad. The pillar includes a first section and a second section between the first section and the portion of the bond pad. The second section has a cross section with a perimeter having a non-round closed shape, and the second section is positioned acentric relative to the first section.
1 . A structure comprising: a bond pad; and an electrical interconnection including a pillar positioned on a portion of the bond pad, the pillar including a first section and a second section between the first section and the portion of the bond pad, the first section of the pillar having a first geometric center and a first axis extending through the first geometric center, the second section of the pillar having a second geometric center and a second axis, the second axis laterally offset from the first axis, the second section having a cross section in a plane cutting through the second section at a right angle to the second axis, and the cross section surrounded by a first non-circular perimeter.
2 . The structure of claim 1 wherein the first section of the pillar is centered on the bond pad.
3 . The structure of claim 1 wherein the first geometric center overlaps with a portion of the first non-circular perimeter of the second section of the pillar.
4 . The structure of claim 1 wherein the first geometric center has a non-overlapping relationship with the second section of the pillar.
5 . The structure of claim 1 further comprising:
a die having a corner,
wherein the first geometric center is positioned between the second geometric center and the corner of the die.
6 . The structure of claim 5 wherein the first geometric center overlaps with a portion of the first non-circular perimeter of the second section of the pillar.
7 . The structure of claim 5 wherein the first geometric center has a non-overlapping relationship with the second section of the pillar.
8 . The structure of claim 1 further comprising:
a passivation layer having an opening, the passivation layer comprising an organic material that is an electrical insulator,
wherein the second section of the pillar is positioned inside the opening, and the organic material of the passivation layer is positioned between the first section of the pillar and the bond pad.
9 . The structure of claim 8 wherein the organic material is polyimide.
10 . The structure of claim 8 wherein the opening in the passivation layer surrounds the second section of the pillar.
11 . The structure of claim 10 wherein the opening is surrounded by a second non-circular perimeter.
12 . The structure of claim 1 wherein the first non-circular perimeter of the second section of the pillar includes a curve and a line segment with endpoints that are joined to the curve at corners.
13 . The structure of claim 12 wherein the first geometric center overlaps with the line segment.
14 . The structure of claim 12 wherein the line segment is closer to the first geometric center than the curve.
15 . The structure of claim 12 wherein the first geometric center has a non-overlapping relationship with the second section of the pillar.
16 . The structure of claim 1 wherein the first non-circular perimeter of the second section of the pillar includes a plurality of line segments with endpoints that are joined at corners.
17 . The structure of claim 1 wherein the first non-circular perimeter of the second section of the pillar has a crescent shape with a concavity facing toward the first geometric center.
18 . The structure of claim 1 wherein the first non-circular perimeter of the second section of the pillar has an oval shape.
19 . The structure of claim 1 wherein the second section of the pillar includes a combination of a plurality of shapes.
20 . A method comprising: forming an electrical interconnection including a pillar positioned on a portion of a bond pad, wherein the pillar includes a first section and a second section between the first section and the portion of the bond pad, the first section of the pillar having a first geometric center and a first axis extending through the first geometric center, the second section of the pillar having a second geometric center and a second axis, the second axis laterally offset from the first axis, the second section has a cross section in a plane cutting through the second section at a right angle to the second axis, and the cross section surrounded by a non-circular perimeter.