Electroless plating apparatus
An electroless plating apparatus includes: a plating bath; a reserve tank; a retaining means for retaining a plurality of semiconductor wafers upright at regular intervals; a plating liquid circulating path; a circulating pump; a flowmeter and a plating liquid supply pipe having a plurality of spouts formed in an upper part thereof at regular intervals. The regular intervals at which the plurality of semiconductor wafers are retained upright by the retaining means are the same as the regular intervals at which the plurality of spouts are formed in the upper part of the plating liquid supply pipe. The plurality of spouts formed on the upper part of the plating liquid supply pipe may be positioned within the regular intervals between the plurality of semiconductor wafers being retained by the retaining means.
1 . An electroless plating apparatus comprising:
a plating bath in which plating liquid is filled;
a reserve tank for accumulating the plating liquid overflowed from the plating bath;
a retaining means for retaining a plurality of semiconductor wafers upright at regular intervals so that surfaces to be plated of the plurality of semiconductor wafers are not contacted;
a supply path for supplying the plating liquid of the reserve tank to the plating bath;
a circulation pump for supplying the plating liquid of the reserve tank to the plating bath through the supply path;
a flowmeter for measuring velocity of the plating liquid in the supply path; and
a supply pipe of the plating liquid in which a plurality of spouts to erupt the plating liquid from the reserve tank to the plating bath is formed at regular intervals in an upper part;
wherein the regular interval with which the plurality of semiconductor wafers is retained in the retaining means upright and the regular interval with which the plurality of spouts is formed on the upper part of the supply pipe of the plating liquid are mutually made equal,
wherein the plurality of spouts formed on the upper part of the supply pipe of the plating liquid is arranged so that the plurality of spouts is positioned between the regular intervals of the plurality of semiconductor wafers retained in the retaining means when the retaining means is set up at the upper part of the supply pipe of the plating liquid which is set up at a bottom of the plating bath, and
wherein in the supply pipe of the plating liquid, an angle of the plurality of spouts to erupt the plating liquid upward is made adjustable within a predetermined range by making a center axis of the supply pipe of the plating liquid as a pivot shaft.
2 . The electroless plating apparatus according to claim 1 , wherein the retaining means is a wafer carrier in which strength to retain the plurality of semiconductor wafers is secured and an area contacting with the plurality of semiconductor wafers is formed minimum.
3 . The electroless plating apparatus according to claim 1 , wherein the plurality of spouts is formed in conical shape expanded downward.