Switchable thermal link
An apparatus for transmitting heat from a component side to a radiator side on a spacecraft includes a component side that contains a heater, an electrical component, an optional first conduction link, and a first portion of a switchable thermal link and a radiator side that includes a radiator, an optional second conduction link and a second portion of a switchable thermal link. The first portion of the switchable thermal link and the second portion of the switchable link are in operative thermal communication with the component side and the radiator side respectively. The first portion of the switchable thermal link and the second portion of the switchable thermal link are reversibly attachable and detachable. The switchable thermal link is operative to receive and radiate thermal energy from the component side to the radiator side.
1 . An apparatus comprising:
a component side comprising:
a heater,
an electrical component,
an first conduction link; and
a first portion of a switchable thermal link;
a radiator side comprising:
a radiator,
an second conduction link; and
a second portion of a switchable thermal link,
wherein the first portion of the switchable thermal link and the second portion of the switchable link are in operative thermal communication with the component side and the radiator side respectively; and wherein the first portion of the switchable thermal link and the second portion of the switchable thermal link are reversibly attachable and detachable, and
wherein the switchable thermal link is operative to receive and radiate thermal energy from a component side to a radiator side.
2 . The apparatus according to claim 1 , wherein the first portion of the switchable thermal link comprises one or more interlocking fins, and wherein the second portion of the switchable thermal link comprises one or more interlocking fins that mate with each other, and wherein the mating interlocking fins are separated by a gap.
3 . The apparatus according to claim 2 , wherein the one or more interlocking fins comprises a variable emissivity coating on a surface the one or more interlocking fins.
4 . The apparatus according to claim 2 , wherein the gap is more than 10 micrometers.
5 . The apparatus according to claim 2 , wherein the gap further comprises one or more thermal insulative spacer to keep the fins from touching.
6 . The apparatus of claim 3 , wherein the variable emissivity coating is a nanostructured material.
7 . The apparatus according to claim 4 , wherein the nanostructured material comprises a dielectric or semi-metallic material layer; and a metal-insulator transition material layer respectively interleaved between successive dielectric layers, between successive semi-metallic material layers, or between a dielectric layer and a semi-metallic layer.
8 . The apparatus according to claim 6 , wherein each metal-insulator transition material layer and each dielectric or semi-metallic material layer of each nanostructure has a cross-sectional shape characterized in that a change in an electrical property of at least one of the dielectric material layers, the semi-metallic material layer or the metal-insulator transition material layer occurs upon exposure to a temperature change.
9 . The apparatus according to claim 4 , wherein the nanostructured material exhibits a first emissivity at a first temperature and a second emissivity exceeding the first emissivity at a second temperature exceeding the first temperature.
10 . The apparatus according to claim 5 , wherein a metal-insulator transition material of the metal-insulator transition material layer comprises at least one of vanadium oxide, tungsten oxide, titanium dioxide, molybdenum oxide, and a combination thereof.
11 . The apparatus according to claim 1 , where the operative communication includes emissive communication.
12 . A flight vehicle comprising the apparatus of claim 1 .
13 . A method, wherein the method includes:
transmitting heat from a component side to a radiator side in a space vehicle, the component side comprising:
a heater;
an electrical component;
an first conduction link; and
a first portion of a switchable thermal link;
the radiator side comprising:
a radiator;
an second conduction link; and
a second portion of the switchable thermal link,
wherein the first portion of the switchable thermal link and the second portion of the switchable link are in operative thermal communication with the component side and the radiator side respectively; and wherein the first portion of the switchable thermal link and the second portion of the switchable thermal link are reversibly attachable and detachable, and
receiving thermal energy from a component side;
transmitting the thermal energy to the radiator side; and
irradiating heat from the radiator side into space.
14 . The method of claim 12 , wherein the operative communication includes emissive communication.
15 . The method according to claim 12 , wherein the first portion of the switchable thermal link comprises one or more interlocking fins, and wherein the second portion of the switchable thermal link comprises one or more interlocking fins that mate with each other, and wherein the mating interlocking fins are separated by a gap.
16 . The method according to claim 14 , wherein the one or more interlocking fins comprises a variable emissivity coating on a surface the one or more interlocking fins.
17 . The method according to claim 15 , wherein the variable emissivity coatings is a nanostructured material, and wherein the nanostructured material exhibits a first emissivity at a first temperature and a second emissivity exceeding the first emissivity at a second temperature exceeding the first temperature.
18 . The method according to claim 15 , wherein the nanostructured material comprises a dielectric or semi-metallic material layer; and a metal-insulator transition material layer respectively interleaved between successive dielectric layers, between successive semi-metallic material layers, or between a dielectric layer and a semi-metallic layer.
19 . The method according to claim 16 , wherein each metal-insulator transition material layer and each dielectric or semi-metallic material layer of each nanostructure has a cross-sectional shape characterized in that a change in an electrical property of at least one of the dielectric material layers, the semi-metallic material layer or the metal-insulator transition material layer occurs upon exposure to a temperature change.