Light emitting element and method of manufacturing same
A light emitting element comprises a semiconductor structure which includes an n-side layer, a p-side layer, and an ultraviolet light emitting active layer positioned between the n-side layer and the p-side layer, each being made of a nitride semiconductor, an n-electrode electrically connected to the n-side layer, and a p-electrode electrically connected to the p-side layer. The active layer has a well layer containing Al, a barrier layer containing Al, and holes defined by the lateral faces of the well layer and the lateral faces of the barrier layer. The p-side layer has a first layer containing Al, a second layer containing Al disposed on the first layer and in contact with the lateral faces of the well layer, and a third layer disposed on the second layer. The third layer is smaller in thickness than the first layer.
1 . A light emitting element comprising:
a semiconductor structure comprising an n-side layer, a p-side layer, and an active layer configured to emit ultraviolet light positioned between the n-side layer and the p-side layer, each being made of a nitride semiconductor;
an n-electrode electrically connected to the n-side layer; and
a p-electrode electrically connected to the p-side layer, wherein:
the active layer comprises a well layer containing Al, a barrier layer containing Al, and holes defined by lateral faces of the well layer and lateral faces of the barrier layer,
the p-side layer comprises a first layer containing Al, a second layer containing Al disposed on the first layer and in contact with the lateral faces of the well layer, and a third layer disposed on the second layer,
a thickness of the third layer is less than a thickness of the first layer,
an Al composition ratio of the second layer differs from an Al composition ratio of the well layer by 10% or less,
an Al composition ratio of the third layer is less than an Al composition ratio of the second layer, or the third layer contains no Al, and
the p-electrode is disposed on the third layer.
2 . The light emitting element according to claim 1 , wherein the thickness of the third layer is less than a thickness of the second layer.
3 . The light emitting element according to claim 2 , wherein an Al composition ratio of the first layer is higher than the Al composition ratio of the second layer.
4 . The light emitting element according to claim 2 , wherein the Al composition ratio of the second layer is higher the Al composition ratio of the well layer.
5 . The light emitting element according to claim 2 , wherein the Al composition ratio of the well layer is 10% or higher.
6 . The light emitting element according to claim 2 , wherein the thickness of the second layer is in a range of 3 nm to 20 nm.
7 . The light emitting element according to claim 1 , wherein:
the first layer, the second layer, and the third layer contain a p-type impurity, and
each of a p-type impurity concentration of the second layer and a p-type impurity concentration of the third layer is less than a p-type impurity concentration of the first layer.
8 . The light emitting element according to claim 7 , wherein the p-type impurity concentration of the third layer is higher than the p-type impurity concentration of the second layer.
9 . The light emitting element according to claim 7 , wherein the p-type impurity concentration of the second layer is in a range of 1×10 19 cm 3 to 1×10 21 cm 3 .
10 . The light emitting element according to claim 1 , wherein an Al composition ratio of the first layer is higher than the Al composition ratio of the second layer.
11 . The light emitting element according to claim 1 , wherein the Al composition ratio of the second layer is higher the Al composition ratio of the well layer.
12 . The light emitting element according to claim 1 , wherein the Al composition ratio of the well layer is 10% or higher.
13 . The light emitting element according to claim 1 , wherein a thickness of the second layer is in a range of 3 nm to 20 nm.
14 . The light emitting element according to claim 1 , wherein:
the first layer and the second layer are made of aluminum gallium nitride, and
the third layer is made of gallium nitride.
15 . A method of manufacturing a light emitting element, the method comprising:
forming an n-side layer made of a nitride semiconductor;
forming, on the n-side layer, an active layer configured to emit ultraviolet light and comprising a well layer containing Al and a barrier layer containing Al, each being made of a nitride semiconductor, and holes defined by lateral faces of the well layer and lateral faces of the barrier layer;
forming, on the active layer, a p-side layer comprising a first layer containing Al, a second layer containing Al, and a third layer, each being made of a nitride semiconductor, wherein an Al composition ratio of the second layer differs from an Al composition ratio of the well layer by 10% or less, wherein a thickness of the third layer is less than a thickness of the first layer, wherein an Al composition ratio of the third layer is less than an Al composition ratio of the second layer, or the third layer contains no Al, and wherein the step of forming the p-side layer comprises:
forming the first layer on the active layer,
forming the second layer on the first layer and in contact with the lateral faces of the well layer, and
forming the third layer on the second layer;
forming an n-electrode electrically connected to the n-side layer; and
forming a p-electrode electrically connected to the third layer of the p-side layer.
16 . The method according to claim 15 , wherein a growth rate at which the second layer is formed is lower than a growth rate at which the first layer is formed.
17 . The method according to claim 16 , wherein a growth rate at which the third layer is formed is lower than a growth rate at which the first layer is formed.
18 . The method according to claim 16 , wherein:
in the step of forming a first layer, the first layer is formed to contain a p-type impurity by using a p-type impurity gas, and
in the step of forming a second layer, the second layer is formed to contain a p-type impurity by using a p-type impurity gas,
a p-type impurity gas flow ratio in the step of forming a second layer is higher than a p-type impurity gas flow ratio in the step of forming a first layer.
19 . The method according to claim 16 , wherein:
in the step of forming a first layer, the first layer is formed to contain a p-type impurity by using a p-type impurity gas, and
in the step of forming a third layer, the third layer is formed to contain a p-type impurity by using a p-type impurity gas,
a p-type impurity gas flow ratio in the step of forming a third layer is higher than a p-type impurity gas flow ratio in the step of forming a first layer.
20 . The method according to claim 15 , wherein:
in the step of forming a first layer, the first layer is formed to contain a p-type impurity by using a p-type impurity gas, and
in the step of forming a second layer, the second layer is formed to contain a p-type impurity by using a p-type impurity gas,
a p-type impurity gas flow ratio in the step of forming a second layer is higher than a p-type impurity gas flow ratio in the step of forming a first layer.
21 . The method according to claim 15 , wherein:
in the step of forming a first layer, the first layer is formed to contain a p-type impurity by using a p-type impurity gas, and
in the step of forming a third layer, the third layer is formed to contain a p-type impurity by using a p-type impurity gas,
a p-type impurity gas flow ratio in the step of forming a third layer is higher than a p-type impurity gas flow ratio in the step of forming a first layer.