IP Library Granted Patent US 12,633,486
Granted Patent B2
US 12,633,486 · App. 18/341,851 · Granted May 19, 2026

Device including a fuse

Inventor: Jonathan Quenzer (German Valley, IL)
Assignee: Milwaukee Electric Tool Corporation
H01H85/0411H01M50/583H02J7/0044H01H2085/0412
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Quick Facts
Patent No.
US 12,633,486
App. No.
18/341,851
Granted
May 19, 2026
Kind
B2
Abstract

A device including a conductive path for passing electric current. The device including a terminal and a spring fuse. The spring fuse is connected in the conductive path and is electrically connected to the terminal. The spring fuse includes a fixed base, an extension spring connected to the fixed base at a first end, a power path connection connected to the extension spring at a second end, a plurality of fuse pads, and one or more solder joints configured to connect the power path connection to the plurality of fuse pads. The one or more solder joints are configured to melt when a temperature of the one or more solder joints exceeds a threshold value. The power path connection is configured to retract toward the fixed base when the temperature of the one or more solder joints exceeds a threshold value.

Claims (41)

1 . A device including a conductive path for passing electric current, the device comprising:

a terminal;

a controller;

a sensor configured to sense a temperature and communicate the sensed temperature to the controller; and

a fuse connected in the conductive path and electrically connected to the terminal, the fuse including:

a fixed base,

a member connected to the fixed base at a first end,

a power path connection connected to the member at a second end,

a plurality of fuse pads, and

one or more bonding joints configured to connect the power path connection to the plurality of fuse pads;

wherein the one or more bonding joints are configured to deteriorate when a temperature of the one or more bonding joints exceeds a threshold value,

wherein the power path connection is configured to move toward the fixed base when the temperature of the one or more bonding joints exceeds a threshold value, and

wherein the power path connection is configured to move away from the plurality of fuse pads when the temperature of the one or more bonding joints exceeds the threshold value, such that the power path connection is spaced away from the plurality of fuse pads.

2 . The device of claim 1 , wherein the fuse is located within a battery pack.

3 . The device of claim 1 , wherein the fuse is located within a battery pack charger.

4 . The device of claim 1 , wherein the fuse is located within a power tool.

5 . The device of claim 1 , further comprising:

a heating element configured to be activated by the controller to thereby increase the temperature of the one or more bonding joints.

6 . The device of claim 1 , further comprising:

a cover configured to enclose the fuse and prevent a circuit board coating from interfering with retraction of the power path connection.

7 . A device including a conductive path for passing electric current, the device comprising:

a terminal; and

a spring fuse connected in the conductive path and electrically connected to the terminal, the spring fuse including:

a fixed base,

an extension spring connected to the fixed base at a first end,

a power path connection connected to the extension spring at a second end,

a first conductive pad positioned perpendicular to the power path connection,

a second conductive pad positioned parallel to the first conductive pad,

a first solder joint connected to the first conductive pad,

a second solder joint connected to the second conductive pad;

wherein the first solder joint or the second solder joint are configured to melt when a respective temperature of the first solder joint or the second solder joint exceeds a threshold value, and

wherein the power path connection is configured to retract toward the fixed base and away from both the first conductive pad and the second conductive pad when the first solder joint and the second solder joint melt, such that the power path connection is spaced from both the first conductive pad and the second conductive pad.

8 . The device of claim 7 , wherein the device is located within a battery pack.

9 . The device of claim 7 , wherein the device is located within a battery pack charger.

10 . The device of claim 7 , wherein the device is located within a power tool.

11 . The device of claim 7 , further comprising:

a cover configured to enclose the spring fuse and prevent a circuit board coating from interfering with the retraction of the power path connection.

12 . The device of claim 7 , further comprising:

a controller; and

a sensing element configured to sense a temperature of the device and communicate with the controller.

13 . The device of claim 12 , further comprising a heating element configured to be activated by the controller to thereby increase the temperature of one or more of the first solder joint and the second solder joint.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 14, 2023
From: QUENZER, JONATHAN
To: MILWAUKEE ELECTRIC TOOL CORPORATION
Reel/Frame 064265/0244 →
Continuity (2)
Provisional Application 63367101 · Jun 27, 2022
Related Publication 20230420207A1 · Dec 28, 2023
References Cited (400)
US 3919573A · Schmuck · 1975 [cited by applicant]
US 4278744A · Athearn · 1981 [cited by applicant]
US 4659636A · Suzuki et al. · 1987 [cited by applicant]
US 4914393A · Yoshido · 1990 [cited by applicant]
US 4965738A · Bauer et al. · 1990 [cited by applicant]
US 4997732A · Austin et al. · 1991 [cited by applicant]
US 5084691A · Lester · 1992 [cited by examiner]
US 5166596A · Goedken · 1992 [cited by applicant]
US 5215834A · Reher et al. · 1993 [cited by applicant]
US 5351283A · Kunitomo · 1994 [cited by applicant]
US 5391974A · Shiojima et al. · 1995 [cited by applicant]
US 5430363A · Kim · 1995 [cited by applicant]
US 5456994A · Mita · 1995 [cited by applicant]
US 5466545A · Chamberlain et al. · 1995 [cited by applicant]
US 5477126A · Shiojima · 1995 [cited by applicant]
US 5477127A · Shiojima et al. · 1995 [cited by applicant]
US 5480734A · Schulz et al. · 1996 [cited by applicant]
US 5483145A · Shiojima et al. · 1996 [cited by applicant]
US 5497068A · Shiojima · 1996 [cited by applicant]
US 5548201A · Grabon · 1996 [cited by applicant]
US 5585710A · Nakamura et al. · 1996 [cited by applicant]
US 5621302A · Shinohara · 1997 [cited by applicant]
US 5637418A · Brown et al. · 1997 [cited by applicant]
US 5637982A · Nanno et al. · 1997 [cited by applicant]
US 5643693A · Hill et al. · 1997 [cited by applicant]
US 5652500A · Kadouchi et al. · 1997 [cited by applicant]
US 5708350A · Tibbs · 1998 [cited by applicant]
US 5711605A · Reher et al. · 1998 [cited by applicant]
US 5717313A · Grabon · 1998 [cited by applicant]
US 5731686A · Malhi · 1998 [cited by applicant]
US 5767659A · Farley · 1998 [cited by applicant]
US 5783998A · Nakajou et al. · 1998 [cited by applicant]
US 5795664A · Kelly · 1998 [cited by applicant]
US 5798667A · Herbert · 1998 [cited by applicant]
US 5804944A · Alberkrack et al. · 1998 [cited by applicant]
US 5826958A · Avitan · 1998 [cited by applicant]
US 5867008A · Du et al. · 1999 [cited by applicant]
US 5870267A · Kitano · 1999 [cited by applicant]
US 5874825A · Brotto · 1999 [cited by applicant]
US 5900717A · Lee · 1999 [cited by applicant]
US 5903423A · Okano et al. · 1999 [cited by applicant]
US 5909103A · Williams · 1999 [cited by applicant]
US 5912547A · Grabon · 1999 [cited by applicant]
US 5920181A · Alberkrack et al. · 1999 [cited by applicant]
US 5939865A · Mcgrath et al. · 1999 [cited by applicant]
US 5963019A · Cheon · 1999 [cited by applicant]
US 6018227A · Kumar et al. · 2000 [cited by applicant]
US 6020721A · Brotto · 2000 [cited by applicant]
US 6029119A · Atkinson · 2000 [cited by applicant]
US 6046575A · Demuro · 2000 [cited by examiner]
US 6048638A · Pendalwar · 2000 [cited by applicant]
US 6075341A · White et al. · 2000 [cited by applicant]
US 6075346A · Kikuchi et al. · 2000 [cited by applicant]
US 6087036A · Rouillard et al. · 2000 [cited by applicant]
US 6152597A · Potega · 2000 [cited by applicant]
US 6157166A · Odaohhara et al. · 2000 [cited by applicant]
US 6160376A · Kumar et al. · 2000 [cited by applicant]
US 6175211B1 · Brotto · 2001 [cited by applicant]
US 6181032B1 · Marshall et al. · 2001 [cited by applicant]
US 6215274B1 · Dotzler · 2001 [cited by applicant]
US 6225778B1 · Hayama et al. · 2001 [cited by applicant]
US 6232749B1 · Hewes et al. · 2001 [cited by applicant]
US 6251537B1 · Kim et al. · 2001 [cited by applicant]
US 6307349B1 · Koenck et al. · 2001 [cited by applicant]
US 6309099B1 · Chang · 2001 [cited by applicant]
US 6316140B1 · Hatazawa et al. · 2001 [cited by applicant]
US 6331761B1 · Kumar et al. · 2001 [cited by applicant]
US 6336080B1 · Atkinson · 2002 [cited by applicant]
US 6340880B1 · Higashijima et al. · 2002 [cited by applicant]
US 6377432B1 · Hashimoto · 2002 [cited by applicant]
US 6387566B1 · Chang et al. · 2002 [cited by applicant]
US 6404610B1 · Chang · 2002 [cited by applicant]
US 6455186B1 · Moores, Jr. et al. · 2002 [cited by applicant]
US 6459175B1 · Potega · 2002 [cited by applicant]
US 6492791B1 · Saeki et al. · 2002 [cited by applicant]
US 6540685B1 · Rhoads et al. · 2003 [cited by applicant]
US 6542846B1 · Miller et al. · 2003 [cited by applicant]
US 6569561B1 · Kimura et al. · 2003 [cited by applicant]
US 6632538B1 · Yamazaki et al. · 2003 [cited by applicant]
US 6634896B1 · Potega · 2003 [cited by applicant]
US 6645666B1 · Moores et al. · 2003 [cited by applicant]
US 6653018B2 · Takahashi et al. · 2003 [cited by applicant]
US 6661231B1 · Arai et al. · 2003 [cited by applicant]
US 6700766B2 · Sato · 2004 [cited by applicant]
US 6773848B1 · Nortoft et al. · 2004 [cited by applicant]
US 6790557B2 · Xing et al. · 2004 [cited by applicant]
US 6797430B1 · Hatta et al. · 2004 [cited by applicant]
US 6841298B2 · Yamashita et al. · 2005 [cited by applicant]
US 6866527B2 · Potega · 2005 [cited by applicant]
US 6878481B2 · Bushong et al. · 2005 [cited by applicant]
US 6885168B2 · Okumura et al. · 2005 [cited by applicant]
US 6902844B2 · Yageta et al. · 2005 [cited by applicant]
US 6914414B2 · Hamada et al. · 2005 [cited by applicant]
US 6945803B2 · Potega · 2005 [cited by applicant]
US 6948078B2 · Odaohhara · 2005 [cited by applicant]
US 6949309B2 · Moores, Jr. et al. · 2005 [cited by applicant]
US 6963186B2 · Hobbs · 2005 [cited by applicant]
US 6981895B2 · Potega · 2006 [cited by applicant]
US 6989652B2 · Saeki et al. · 2006 [cited by applicant]
US 6992463B2 · Yoshio · 2006 [cited by applicant]
US 7002265B2 · Potega · 2006 [cited by applicant]
US 7008720B2 · Shimamura et al. · 2006 [cited by applicant]
US 7014945B2 · Moores et al. · 2006 [cited by applicant]
US 7039821B1 · Potega · 2006 [cited by applicant]
US 7056616B2 · Moores et al. · 2006 [cited by applicant]
US 7058484B1 · Potega · 2006 [cited by applicant]
US 7059769B1 · Potega · 2006 [cited by applicant]
US 7127623B2 · Potega · 2006 [cited by applicant]
US 7157882B2 · Johnson et al. · 2007 [cited by applicant]
US 7180268B2 · Denning et al. · 2007 [cited by applicant]
US 7252904B2 · Moores et al. · 2007 [cited by applicant]
US 7270910B2 · Yahnker et al. · 2007 [cited by applicant]
US 7276881B2 · Okumura et al. · 2007 [cited by applicant]
US 7285334B1 · Yamashita et al. · 2007 [cited by applicant]
US 7288920B2 · Bushong et al. · 2007 [cited by applicant]
US 7326490B2 · Moores, Jr. et al. · 2008 [cited by applicant]
US 7375498B2 · Yamamoto · 2008 [cited by applicant]
US 7393610B2 · Shimamura et al. · 2008 [cited by applicant]
US 7442468B2 · Chen · 2008 [cited by applicant]
US 7456614B2 · Sato et al. · 2008 [cited by applicant]
US 7470485B2 · Kang et al. · 2008 [cited by applicant]
US 7495416B2 · Sato et al. · 2009 [cited by applicant]
US 7507498B2 · Yoon et al. · 2009 [cited by applicant]
US 7508171B2 · Carrier et al. · 2009 [cited by applicant]
US 7510799B2 · Hatta et al. · 2009 [cited by applicant]
US 7514903B2 · Lee · 2009 [cited by applicant]
US 7531270B2 · Buck et al. · 2009 [cited by applicant]
US 7538448B2 · Yoshida et al. · 2009 [cited by applicant]
US 7550950B2 · Tsubaki et al. · 2009 [cited by applicant]
US 7554290B2 · Johnson et al. · 2009 [cited by applicant]
US 7572544B2 · Kozuki et al. · 2009 [cited by applicant]
US 7579732B2 · Yamaguchi et al. · 2009 [cited by applicant]
US 7579782B2 · West · 2009 [cited by applicant]
US 7589499B2 · Denning et al. · 2009 [cited by applicant]
US 7602146B2 · Carrier et al. · 2009 [cited by applicant]
US 7609005B2 · West · 2009 [cited by applicant]
US 7611798B2 · Yoon et al. · 2009 [cited by applicant]
US 7638977B2 · Park · 2009 [cited by applicant]
US 7646169B2 · Liu et al. · 2010 [cited by applicant]
US 7649340B2 · Sato et al. · 2010 [cited by applicant]
US 7667435B2 · Denning · 2010 [cited by applicant]
US 7670184B2 · Akahori et al. · 2010 [cited by applicant]
US 7704635B2 · Kosuda et al. · 2010 [cited by applicant]
US 7710076B2 · Goto · 2010 [cited by applicant]
US 7719234B2 · Carrier et al. · 2010 [cited by applicant]
US 7723921B2 · West · 2010 [cited by applicant]
US 7728553B2 · Carrier et al. · 2010 [cited by applicant]
US 7736792B2 · Moores, Jr. et al. · 2010 [cited by applicant]
US 7772799B2 · Wu · 2010 [cited by applicant]
US 7772805B2 · Yamamoto et al. · 2010 [cited by applicant]
US 7790313B2 · Lee · 2010 [cited by applicant]
US 7807288B2 · Yoon et al. · 2010 [cited by applicant]
US 7807289B2 · Seiler et al. · 2010 [cited by applicant]
US 7808205B2 · Rao et al. · 2010 [cited by applicant]
US 7830121B2 · Sasaki · 2010 [cited by applicant]
US 7838143B2 · Onnerud et al. · 2010 [cited by applicant]
US 7859220B2 · Bushong et al. · 2010 [cited by applicant]
US 7875378B2 · Yang et al. · 2011 [cited by applicant]
US 7892669B2 · Yang et al. · 2011 [cited by applicant]
US 7909657B1 · Abughazaleh et al. · 2011 [cited by applicant]
US 7928692B2 · Carrier et al. · 2011 [cited by applicant]
US 7939193B2 · Moores, Jr. et al. · 2011 [cited by applicant]
US 7952330B2 · Mori · 2011 [cited by applicant]
US 7964303B2 · Takeshita et al. · 2011 [cited by applicant]
US 8012615B2 · Onnerud et al. · 2011 [cited by applicant]
US 8035986B2 · Koetting et al. · 2011 [cited by applicant]
US 8039145B2 · Ha et al. · 2011 [cited by applicant]
US 8049460B2 · Krauer et al. · 2011 [cited by applicant]
US 8057931B2 · Bjork · 2011 [cited by applicant]
US 8058846B2 · Kim · 2011 [cited by applicant]
US 8093863B2 · Carrier et al. · 2012 [cited by applicant]
US 8173293B2 · Kim · 2012 [cited by applicant]
US 8232773B2 · Denning et al. · 2012 [cited by applicant]
US 8257848B2 · Ijaz et al. · 2012 [cited by applicant]
US 8257855B2 · Ijaz et al. · 2012 [cited by applicant]
US 8273471B2 · Hain et al. · 2012 [cited by applicant]
US 8283893B2 · Lee et al. · 2012 [cited by applicant]
US 8288031B1 · Matejek et al. · 2012 [cited by applicant]
US 8313856B2 · Takeshita et al. · 2012 [cited by applicant]
US 8323828B2 · Yamazaki et al. · 2012 [cited by applicant]
US 8409744B2 · Ijaz et al. · 2013 [cited by applicant]
US 8426057B2 · Park et al. · 2013 [cited by applicant]
US 8446120B2 · Forster et al. · 2013 [cited by applicant]
US 8450966B2 · Krauer et al. · 2013 [cited by applicant]
US 8455135B2 · Yamazaki et al. · 2013 [cited by applicant]
US 8482209B2 · West · 2013 [cited by applicant]
US 8497662B2 · Aradachi et al. · 2013 [cited by applicant]
US 8501345B2 · Gardner et al. · 2013 [cited by applicant]
US 8503161B1 · Chang et al. · 2013 [cited by applicant]
US 8512887B2 · Reyburn et al. · 2013 [cited by applicant]
US 8531263B2 · Dietsch et al. · 2013 [cited by applicant]
US 8574740B2 · Quick et al. · 2013 [cited by applicant]
US 8580423B2 · Kim · 2013 [cited by applicant]
US 8592067B2 · Yokoyama et al. · 2013 [cited by applicant]
US 8605450B2 · Kaneshige et al. · 2013 [cited by applicant]
US 8618775B2 · Hermann et al. · 2013 [cited by applicant]
US 8618805B2 · Li · 2013 [cited by applicant]
US 8652678B2 · Musetti · 2014 [cited by applicant]
US 8653787B2 · Cunanan et al. · 2014 [cited by applicant]
US 8663832B2 · Abe et al. · 2014 [cited by applicant]
US 8679670B2 · Onnerud et al. · 2014 [cited by applicant]
US 8691430B2 · Kim · 2014 [cited by applicant]
US 8691446B2 · Sakata et al. · 2014 [cited by applicant]
US 8697264B2 · Park et al. · 2014 [cited by applicant]
US 8698457B2 · Hogari et al. · 2014 [cited by applicant]
US 8704491B2 · Sugiura · 2014 [cited by applicant]
US 8728642B2 · Maskew et al. · 2014 [cited by applicant]
US 8729865B2 · Scheucher · 2014 [cited by applicant]
US 8741466B2 · Youngs et al. · 2014 [cited by applicant]
US 8742724B2 · Suzuki et al. · 2014 [cited by applicant]
US 8742764B2 · Lee et al. · 2014 [cited by applicant]
US 8771863B2 · Amagai et al. · 2014 [cited by applicant]
US 8773073B2 · Kimura · 2014 [cited by applicant]
US 8786261B2 · Andrea · 2014 [cited by applicant]
US 8796995B2 · Cunanan et al. · 2014 [cited by applicant]
US 8802259B2 · Lee et al. · 2014 [cited by applicant]
US 8802264B2 · Lin et al. · 2014 [cited by applicant]
US 8808031B2 · Zhao · 2014 [cited by applicant]
US 8810085B2 · Matsunaga et al. · 2014 [cited by applicant]
US 8815429B2 · Hostler et al. · 2014 [cited by applicant]
US 8822051B2 · Yoo · 2014 [cited by applicant]
US 8828577B2 · Youngs et al. · 2014 [cited by applicant]
US 8830676B2 · Borck et al. · 2014 [cited by applicant]
US 8846239B2 · Park et al. · 2014 [cited by applicant]
US 8846240B2 · Merriman et al. · 2014 [cited by applicant]
US 8846243B2 · Ryu et al. · 2014 [cited by applicant]
US 8847553B2 · Bohan, Jr. et al. · 2014 [cited by applicant]
US 8859124B2 · Tanno · 2014 [cited by applicant]
US 8906531B2 · Caumont et al. · 2014 [cited by applicant]
US 8911253B2 · Myer et al. · 2014 [cited by applicant]
US 8932750B2 · Cooley et al. · 2015 [cited by applicant]
US 8936865B2 · Kim · 2015 [cited by applicant]
US 8968901B2 · Yang et al. · 2015 [cited by applicant]
US 8980452B2 · Hong et al. · 2015 [cited by applicant]
US 8988015B2 · Forster et al. · 2015 [cited by applicant]
US 8999546B2 · Hostler et al. · 2015 [cited by applicant]
US 9000882B2 · Velderman et al. · 2015 [cited by applicant]
US 9001495B2 · Martini et al. · 2015 [cited by applicant]
US 9007015B1 · Nook et al. · 2015 [cited by applicant]
US 9017634B2 · Brambilla et al. · 2015 [cited by applicant]
US 9023499B2 · Takase et al. · 2015 [cited by applicant]
US 9023508B2 · Seong et al. · 2015 [cited by applicant]
US 9028986B2 · Ijaz et al. · 2015 [cited by applicant]
US 9029011B2 · Kim · 2015 [cited by applicant]
US 9034129B2 · Koetting et al. · 2015 [cited by applicant]
US 9050715B2 · Umemura et al. · 2015 [cited by applicant]
US 9054359B2 · Han et al. · 2015 [cited by applicant]
US 9054368B2 · Tong et al. · 2015 [cited by applicant]
US 9054401B2 · Hopkins et al. · 2015 [cited by applicant]
US 9065152B2 · Ryu et al. · 2015 [cited by applicant]
US 9070919B2 · Tada et al. · 2015 [cited by applicant]
US 9070938B2 · Hashimoto et al. · 2015 [cited by applicant]
US 9071069B2 · Brotto et al. · 2015 [cited by applicant]
US 9077035B2 · Kita et al. · 2015 [cited by applicant]
US 9083062B2 · Kumar et al. · 2015 [cited by applicant]
US 9093686B2 · Lee et al. · 2015 [cited by applicant]
US 9097771B2 · Lee et al. · 2015 [cited by applicant]
US 9099725B2 · Langhoff et al. · 2015 [cited by applicant]
US 9099761B2 · Hong · 2015 [cited by applicant]
US 9099796B2 · Myer et al. · 2015 [cited by applicant]
US 9121907B2 · Shiraishi et al. · 2015 [cited by applicant]
US 9124085B2 · Wu et al. · 2015 [cited by applicant]
US 9136524B2 · Kim · 2015 [cited by applicant]
US 9142825B2 · Cho et al. · 2015 [cited by applicant]
US 9147916B2 · Bronczyk et al. · 2015 [cited by applicant]
US 9153978B2 · Reade et al. · 2015 [cited by applicant]
US 9160038B2 · Buck et al. · 2015 [cited by applicant]
US 9166251B2 · Katayama et al. · 2015 [cited by applicant]
US 9172115B2 · Kolden et al. · 2015 [cited by applicant]
US 9178192B2 · Payne · 2015 [cited by applicant]
US 9196879B2 · Hayashi et al. · 2015 [cited by applicant]
US 9203075B2 · Jang et al. · 2015 [cited by applicant]
US 9203118B2 · Lenz et al. · 2015 [cited by applicant]
US 9203125B2 · Bronczyk et al. · 2015 [cited by applicant]
US 9209434B2 · Epstein · 2015 [cited by applicant]
US 9209642B2 · Cunanan et al. · 2015 [cited by applicant]
US 9214650B2 · Lee et al. · 2015 [cited by applicant]
US 9218917B2 · Brambilla et al. · 2015 [cited by applicant]
US 9224516B2 · Nelson et al. · 2015 [cited by applicant]
US 9224997B2 · Osswald · 2015 [cited by applicant]
US 9225275B2 · Sterling et al. · 2015 [cited by applicant]
US 9257729B2 · Hermann et al. · 2016 [cited by applicant]
US 9269934B2 · Yang et al. · 2016 [cited by applicant]
US 9287579B2 · Wyatt et al. · 2016 [cited by applicant]
US 9312580B2 · Nguyen et al. · 2016 [cited by applicant]
US 9316546B2 · Tsubaki et al. · 2016 [cited by applicant]
US 9321340B2 · Maskew et al. · 2016 [cited by applicant]
US 9331325B2 · Lim · 2016 [cited by applicant]
US 9337451B2 · Pinon et al. · 2016 [cited by applicant]
US 9337453B2 · Ogura et al. · 2016 [cited by applicant]
US 9337455B2 · Yang et al. · 2016 [cited by applicant]
US 9343722B2 · Adre et al. · 2016 [cited by applicant]
US 9350000B2 · Hayashi et al. · 2016 [cited by applicant]
US 9350019B2 · Sakata et al. · 2016 [cited by applicant]
US 9350041B2 · Chen et al. · 2016 [cited by applicant]
US 9356278B2 · Suzuki · 2016 [cited by applicant]
US 9360558B2 · Mitelman et al. · 2016 [cited by applicant]
US 9362545B2 · Sugawara · 2016 [cited by applicant]
US 9368771B2 · Seto et al. · 2016 [cited by applicant]
US 9373833B2 · Park et al. · 2016 [cited by applicant]
US 9375852B2 · Rose et al. · 2016 [cited by applicant]
US 9383412B2 · Shiraishi et al. · 2016 [cited by applicant]
US 9385355B2 · Pinon et al. · 2016 [cited by applicant]
US 9385360B2 · Stoughton et al. · 2016 [cited by applicant]
US 9385395B2 · Wu · 2016 [cited by applicant]
US 9385399B2 · Ryu et al. · 2016 [cited by applicant]
US 9397513B2 · Butler et al. · 2016 [cited by applicant]
US 9401250B2 · Velderman et al. · 2016 [cited by applicant]
US 9401257B2 · Dietsch et al. · 2016 [cited by applicant]
US 9406457B2 · Velderman et al. · 2016 [cited by applicant]
US 9412994B2 · Koebler · 2016 [cited by applicant]
US 9413038B2 · Choi et al. · 2016 [cited by applicant]
US 9413088B2 · Brotto et al. · 2016 [cited by applicant]
US 9415674B2 · Youngs et al. · 2016 [cited by applicant]
US 9419268B2 · Lee et al. · 2016 [cited by applicant]
US 9438113B2 · Wyatt et al. · 2016 [cited by applicant]
US 9444086B2 · Shimizu et al. · 2016 [cited by applicant]
US 9444269B2 · Wohltmann et al. · 2016 [cited by applicant]
US 9448287B2 · Okada et al. · 2016 [cited by applicant]
US 9452671B2 · Bennett et al. · 2016 [cited by applicant]
US 9455436B2 · Roh et al. · 2016 [cited by applicant]
US 9461293B2 · Ochi · 2016 [cited by applicant]
US 9461379B2 · Cunanan et al. · 2016 [cited by applicant]
US 9466863B2 · Hong et al. · 2016 [cited by applicant]
US 9472797B2 · Han et al. · 2016 [cited by applicant]
US 9484591B2 · Shin et al. · 2016 [cited by applicant]
US 9496588B2 · Nguyen et al. · 2016 [cited by applicant]
US 9500708B2 · Shiraishi et al. · 2016 [cited by applicant]
US 9502708B2 · Wang et al. · 2016 [cited by applicant]
US 9508498B2 · Forster et al. · 2016 [cited by applicant]
US 9520612B2 · Sato et al. · 2016 [cited by applicant]
US 9525195B2 · Wyatt et al. · 2016 [cited by applicant]
US 9531046B2 · Inoue et al. · 2016 [cited by applicant]
US 9548478B2 · Park et al. · 2017 [cited by applicant]
US 9550425B2 · Sugawara · 2017 [cited by applicant]
US 9553343B2 · Malcolm et al. · 2017 [cited by applicant]
US 9558894B2 · Signorelli et al. · 2017 [cited by applicant]
US 9559394B2 · Eckl et al. · 2017 [cited by applicant]
US 9568557B2 · Kudo et al. · 2017 [cited by applicant]
US 9570822B2 · Cunanan et al. · 2017 [cited by applicant]
US 9570924B2 · Endo et al. · 2017 [cited by applicant]
US 9583745B2 · White et al. · 2017 [cited by applicant]
US 9599674B2 · Shiraishi et al. · 2017 [cited by applicant]
US 9614257B2 · Teramoto et al. · 2017 [cited by applicant]
US 9614259B2 · Bergmann et al. · 2017 [cited by applicant]
US 9620826B2 · Yang et al. · 2017 [cited by applicant]
US 9621009B2 · Matsunaga et al. · 2017 [cited by applicant]
US 9627720B2 · Yun · 2017 [cited by applicant]
US 9627908B2 · Kaminsky et al. · 2017 [cited by applicant]
US 9634295B2 · Dube · 2017 [cited by applicant]
US 9640790B2 · Yoon et al. · 2017 [cited by applicant]
US 9653724B2 · Lim · 2017 [cited by applicant]
US 9673493B2 · Oshima et al. · 2017 [cited by applicant]
US 9680144B2 · Shin · 2017 [cited by applicant]
US 9680178B2 · Deponte et al. · 2017 [cited by applicant]
US 9692087B2 · Wang et al. · 2017 [cited by applicant]
US 9692157B2 · Brotto et al. · 2017 [cited by applicant]
US 9705112B2 · Shin et al. · 2017 [cited by applicant]
US 9711780B2 · Park et al. · 2017 [cited by applicant]
US 9722334B2 · Sterling et al. · 2017 [cited by applicant]
US 9735451B2 · Kim et al. · 2017 [cited by applicant]
US 9741979B2 · Tamura et al. · 2017 [cited by applicant]
US 9746523B2 · Boehm et al. · 2017 [cited by applicant]
US 9746525B2 · Kudo et al. · 2017 [cited by applicant]
US 9748548B2 · Malcolm et al. · 2017 [cited by applicant]
US D797663S · Miller et al. · 2017 [cited by applicant]
US 9760138B2 · Huang et al. · 2017 [cited by applicant]
US 9761911B2 · Lee et al. · 2017 [cited by applicant]
US 9761912B2 · Tenzer et al. · 2017 [cited by applicant]
US 9768435B2 · Koebler et al. · 2017 [cited by applicant]
US 9768473B2 · Roh et al. · 2017 [cited by applicant]
US 9768625B2 · Sakakibara · 2017 [cited by applicant]
US 9770992B2 · Nook et al. · 2017 [cited by applicant]
US 9774064B2 · Dudley et al. · 2017 [cited by applicant]
US 9786878B2 · Hayashi et al. · 2017 [cited by applicant]
US 9786965B2 · Omura · 2017 [cited by applicant]
US 9792038B2 · Gil et al. · 2017 [cited by applicant]
US 9793581B2 · Henrici et al. · 2017 [cited by applicant]
US 9819046B2 · Choi et al. · 2017 [cited by applicant]
US 9819204B2 · Miller et al. · 2017 [cited by applicant]
US 9829953B2 · Reade et al. · 2017 [cited by applicant]
US 9837683B2 · Lundström · 2017 [cited by applicant]
US 9876204B2 · Kim et al. · 2018 [cited by applicant]
US 9882197B2 · Wang et al. · 2018 [cited by applicant]
US D810011S · Nelson et al. · 2018 [cited by applicant]
US 9887398B2 · Yun et al. · 2018 [cited by applicant]
US 9893519B1 · Castillo et al. · 2018 [cited by applicant]
US 9899645B2 · Hayashi et al. · 2018 [cited by applicant]
US 9899658B2 · Biskup et al. · 2018 [cited by applicant]
US 9911954B2 · Li et al. · 2018 [cited by applicant]
US 9912017B1 · Kuo et al. · 2018 [cited by applicant]
US 9917285B1 · Motoyama et al. · 2018 [cited by applicant]
US 9917294B2 · Bang et al. · 2018 [cited by applicant]
US 9923247B2 · Beaston et al. · 2018 [cited by applicant]
US 9929386B2 · Yoshitake et al. · 2018 [cited by applicant]
US 9929441B2 · Kotik · 2018 [cited by applicant]
US 9929451B2 · Ng et al. · 2018 [cited by applicant]
US 9954207B2 · Koebler · 2018 [cited by applicant]
US 9960509B2 · Sterling et al. · 2018 [cited by applicant]
US 9960625B2 · Klein et al. · 2018 [cited by applicant]