Granted Patent B2

US 12,489,205 · App. 18/154,161 · Granted Dec 2, 2025

Inventors: Christian Vockenberger (Leoben, AT); Ahmad Bader Alothman Alterkawi (Graz, AT)

Assignee: AT&S Austria Technologies & Systemetechnik Aktiengesellschaft

H01Q1/526H01Q1/40H01Q9/045

Abstract

Claims (80)

1 . An antenna radiation module for assembling to an antenna inlay for a component carrier or to a component carrier, the antenna radiation module comprising:

a first dielectric layer structure; and

an antenna radiation layer structure;

wherein the antenna radiation layer structure is embedded in the first dielectric layer structure;

wherein the first dielectric layer structure comprises two opposed main surfaces, and the antenna radiation layer structure includes respective elements exposed at the two opposed main surfaces,

wherein the respective elements of the antenna radiation layer structure extend through the whole thickness of the first dielectric layer structure.

2 . The antenna radiation module according to claim 1 ,

wherein the antenna radiation layer structure is at least partially flush with at least one of the two opposed main surfaces.

3 . The antenna radiation module according to claim 1 , further comprising:

a first spacer structure that at least partially delimits a cavity laterally.

4 . An antenna inlay for a component carrier or a component carrier, the antenna inlay or the component carrier comprising:

an antenna radiation module including

a first dielectric layer structure; and

an antenna radiation layer structure;

wherein the antenna radiation layer structure is embedded in the first dielectric layer structure;

wherein the first dielectric layer structure comprises two opposed main surfaces, and the antenna radiation layer structure includes respective elements exposed at the two opposed main surfaces;

wherein the respective elements of the antenna radiation layer structure extend through the whole thickness of the first dielectric layer structure,

an antenna feeding module for assembling to the antenna radiation module, the antenna feeding module comprising:

a second dielectric layer structure;

an antenna feeding layer structure;

wherein the antenna feeding layer structure is assembled to the second dielectric layer structure; and

a fluid-filled cavity between the first dielectric layer structure and the second dielectric layer structure;

wherein the antenna radiation module is assembled to the antenna feeding module, so that the fluid-filled cavity between the antenna radiation module and the antenna feeding module is at least partially closed.

5 . The antenna inlay or the component carrier according to claim 4 , wherein the antenna feeding layer structure is arranged on or embedded in the second dielectric structure.

6 . The antenna inlay or the component carrier according to claim 4 , further comprising:

a spacer structure that at least partially delimits the cavity laterally.

7 . The antenna inlay or the component carrier according to claim 4 , further comprising:

a module layer stack with at least one of an electrically conductive layer structure or at least one electrically insulating layer structure.

8 . The antenna inlay or the component carrier according to claim 4 ,

wherein the fluid-filled cavity is hermetically closed; or

wherein the fluid-filled cavity comprises at least one hole that enables fluid communication.

9 . The antenna inlay or the component carrier according to claim 4 ,

wherein the antenna radiation layer structure and the antenna feeding layer structure are coupled such that electromagnetic waves propagating between the antenna radiation layer structure and the antenna feeding layer structure pass through the fluid-filled cavity.

10 . The antenna inlay or the component carrier according to claim 4 ,

wherein the antenna radiation layer structure and the antenna feeding layer structure are not electrically connected with each other.

11 . The antenna inlay or the component carrier according to claim 4 , further comprising at least one of the following features:

wherein at least one of the first dielectric layer structure or the second dielectric layer structure comprises a Dk value smaller than 4;

wherein at least one of the first dielectric layer structure or the second dielectric layer structure comprises a low dissipation factor, Df, material with a Df value of not more than 0.005;

wherein at least one of the first dielectric layer structure or the second dielectric layer structure comprises a low dissipation factor, Df, material, with a Df value in the range between 0.001 and 0.007;

wherein at least one of the first dielectric layer structure or the second dielectric layer structure comprises a thickness in the range 30 μm to 300 μm.

12 . The antenna inlay or the component carrier according to claim 4 ,

wherein at least one of the antenna radiation layer structure or the antenna feeding layer structure comprises a planar antenna.

13 . The antenna inlay or the component carrier according to claim 4 ,

wherein the second dielectric layer structure comprises an aperture, and

wherein the antenna feeding layer structure is partially exposed through the aperture.

14 . The antenna inlay or the component carrier according to claim 4 ,

wherein the first dielectric layer structure and the second dielectric layer structure are spatially separated by a spacer structure that at least partially delimits the fluid-filled cavity laterally.

15 . A component carrier, comprising:

a layer stack with at least one of at least one electrically conductive layer structure or at least one electrically insulating layer structure;

an antenna radiation module assembled to the layer stack, the antenna radiation module including

a first dielectric layer structure with opposed main surfaces; and

an antenna radiation layer structure with respective elements embedded in the first dielectric layer structure and exposed at the opposed main surfaces; wherein the respective elements of the antenna radiation layer structure extend through the whole thickness of the first dielectric layer structure,

or

an antenna inlay assembled to the layer stack, the antenna inlay comprising:

an antenna radiation module including

a first dielectric layer structure with opposed main surfaces; and

an antenna radiation layer structure with respective elements embedded in the first dielectric layer structure and exposed at the opposed main surfaces wherein the respective elements of the antenna radiation layer structure extend through the whole thickness of the first dielectric layer structure;

an antenna feeding module assembled to the antenna radiation module, the antenna feeding module comprising:

a second dielectric layer structure;

an antenna feeding layer structure;

a fluid-filled cavity between the first dielectric layer structure and the second dielectric layer structure;

wherein the fluid-filled cavity between the antenna radiation module and the antenna feeding module is at least partially closed.

16 . The component carrier according to claim 15 , wherein the component carrier comprises an antenna inlay and an antenna feeding layer structure, further comprising at least one of the following features:

wherein the antenna inlay is embedded in or surface mounted to the layer stack;

further comprising a component electrically coupled to the antenna feeding layer structure;

wherein the component is embedded in or surface mounted to at least one of the antenna radiation module, the antenna feeding module, the antenna inlay, the layer stack;

wherein the component is a high frequency functionality component;

a shielding structure that at least partially electromagnetically shields the layer stack from the antenna inlay.

17 . A method of manufacturing at least one of an antenna radiation module or an antenna feeding module, the method comprising:

providing a temporary carrier;

arranging an electrically conductive layer structure on the temporary carrier;

structuring the electrically conductive layer structure to form an antenna layer structure;

assembling the antenna layer structure at least partially to a dielectric material that forms dielectric layer structure, wherein the dielectric layer structure comprises two opposed main surfaces, and the antenna layer structure includes respective elements exposed at the two opposed main surfaces, wherein the respective elements of the antenna layer structure extend through the whole thickness of the dielectric layer structure; and

removing the temporary carrier.

18 . A method of manufacturing an antenna inlay for a component carrier or a component carrier, the method comprising:

providing an antenna radiation module comprising:

a first dielectric layer structure with two opposed main surfaces; and

an antenna radiation layer structure with respective elements embedded in the first dielectric layer structure;

wherein the respective elements of the antenna radiation layer structure are exposed at the two opposed main surfaces of the first dielectric structure, wherein the respective elements of the antenna radiation layer structure extend through the whole thickness of the first dielectric layer structure; and

assembling the antenna radiation module to an antenna feeding module, such that a fluid-filled cavity between the antenna radiation module and the antenna feeding module is at least partially closed.

Assignments (1)

Priority Claims (1)

Continuity (1)

References Cited (14)