IP Library Granted Patent US 12,548,699
Granted Patent B2
US 12,548,699 · App. 18/296,260 · Granted Feb 10, 2026

Thin film resistor

Inventors: Zhong-Yu Chen (Hsinchu County, TW); Cheng-Chung Chiu (Hsinchu County, TW); Shun-Ho Kuo (Hsinchu County, TW); Chi-Yu Lu (Hsinchu County, TW)
Assignee: VIKING TECH CORPORATION
H01C7/006H01C1/012
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Quick Facts
Patent No.
US 12,548,699
App. No.
18/296,260
Granted
Feb 10, 2026
Kind
B2
Abstract

A thin film resistor is provided, and a resistance layer of the thin film resistor is a patternized mesh. The mesh density of the mesh resistance layer increases from center to both ends of the film resistor. The temperature peak is shifted from the center to both ends of the film resistor. Therefore, the heat can be quickly dissipated via the electrodes.

Claims (12)

1 . A thin film resistor, comprising:

two electrodes disposed on both ends of a substrate; and

a resistance layer, disposed on the substrate between the two electrodes and connected to the two electrodes, wherein the resistance layer is formed with a mesh pattern having a mesh density which increases from a center of the film resistor to the electrodes, the mesh pattern has a low-density portion near the center of the film resistor and a high-density mesh portion near both ends of the film resistor,

wherein a second distance between the high-density portion and the electrode, is 50˜75% of a first distance between the low-density portion and the high-density portion,

wherein a first area covered by the high-density portion, is 50˜75% of a second area covered by the low-density portion, and

wherein a wire width of the high-density portion is 50˜75% of a wire width of the low-density portion.

2 . The thin film resistor according to claim 1 , wherein the mesh pattern further includes a middle-density portion between the low-density portion and the high-density portion.

3 . The thin film resistor according to claim 2 , wherein a third distance between the electrode and the high-density portion is 50˜75% of a forth distance between the high-density portion and the middle-density portion.

4 . The thin film resistor according to claim 2 , wherein a third area covered by the middle-density portion, is 50˜75% of the first area covered by the high-density portion.

5 . The thin film resistor according to claim 2 , wherein a wire width of the middle-density portion is 50˜75% of the wire width of the high-density portion.

6 . The thin film resistor according to claim 2 , wherein the low-density portion, the middle-density portion and the high-density portion are rectangular.

7 . The thin film resistor according to claim 1 , wherein the substrate material is aluminum nitride, and the electrode materials is copper.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 27, 2023
From: CHEN, ZHONG-YU; CHIU, CHENG-CHUNG; KUO, SHUN-HO; LU, CHI-YU
To: VIKING TECH CORPORATION
Reel/Frame 064408/0274 →
Priority Claims (1)
TW 111112986 · Apr 6, 2022 · national
Continuity (1)
Related Publication 20230326635A1 · Oct 12, 2023
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