Printed circuit board and manufacturing method thereof
A printed circuit board: a first insulation layer; a first wiring layer embedded in the first insulation layer; a first via layer disposed in a first via of the first insulation layer; a second insulation layer disposed on the first insulation layer; a second wiring layer embedded in the second insulation layer; a second via layer disposed in a second via of the second insulation layer; and a cavity disposed in the first insulation layer and a portion of the second insulation layer. The cavity includes a first portion and a second portion disposed in the first insulation layer and having different widths, the first portion is disposed at a lateral side of the first wiring layer, the second portion is disposed at a lateral side of the first via layer, and a first width of the first portion is greater than a second width of the second portion.
1 . A printed circuit board comprising: a first insulation layer; a first wiring layer embedded in the first insulation layer; a first via layer disposed in a first via in the first insulation layer; a second insulation layer disposed on the first insulation layer; a second wiring layer embedded in the second insulation layer; a second via layer disposed in a second via in the second insulation layer; and a cavity disposed in the first insulation layer and a portion of the second insulation layer, wherein the cavity includes a first portion and a second portion disposed in the first insulation layer and having different widths, the first portion is disposed at a lateral side of the first wiring layer and the second portion is disposed at a lateral side of the first via layer, and a first width of the first portion is greater than a second width of the second portion, and the second portion and the entire first via layer are tapered in a same direction in a cross-sectional view of the printed circuit board.
2 . The printed circuit board of claim 1 , wherein
the cavity further includes a third portion disposed in the portion of the second insulation layer, and
the third portion is disposed at a lateral side of the second wiring layer.
3 . The printed circuit board of claim 2 , wherein
a depth of the third portion is substantially equivalent to a thickness of the second wiring layer.
4 . The printed circuit board of claim 2 , wherein
a third width of the third portion is substantially equivalent to the first width.
5 . The printed circuit board of claim 2 , further comprising
a solder resist layer disposed below the first insulation layer,
wherein the cavity further includes a fourth portion in the solder resist layer, and
a fourth width of the fourth portion is greater than the first width and the second width.
6 . The printed circuit board of claim 1 , wherein
a depth of the first portion is substantially equivalent to a thickness of the first wiring layer, and a depth of the second portion is substantially equivalent to a thickness of the first via layer.
7 . The printed circuit board of claim 1 , wherein
the first wiring layer is connected to the second wiring layer through the first via layer.
8 . The printed circuit board of claim 1 , further comprising
a third insulation layer disposed between the first insulation layer and the second insulation layer,
wherein the cavity further includes a fifth portion and a sixth portion disposed in the third insulation layer and having different widths.
9 . The printed circuit board of claim 8 , further comprising
a third wiring layer embedded in the third insulation layer; and
a third via layer disposed in a third via of the third insulation layer,
wherein the fifth portion is disposed at a lateral side of the third wiring layer and the sixth portion is disposed at a lateral side of the third via layer.
10 . The printed circuit board of claim 8 , further comprising
a plurality of protrusions protruding toward the cavity from the second insulation layer.
11 . The printed circuit board of claim 1 , further comprising a plurality of protrusions protruding toward the cavity from the second insulation layer.
12 . The printed circuit board of claim 1 , wherein
the first portion and the second portion of the cavity have a step.
13 . A printed circuit board comprising: a first insulation layer; a first wiring layer embedded in the first insulation layer; a first via layer disposed in a first via in the first insulation layer; a second insulation layer disposed on the first insulation layer; a second wiring layer embedded in the second insulation layer; a second via layer disposed in a second via of the second insulation layer; and a cavity including a first portion penetrating the first insulation layer and a second portion disposed in the second insulation layer, wherein the second portion of the cavity is disposed at a lateral side of the second wiring layer, and a depth of the second portion of the cavity is substantially equivalent to a thickness of the second wiring layer, the first portion comprises a portion disposed at a lateral side of the first via layer, and the portion of the first portion and the entire first via layer are tapered in a same direction in a cross-sectional view of the printed circuit board.
14 . The printed circuit board of claim 13 , wherein the first portion and the second portion of the cavity have a step.
15 . The printed circuit board of claim 13 , further comprising
a plurality of protrusions protruding toward the cavity from the second insulation layer.
16 . The printed circuit board of claim 1 , wherein
the second portion and the first via layer are tapered in the same direction from a bottom of the cavity to the first portion of the cavity.
17 . A printed circuit board comprising:
a first insulation layer;
a first wiring layer embedded in the first insulation layer;
a first via layer disposed in a first via in the first insulation layer;
a second insulation layer disposed on the first insulation layer;
a second wiring layer embedded in the second insulation layer;
a second via layer disposed in a second via in the second insulation layer;
a solder resist layer disposed below the first insulation layer; and
a cavity disposed in the first insulation layer and a portion of the second insulation layer,
wherein the cavity includes a first portion and a second portion disposed in the first insulation layer and having different widths,
the first portion is disposed at a lateral side of the first wiring layer and the second portion is disposed at a lateral side of the first via layer,
a first width of the first portion is greater than a second width of the second portion,
the cavity further includes another portion in the solder resist layer, and
a width of the another portion of the cavity is greater than the first width and the second width.
18 . The printed circuit board of claim 17 , wherein
the cavity further includes a third portion disposed in the portion of the second insulation layer, and
the third portion is disposed at a lateral side of the second wiring layer.
19 . The printed circuit board of claim 18 , wherein
a depth of the third portion is substantially equivalent to a thickness of the second wiring layer.
20 . The printed circuit board of claim 18 , wherein
a third width of the third portion is substantially equivalent to the first width.
21 . The printed circuit board of claim 17 , wherein
a depth of the first portion is substantially equivalent to a thickness of the first wiring layer, and a depth of the second portion is substantially equivalent to a thickness of the first via layer.
22 . The printed circuit board of claim 17 , wherein
the first wiring layer is connected to the second wiring layer through the first via layer.