Printed circuit board, backplane architecture system, and communication device
A printed circuit board includes a plurality of layer structures disposed in a stacked manner, and the printed circuit board has a disposing face. A differential pair unit and a shielding structure for shielding the differential pair unit are disposed on the disposing face. The differential pair unit includes two signal via holes, each signal via hole passes through the plurality of layer structures, and an anti-pad corresponding to each signal via hole is disposed on a ground layer through which the signal via hole passes. A part of metal of a ground layer is spaced between two anti-pads. Each signal corresponds to one anti-pad, and a ground layer is spaced between anti-pads.
1 . A printed circuit board, comprising:
a plurality of layer structures disposed in a stacked manner and comprising ground layers and conductor layers that are alternately arranged, wherein an outermost layer structure of the layer structures comprises a disposing face;
a differential pair unit disposed on the disposing face and comprising:
signal via holes, wherein each of the signal via holes passes through at least some of the ground layers and the conductor layers and is connected to a first trace at a first conductor layer of the conductor layers; and
anti-pads respectively corresponding to the signal via holes, disposed on a first ground layer through which the signal via holes pass, and arranged at intervals; and
a shielding structure configured to shield the differential pair unit, disposed on the disposing face, and comprising:
primary ground holes located on sides of the differential pair unit; and
a first secondary ground hole disposed on the disposing face and located between the signal via holes,
wherein the primary ground holes and the first secondary ground hole separately pass through at least some of the conductor layers and the ground layers,
wherein the primary ground holes and the first secondary ground hole are separately grounded to a second ground layer through which the primary ground holes and the first secondary ground hole pass,
wherein the primary ground holes and the first secondary ground hole are arranged in a vertical direction to form a ground hole array, and
wherein the ground hole array and the anti-pads are combined to form a small-sized grid in three-dimensional space in a package region of the printed circuit board.
2 . The printed circuit board of claim 1 , wherein a second trace of the conductor layers on sides of a third ground layer is located outside of second anti-pads of the third ground layer, and wherein each signal via hole passes through the third ground layer.
3 . The printed circuit board of claim 1 , wherein adjacent differential pair units in a plurality of differential pair units share a primary ground hole.
4 . The printed circuit board of claim 3 , wherein a first width of each primary ground hole in a first direction is greater than a second width of the signal via holes in the first direction, and wherein the first direction is parallel to the disposing face and perpendicular to an arrangement direction of the signal via holes.
5 . The printed circuit board of claim 4 , wherein each of the primary ground holes comprises a primary hole and at least one secondary hole that surrounds the primary hole, and wherein the primary hole communicates with each secondary hole and is electrically connected to each secondary hole.
6 . The printed circuit board of claim 4 , wherein each primary ground hole comprises two primary holes and a secondary hole located between the two primary holes, and wherein the secondary hole separately communicates with the two primary holes and is electrically connected to the two primary holes.
7 . The printed circuit board of claim 1 , wherein the primary ground holes and the first secondary ground hole form a C-shaped shielding structure that wraps the differential pair unit.
8 . The printed circuit board of claim 7 , wherein when each of the primary ground holes comprises a primary hole and at least one secondary hole that surrounds the primary hole, a first center point connection line of the primary ground holes overlaps a second center point connection line of the signal via holes.
9 . The printed circuit board of claim 8 , wherein a third center point of the first secondary ground hole is located on one side of the second center point connection line.
10 . The printed circuit board of claim 8 , wherein the shielding structure further comprises two of the first secondary ground hole with center points respectively located on sides of the second center point connection line.
11 . The printed circuit board of claim 7 , wherein the shielding structure further comprises a second secondary ground hole disposed between a first primary ground hole of the primary ground holes and an adjacent signal of the signal via holes.
12 . A communication device, comprising:
a cabinet; and
a printed circuit board inserted into the cabinet and comprising:
a plurality of layer structures disposed in a stacked manner and comprising ground layers and conductor layers that are alternately arranged, wherein an outermost layer structure of the layer structures comprises a disposing face;
a differential pair unit disposed on the disposing face and comprising:
signal via holes, wherein each of the signal via holes passes through at least some of the ground layers and the conductor layers, and is connected to a first trace at a first conductor layer of the conductor layers; and
anti-pads respectively corresponding to the signal via holes, disposed on a first ground layer through which the signal via holes pass, and arranged at intervals; and
a shielding structure configured to shield the differential pair unit, disposed on the disposing face, and comprising:
primary ground holes located on sides of the differential pair unit; and
a first secondary ground hole disposed on the disposing face and located between the signal via holes,
wherein the primary ground holes and the first secondary ground hole separately pass through at least some of the conductor layers and the ground layers,
wherein the primary ground holes and the first secondary ground hole are separately grounded to a second ground layer through which the primary ground holes and the first secondary ground hole pass,
wherein the primary ground holes and the first secondary ground hole are arranged in a vertical direction to form a ground hole array, and
wherein the ground hole array and the anti-pads are combined to form a small-sized grid in three-dimensional space in a package region of the printed circuit board.
13 . The communication device of claim 12 , wherein a second trace of the conductor layers on sides of a third ground layer is located outside of second anti-pads of the third ground layer, and wherein each of the signal via hole pass through the third ground layer.
14 . The communication device of claim 12 , wherein adjacent differential pair units in a plurality of differential pair units share a primary ground hole in the printed circuit board.
15 . The communication device of claim 14 , wherein a first width of each primary ground hole in a first direction is greater than a second width of the signal via holes in the first direction in the printed circuit board, and wherein the first direction is parallel to the disposing face and perpendicular to an arrangement direction of the signal via holes.
16 . The communication device of claim 15 , wherein each of the primary ground holes comprises a primary hole and at least one secondary hole that surrounds the primary hole, and wherein the primary hole communicates with each secondary hole and is electrically connected to each secondary hole.
17 . The communication device of claim 15 , wherein each primary ground hole comprises two primary holes and a secondary hole located between the two primary holes, and wherein the secondary hole separately communicates with the two primary holes and is electrically connected to the two primary holes.
18 . The communication device of claim 12 , wherein the primary ground holes and the first secondary ground hole form a C-shaped shielding structure that wraps the differential pair unit.
19 . The communication device of claim 18 , wherein when each of the primary ground holes comprises a primary hole and at least one secondary hole that surrounds the primary hole, a first center point connection line of the primary ground holes overlaps a second center point connection line of the signal via holes.
20 . The communication device of claim 19 , wherein a third center point of the first secondary ground hole is located on one side of the second center point connection line.