Semiconductor memory device and manufacturing method of semiconductor memory device
There are provided a semiconductor memory device and a manufacturing method of a semiconductor memory device. The semiconductor memory device may include a stack structure including a plurality of conductive layers, a hole formed in the stack structure, a memory layer allowing a first part and a second part of the hole to be spaced apart from each other in the hole, and a first channel layer disposed in the first part of the hole and a second channel layer disposed in the second part of the hole.
1 . A semiconductor memory device comprising:
a stack structure including a plurality of conductive layers, each of the plurality of conductive layers having a surface facing a first direction and the plurality of conductive layers being spaced apart from each other in the first direction;
a hole formed in the stack structure, the hole including a first part and second part that are adjacent to each other in a second direction that is perpendicular to the first direction, wherein the hole has a width that is narrower closer to a connection point between the first part and the second part;
a first channel layer in the first part of the hole;
a second channel layer in the second part of the hole; and
a memory layer interposed between the first channel layer and the second channel layer and extending into a space between the stack structure and each of the first and second channel layers, and
wherein the memory layer separates the first and second channel layers.
2 . The semiconductor memory device of claim 1 , further comprising a first insulating pillar and a second insulating pillar, penetrating the stack structure at both sides of the connection point between the first part and the second part of the hole.
3 . The semiconductor memory device of claim 2 , wherein the hole is concave in a region in contact with the first insulating pillar and the second insulating pillar.
4 . The semiconductor memory device of claim 2 , wherein the memory layer is formed along a sidewall of each of the first insulating pillar and the second insulating pillar to have a concave shape based on a contour of the first insulating pillar and the second insulating pillar.
5 . The semiconductor memory device of claim 2 , wherein, in the first direction, a length of each of the first channel layer and the second channel layer is greater than a length of each of the first insulating pillar and the second insulating pillar.
6 . The semiconductor memory device of claim 1 , wherein the plurality of conductive layers includes a protrusion part protruding toward the connection point.
7 . The semiconductor memory device of claim 6 , wherein the hole is concave in a region in contact with the protrusion part of the plurality of conductive layers.
8 . The semiconductor memory device of claim 6 , wherein the memory layer is formed along the protrusion part of the plurality of conductive layers.
9 . The semiconductor memory device of claim 1 , wherein edges of the first part and the second part of the hole overlap with an edge of a hypothetical circle.
10 . The semiconductor memory device of claim 1 , wherein edges of the first part and the second part of the hole overlap with an edge of a hypothetical ellipse.
11 . The semiconductor memory device of claim 1 , further comprising:
a first bit line connected to the first channel layer;
a second bit line connected to the second channel layer; and
a doped semiconductor structure connected to the first channel layer and the second channel layer.
12 . The semiconductor memory device of claim 1 , further comprising a first core insulating layer and a second core insulating layer,
wherein the first channel layer surrounds the first core insulating layer, and
wherein the second channel layer surrounds the second core insulating layer.
13 . A semiconductor memory device comprising:
a stack structure including a plurality of conductive layers that are spaced apart from each other;
a butterfly-shaped hole formed in the stack structure;
a memory layer extending along a sidewall of the butterfly-shaped hole, the memory layer isolating a first region and a second region in the butterfly-shaped hole;
a first channel layer in the first region; and
a second channel layer in the second region, and
wherein the memory layer separates the first and second channel layers.
14 . The semiconductor memory device of claim 13 ,
wherein the memory layer fills a central region of the butterfly-shaped hole between the first channel layer and the second channel layer and peripheral regions of the butterfly-shaped hole between the stack structure and each of the first channel layer and the second channel layer.
15 . The semiconductor memory device of claim 13 , further comprising an insulating pillar in contact with a concave portion of the butterfly-shaped hole, the insulating pillar penetrating the stack structure.
16 . The semiconductor memory device of claim 15 , wherein, in a stacking direction of the plurality of conductive layers, a length of each of the first channel layer and the second channel layer is greater than a length of the insulating pillar.
17 . The semiconductor memory device of claim 13 , wherein the plurality of conductive layers include a protrusion part protruding toward a concave portion of the butterfly-shaped hole.
18 . The semiconductor memory device of claim 13 , further comprising:
a first bit line connected to the first channel layer;
a second bit line connected to the second channel layer; and
a doped semiconductor structure connected to the first channel layer and the second channel layer.
19 . The semiconductor memory device of claim 13 , further comprising a first core insulating layer and a second core insulating layer,
wherein the first channel layer surrounds the first core insulating layer, and
wherein the second channel layer surrounds the second core insulating layer.