IP Library Granted Patent US 12,617,039
Granted Patent B2
US 12,617,039 · App. 18/144,636 · Granted May 5, 2026

Scan field and work plane evaluation and orientation for high-speed laser motion systems

Inventors: Jacob C. Hay (Columbus, OH); Ajay Krishnan (Columbus, OH); Ron Aman (Columbus, OH); Stanley L. Ream (Columbus, OH)
B23K26/082B23K26/032
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,617,039
App. No.
18/144,636
Granted
May 5, 2026
Kind
B2
Abstract

System and methods for evaluating build platform flatness and parallelism relative to a focal plane of a high-speed laser in high-speed laser motion systems, wherein the high-speed laser motion systems include the high-speed laser that generates a laser beam, and the build platform having a work plane, comprising positioning a plurality of pin-hole sensors within the focal plane of the high-speed laser, wherein each of the pin-hole sensors is positioned at a predetermined location; directing the laser beam to the predetermined locations of each pin-hole sensor; measuring a spot size of the laser beam at each pin-hole sensor, wherein the spot size at each pin-hole defining structure has a measureable diameter; comparing the measurable diameters obtained at each pin-hole sensor; and adjusting the work plane of the build platform to a position where the measurable diameters of the spot sizes are equal at each pin-hole sensor.

Claims (25)

1 . A method for evaluating build platform flatness and parallelism relative to a focal plane of a high-speed laser in high-speed laser motion systems, wherein the high-speed laser motion systems include the high-speed laser that generates a laser beam, and the build platform having a work plane, comprising:

(a) positioning a plurality of pin-hole sensors within the focal plane of the high-speed laser, wherein each of the pin-hole sensors is positioned at a predetermined location;

(b) directing the laser beam to the predetermined locations of each pin-hole sensor;

(c) measuring a spot size of the laser beam at each pin-hole sensor, wherein the spot size at each pin-hole defining structure has a measurable diameter;

(d) comparing the measurable diameters obtained at each pin-hole sensor; and

(e) adjusting the work plane of the build platform to a position where the measurable diameters of the spot sizes are equal at each pin-hole sensor.

2 . The method of claim 1 , wherein the focal plane of the high-speed laser is ideally parallel to the work plane of the build platform.

3 . The method of claim 1 , further comprising repeatedly redirecting the laser beam to the predetermined locations of each pin-hole sensor, re-measuring the spot size of the laser beam at each pin-hole sensor, and re-adjusting the work plane of the build platform.

4 . The method of claim 1 , further comprising providing feedback to an operator indicating the adjustments necessary for making the work plane of the build platform parallel with the focal plane of the high-speed laser.

5 . The method of claim 1 , further comprising analyzing working parameters of the high-speed laser motion systems, by:

(a) measuring the spot size of the laser beam at each pin-hole sensor;

(b) comparing the measured spot sizes obtained at each pin-hole sensor;

(c) calculating changes in the working parameters due to non-uniformity between the measured spot sizes; and

(d) recording the location and profile of the work plane for use during processing.

6 . The method of claim 5 , further comprising providing feedback to an operator indicating the adjustments necessary for making the work plane of the build platform parallel with the focal plane of the high-speed laser.

7 . The method of claim 5 , wherein the high-speed laser motion systems are two-dimensional.

8 . The method of claim 1 , further comprising analyzing orientation of the high-speed laser motion systems, by:

(a) measuring the spot size of the laser beam at each pin-hole sensor;

(b) comparing the measured spot sizes obtained at each pin-hole sensor;

(c) calculating necessary movement of the high-speed laser in the z-axis due to non-uniformity between the measured spot sizes;

(d) recording the location and profile of the work plane for use during processing;

(e) running a measurement cycle with z-axis compensation; and

(f) verifying uniformity in the measured spot sizes between each pin-hole sensor.

9 . The method of claim 8 , further comprising providing feedback to an operator indicating the adjustments necessary for making the work plane of the build platform parallel with the focal plane of the high-speed laser.

10 . The method of claim 8 , wherein the high-speed laser motion systems are three-dimensional.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 30, 2024
From: HAY, JACOB C.; KRISHNAN, AJAY; AMAN, RON; REAM, STANLEY L.
To: EDISON WELDING INSTITUTE, INC.
Reel/Frame 066299/0648 →
Continuity (2)
Provisional Application 63339850 · May 9, 2022
Related Publication 20230356325A1 · Nov 9, 2023
References Cited (13)
US 10336007B2 · Boyer · 2019 [cited by examiner]
US 20020125231A1 · Hunter · 2002 [cited by examiner]
US 20030052105A1 · Nagano · 2003 [cited by examiner]
US 20130075377A1 · Cheng · 2013 [cited by examiner]
US 20170304947A1 · Shibazaki · 2017 [cited by applicant]
US 20190301970A1 · Ream et al. · 2019 [cited by applicant]
US 20200338669A1 · Shi · 2020 [cited by examiner]
US 20210187861A1 · Zeulner et al. · 2021 [cited by applicant]
US 20220055146A1 · Gabilondo · 2022 [cited by examiner]
US 20220168813A1 · Dardis · 2022 [cited by examiner]
CN 112829295A · 2021 [cited by examiner]
ES 2948448T3 · 2023 [cited by examiner]
International Search Report and Written Opinion of the International Searching Authority for International Patent App. No. PCT/US2023/021486 dated as mailed on Jul. 18, 2023 (8 pages). [cited by applicant]