IP Library › Granted Patent US 12,615,012
Granted Patent B1
US 12,615,012 · App. 19/360,348 · Granted Apr 28, 2026

Linearly corrugated panel system for solar panels and other radiation-based applications

Inventor: Armando Moncada (Honolulu, HI)
H02S40/42H02S40/22H10F77/703
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Quick Facts
Patent No.
US 12,615,012
App. No.
19/360,348
Granted
Apr 28, 2026
Kind
B1
Abstract

A panel structure for increasing efficiency in a panel system may include a panel substrate with a plurality of conductive bridges positioned therein and extending between a top surface of the panel substrate and a bottom surface of the panel substrate; a linearly corrugated layer attached to the top surface of the panel substrate, wherein the linearly corrugated layer includes a pair of top wire channels therein, the top wire channels being aligned with the conductive bridges; a pair of top wires positioned within the top wire channels and operatively engaged with the conductive bridges; and a pair of bottom wires positioned on the bottom surface of the panel substrate, the bottom wires being operatively engaged with the conductive bridges. The system may also include a dielectric paint layer applied between the panel substrate and the linearly corrugated layer.

Claims (11)

1 . A panel structure for increasing efficiency in a panel system, the panel structure comprising:

a panel substrate with a plurality of conductive bridges positioned therein and extending between a top surface of the panel substrate and a bottom surface of the panel substrate, the panel substrate having a corrugated top surface with a corrugation pattern and a planar bottom surface;

a linearly corrugated layer attached to the top surface of the panel substrate, wherein the linearly corrugated layer includes a pair of top wire channels extending entirely therethrough, the top wire channels being aligned with the conductive bridges, such that the top wire channels are parallel with an elongate length of the corrugation pattern;

a pair of top wires positioned within the top wire channels and operatively engaged with the conductive bridges; and

a pair of bottom wires positioned on the bottom surface of the panel substrate, the bottom wires being operatively engaged with the conductive bridges.

2 . The panel structure of claim 1 , wherein the linearly corrugated layer is a silicon layer.

3 . The panel structure of claim 2 , wherein silicon layer is monocrystalline.

4 . The panel structure of claim 1 , further comprising a dielectric paint applied between the panel substrate and the linearly corrugated layer.

5 . The panel structure of claim 1 , wherein the pair of top wires and the pair of bottom wires each extend beyond outer edges of the panel substrate and are substantially parallel to a linear corrugation pattern on the linearly corrugated layer.

6 . The panel structure of claim 1 , wherein the linearly corrugated layer comprises 45 degree angles.

7 . The panel structure of claim 1 , wherein the linearly corrugated layer comprises angles that provide for at least a double bounce of light.

Continuity (1)
Provisional Application 63837320 · Jul 2, 2025
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