IP Library Granted Patent US 12,568,698
Granted Patent B2
US 12,568,698 · App. 17/935,336 · Granted Mar 3, 2026

Solid-state image sensor and imaging system

Inventor: Hiroshige Goto (Taito-ku, JP)
Assignee: TOPPAN Inc.
H10F39/184H04N25/60H04N25/62H04N25/771H10F39/8037
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Quick Facts
Patent No.
US 12,568,698
App. No.
17/935,336
Granted
Mar 3, 2026
Kind
B2
Abstract

A solid-state image sensor includes a first semiconductor, and a second semiconductor having a composition different from that of the first composition and electrically connected to the first semiconductor. The first semiconductor includes a photodiode that converts light incident on the photodiode into charge carriers, first carrier storages that store the charge carriers, and a transfer gate that controls transfer the charge carriers to a selected one of the first carrier storages. The second semiconductor includes second carrier storages and a potential detection node. The second carrier storages each store charge carriers based on the charge carriers stored in a corresponding one of the first carrier storages. The potential detection node detects the electric potential of each of the second carrier storages. The solid-state image sensor further includes a reset transistor that resets the electric potential of each of the first carrier storages to a predetermined electric potential.

Claims (23)

1 . A solid-state image sensor, comprising:

a first semiconductor having a first composition and including

a photodiode configured to convert light incident on the photodiode into charge carriers,

a plurality of first carrier storages configured to store the charge carriers, and

a transfer controller configured to control transfer of the charge carriers to a selected one of the first carrier storages, the transfer controller being positioned between the photodiode and the selected one of the first carrier storages;

a second semiconductor having a second composition different from the first composition, the second semiconductor being electrically connected to the first semiconductor, the second semiconductor including

a plurality of second carrier storages corresponding to the respective first carrier storages, which are included in the first semiconductor having the first composition, each of the second carrier storages being configured to store charge carriers based on the charge carriers stored in a corresponding one of the first carrier storages, which is included in the first semiconductor having the first composition, and

a potential detector configured to detect an electric potential of each of the second carrier storages; and

a resetter configured to reset an electric potential of each of the first carrier storages, which is included in the first semiconductor having the first composition, to a predetermined electric potential.

2 . The solid-state image sensor according to claim 1 , wherein the resetter, which is configured to reset the electric potential of each of the first carrier storages, which is included in the first semiconductor having the first composition, to the predetermined electric potential, is mounted to the first semiconductor.

3 . An imaging system, comprising:

a light source unit configured to emit light having a predetermined wavelength profile; and

the solid-state image sensor of claim 2 .

4 . The imaging system according to claim 3 , wherein the light source unit is configured to emit near-infrared light or short-wave infrared light.

5 . The solid-state image sensor according to claim 1 , wherein the photodiode comprises germanium as a main element thereof.

6 . An imaging system, comprising:

a light source unit configured to emit light having a predetermined wavelength profile; and

the solid-state image sensor of claim 5 .

7 . The imaging system according to claim 6 , wherein the light source unit is configured to emit near-infrared light or short-wave infrared light.

8 . An imaging system, comprising:

a light source unit configured to emit light having a predetermined wavelength profile; and

the solid-state image sensor of claim 1 .

9 . The imaging system according to claim 8 , wherein the light source unit is configured to emit near-infrared light or short-wave infrared light.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 27, 2022
From: GOTO, HIROSHIGE
To: TOPPAN INC.
Reel/Frame 061221/0264 →
Priority Claims (1)
JP 2020-054149 · Mar 25, 2020 · national
Continuity (2)
Continuation PCTJP2021009537 · Mar 10, 2021
Related Publication 20230014856A1 · Jan 19, 2023
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