High bandwidth density optical interfaces for co-packaged devices including photonic integrated circuits
An optical interface includes a cladding layer having a plurality of inner cores and a plurality of turning elements formed therein. Each inner core the plurality of inner cores is associated with a respective turning element of the plurality of turning elements. The optical interface further includes an array of optical elements formed on the cladding layer. Each optical element of the array of optical elements is associated with a respective turning element of the plurality of turning elements.
1 . A system comprising:
an interposer substrate;
a photonic integrated circuit (PIC) substrate associated with a PIC;
an optical fiber array connector associated with an optical fiber array; and
an optical interface between the PIC and the optical fiber array, wherein the optical interface comprises:
a cladding layer, formed on the interposer substrate, having a plurality of inner cores of waveguides and a plurality of turning elements formed therein, wherein each inner core the plurality of inner cores is associated with a respective turning element of the plurality of turning elements; and
an array of optical elements formed between the cladding layer and the optical fiber array connector, wherein each optical element of the array of optical elements is associated with a respective turning element of the plurality of turning elements.
2 . The system of claim 1 , wherein the array of optical elements comprises a microlens array.
3 . The system of claim 1 , wherein the array of optical elements comprises a metalens array.
4 . The system of claim 1 , wherein each turning element of the plurality of turning elements comprises a mirror.
5 . The system of claim 1 , wherein the optical interface further comprises a second cladding layer, formed on the cladding layer, having a plurality of second inner cores formed therein, wherein each second inner core of the plurality of second inner cores is configured to transmit an optical signal to a respective inner core of the plurality of inner cores via evanescent wave coupling.
6 . The system of claim 5 , wherein the second cladding layer is hybrid bonded to the cladding layer.
7 . The system of claim 1 , wherein the optical interface achieves an optical bandwidth density that is greater than or equal to about 10 terabits per second per millimeter (Tb/s/mm).
8 . The system of claim 1 , wherein the cladding layer comprises a micro-trench array, each micro-trench of the micro-trench array containing a turning element of the plurality of turning elements.
9 . A method comprising:
forming an optical interface to be placed between a photonic integrated circuit (PIC) associated with a PIC and an optical fiber array connector associated with an optical fiber array, wherein forming the optical interface comprises:
forming a plurality of inner cores of waveguides within a cladding layer;
forming a plurality of turning elements of the optical interface within the cladding layer, wherein each inner core the plurality of inner cores is associated with a respective turning element of the plurality of turning elements; and
forming an array of optical elements of the optical interface on the cladding layer, wherein each optical element of the array of optical elements is associated with a respective turning element of the plurality of turning elements; and
integrating the optical interface within a system comprising the PIC, the optical fiber array, and an interposer substrate, wherein the cladding layer is formed on the interposer substrate.
10 . The method of claim 9 , further comprising forming, on the cladding layer, a second cladding layer having a plurality of second inner cores formed therein, wherein each second inner core of the plurality of second inner cores is configured to transmit an optical signal to a respective inner core of the plurality of inner cores via evanescent wave coupling.
11 . The method of claim 10 , wherein forming the second cladding layer on the cladding layer comprises hybrid bonding the second cladding layer to the cladding layer.
12 . The method of claim 9 , further comprising:
forming, on the cladding layer, a photonic integrated circuit (PIC) substrate associated with a PIC;
forming, on the cladding layer, an interposer substrate; and
forming, on the array of optical elements, an optical fiber array connector.