IP Library › Granted Patent US 12,132,159
Granted Patent B2
US 12,132,159 · App. 17/567,671 · Granted Oct 29, 2024

Light emitting diode (LED) package and illuminating device including the same

Inventors: Jongho Lim (Suwon-si, KR); Myoungsu Chae (Hwaseong-si, KR); Yeonjun Sung (Hwaseong-si, KR); Hyongsik Won (Yongin-si, KR); Joonwoo Jeon (Seoul, KR); Soonwon Jeong (Hwaseong-si, KR)
Assignee: SAMSUNG ELECTRONICS CO., LTD.
H01L33/62H05K1/111
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Quick Facts
Patent No.
US 12,132,159
App. No.
17/567,671
Granted
Oct 29, 2024
Kind
B2
Abstract

A light-emitting diode (LED) package includes a package substrate, an LED chip disposed on a first surface of the package substrate, and a first external connection pad and a second external connection pad disposed on a second surface of the package substrate opposite the first surface. The first external connection pad includes a first side, a second side, a third side and a fourth side, the first side being parallel to the second side, and the third side being parallel to the fourth side. The first side is spaced farther from a center of the package substrate than the second side. A length of the first side is shorter than a length of the second side.

Claims (18)

1. A light-emitting diode (LED) package comprising:

a package substrate;

an LED chip disposed on a first surface of the package substrate; and

a first external connection pad and a second external connection pad disposed on a second surface of the package substrate opposite the first surface,

wherein the first external connection pad comprises a first side, a second side, a third side and a fourth side, the first side being parallel to the second side, and the third side being parallel to the fourth side,

wherein the first side is spaced farther from a center of the package substrate than the second side, and

wherein a length of the first side is shorter than a length of the second side.

2. The LED package of claim 1 , wherein each of the length of the first side and the length of the second side is greater than a length of each of the third side and the fourth side.

3. The LED package of claim 1 , wherein the first external connection pad comprises:

a first corner connected to each of the first side and the third side; and

a second corner connected to each of the second side and the third side, and wherein a radius of the first corner is larger than a radius of the second corner.

4. The LED package of claim 3 , wherein the radius of the first corner is in a range of about 2 times to about 10 times the radius of the second corner.

5. The LED package of claim 3 , wherein the radius of the first corner is in a range of about 0.2 times to about 0.5 times a distance between an intersection point where an extension line of the first side and an extension line of the third side intersect and the center of the package substrate.

6. The LED package of claim 1 , further comprising a fifth side connected to each of the first side and the third side, the fifth side being oblique to the first side and the third side.

7. The LED package of claim 6 , wherein each of a distance between an intersection point where an extension line of the first side and an extension line of the third side intersect and a first end of the fifth side and a distance between the intersection point and a second end of the fifth side is in a range of about 0.2 times to about 0.5 times a distance between the center of the package substrate and the intersection point.

8. The LED package of claim 1 , wherein the first external connection pad further comprises a stress relief finger recessed from the first side toward the second side.

9. The LED package of claim 8 , wherein a distance from the center of the package substrate to a starting point of the stress relief finger on the first side is in a range of about 0.5 times to about 0.8 times a distance between an intersection point where an extension line of the first side and an extension line of the third side intersect and the center of the package substrate.

10. The LED package of claim 1 , wherein the first external connection pad is symmetric to the second external connection pad with respect to an axis passing through the center of the package substrate, the axis being parallel to the first side.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 3, 2022
From: LIM, JONGHO; CHAE, MYOUNGSU; SUNG, YEONJUN; WON, HYONGSIK; JEON, JOONWOO; JEONG, SOONWON
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 058530/0947 →
Priority Claims (1)
KR 10-2021-0004924 · Jan 13, 2021 · national
Continuity (1)
Related Publication 20220223774A1 · Jul 14, 2022