Electronic devices with modified covers
A fabric assembly for an electronic device includes multiple fabric layers joined together at select locations. The fabric layers each include multiple indentations, or de-bosses. The fabric layers can be combined, or bonded, together at one or more respective indentations. As an example, the indentations can be bonded together through a welding operation, including radio frequency welding. When the fabric assembly is integrated with an electronic device, the fabric assembly permits passage of soundwaves therethrough. The indentations can be equally or unequally spaced throughout each fabric layer. When unequally spaced, the fabric assembly can be positioned over a component of an electronic device such that the locations with few or no indentations are positioned at a location corresponding to the component, thus allowing access to the component.
1 . An electronic device, comprising:
a fabric assembly that at least partially covers electronic components, the fabric assembly comprising:
a first fabric layer comprising a first indentation that defines a first surface; and
a second fabric layer comprising a second indentation that defines a second surface that is bonded with the first indentation.
2 . The electronic device of claim 1 , wherein:
the electronic components comprise:
a processor circuit; and
an audio transducer operatively coupled to the processor circuit, the audio transducer comprising a speaker; and
the fabric assembly permits passage of soundwaves generated by the speaker.
3 . The electronic device of claim 2 , wherein:
the first fabric layer comprises a third indentation,
the second fabric layer comprises fourth indentation joined with the third indentation,
the first indentation is bonded with the second indentation at a first bond, and
the third indentation is bonded with the fourth indentation at a second bond.
4 . The electronic device of claim 3 , wherein the fabric assembly i) permits passage of the soundwaves between the first bond and the second bond and ii) limits passage of the soundwaves between at the first bond and at the second bond.
5 . The electronic device of claim 1 , wherein:
the first fabric layer comprises a first circular knit fabric, and
the second fabric layer comprises a second circular knit fabric.
6 . The electronic device of claim 1 , wherein the first fabric layer at least partially covers the second fabric layer.
7 . The electronic device of claim 1 , wherein the first fabric layer and the second fabric layer further define a void configured to permit passage of soundwaves.
8 . The electronic device of claim 1 , wherein the first surface is bonded to the second surface without an adhesive.
9 . The electronic device of claim 1 , further comprising a through hole that extends through the first surface and the second surface.
10 . The electronic device of claim 1 , wherein:
the first indentation comprises a first flange, and
the second indentation comprises a second flange that is bonded to the first flange.
11 . The electronic device of claim 1 , further comprising a display covered by the fabric assembly.
12 . A fabric assembly for an electronic device, the fabric assembly comprising:
a first fabric layer comprising a first indentation; and
a second fabric layer comprising a second indentation, wherein the first fabric layer is secured with the second fabric layer at a bond between the first indentation and the second indentation.
13 . The fabric assembly of claim 12 , wherein:
the first indentation defines a first surface,
the second indentation defines a second surface, and
the bond is located at the first surface and the second surface.
14 . The fabric assembly of claim 12 , wherein:
the first indentation comprises a first flange,
the second indentation comprises a second flange, and
the bond is located at the first flange and the second flange.
15 . The fabric assembly of claim 12 , further comprising a through hole formed through the bond.
16 . The fabric assembly of claim 12 , wherein the bond comprises a weld.
17 . A fabric assembly for an electronic device, the fabric assembly comprising:
a first circular knit fabric that forms an opening for electronic components of the electronic device; and
a second circular knit fabric that is surrounded by, and bonded to, the first circular knit fabric.
18 . The fabric assembly of claim 17 , further comprising:
a first indentation formed in the first circular knit fabric; and
a second indentation formed in the second circular knit fabric, wherein the first indentation is joined to the second indentation.
19 . The fabric assembly of claim 18 , further comprising a third indentation formed in the first circular knit fabric, wherein the third indentation extends to the second circular knit fabric and is longer than the first indentation.
20 . The fabric assembly of claim 17 , wherein the first circular knit fabric combines with the second circular knit fabric to form a cylindrical body.