Kirigami enabled method for fabrication of large-format electronic device arrays
View Patent ↗A kirigami enabled manufacturing method and systems are provided. The method includes providing a plurality of substrate units for mounting electronic devices in an initial state; providing at least one connector connecting adjacent substrate units of the plurality of substrate units in the initial state, wherein the at least one connector includes one or more foldable areas defined by a plurality of creases and n stretchable layers stacking on one another; folding the one or more foldable areas of the connector along the plurality of creases by 180°; and flipping and expanding the n stretchable layers of the connector into one layer of a planar predetermined pattern connecting the plurality of substrate units. The enabled manufacturing method and systems expand a small area of thin film material to a large area network by the folding and expanding processes.
1 . A manufacturing method comprising:
providing, in an initial state, a plurality of substrate units for mounting electronic devices;
providing at least one connector connecting adjacent substrate units of the plurality of substrate units in the initial state, wherein the at least one connector comprises one or more foldable areas such that each foldable area has a shape defined by a plurality of creases and n stretchable layers stacking on one another, with n being greater than or equal to 3;
folding the one or more foldable areas of the connector along the plurality of creases by 180°, while the n stretchable layers remain intact; and
flipping and expanding the n stretchable layers of the connector into one layer of a planar predetermined pattern connecting the plurality of substrate units to generate a larger exposed surface area;
wherein each of the one or more foldable areas is connected to other parts of the at least one connector along a folding edge,
wherein each of the one or more foldable areas has a quadrilateral shape defined by the folding edge and three additional edges and has an area smaller than the other parts of the at least one connector,
wherein in an unfolded state two of the three additional edges are edge-contacted with two corresponding edges of the other parts of the at least one connector, respectively, without being fixedly connected to the other parts of the at least one connector, and the remaining additional edge is not in contact with the other parts of the at least one connector, allowing each of the one or more foldable areas to rotate relative to the other parts of the at least one connector along the corresponding folding edge, and
wherein the rotation of the foldable area occurs independently while the other parts of the at least one connector remain stationary.
2 . The manufacturing method of claim 1 , wherein n is an odd integer number greater than or equal to 3.
3 . The manufacturing method of claim 1 , when the at least one connector includes a plurality of connectors, further comprising orthogonally expanding adjacent connectors to form a pattern of k*k matrix of substrate units, wherein k is an integer number greater or equal to 2.
4 . The manufacturing method of claim 3 , wherein when the plurality of substrate units are in the initial state, lengths of the plurality of connectors are same as one another, and the pattern of k*k matrix of substrate units formed after expanding has a shape of a rectangle.
5 . The manufacturing method of claim 3 , wherein when the plurality of substrate units are in the initial state, lengths of the plurality of connectors are not same as one another, and the pattern of k*k matrix of substrate units formed after expanding has a three-dimensional (3D) structure.
6 . The manufacturing method of claim 1 , wherein the plurality of substrate units are made of flexible circuit substrates.