Electronic device
An electronic device is disclosed. The electronic device can include a core having a top core section and a bottom core section, a laminate substrate, where the laminate substrate having a void through which the top and bottom core sections are connected, and the laminate substrate having conductive traces. The electronic device can further include a base having a first side including a recess and a second side opposite the first site, at least one of the core and the laminate substrate disposed in the recess of the base, where the base has one or more terminals on the second side to electrically connect to an external device.
1 . An electronic device comprising:
a core comprising a top core section and a bottom core section;
a laminate substrate, the laminate substrate having a void through which the top and bottom core sections are connected, the laminate substrate having conductive traces;
a base having a first side including a recess and a second side opposite the first side, at least one of the core and the laminate substrate disposed in the recess of the base, the base having one or more terminals on the second side to electrically connect to an external device;
wherein the base has at least one vertical terminal lead configured to connect the base to the laminate substrate; and
wherein the laminate substrate has a notch for connecting the at least one vertical terminal lead of the base to the laminate substrate.
2 . The electronic device of claim 1 , wherein the electronic device comprises at least one of a transformer, an inductor, and any other suitable type of electronic device.
3 . The electronic device of claim 1 , wherein intermediate layers of the laminate substrate alternate in a winding structure of Primary-Secondary-Primary to reduce leakage inductance.
4 . The electronic device of claim 1 , wherein the base has six vertical terminal leads, three vertical terminal leads each on a first and second opposing side of the base, to connect the laminate substrate to the base.
5 . The electronic device of claim 1 , wherein the at least one vertical terminal lead is connected to the laminate substrate by a conductive adhesive.
6 . The electronic device of claim 3 , wherein a prepreg insulation is disposed between the intermediate layers of the laminate substrate.
7 . The electronic device of claim 1 , wherein the one or more terminals of the base are configured for surface mounting on the laminate substrate.
8 . The electronic device of claim 1 , wherein the core and the laminate substrate are inserted into and attached by an adhesive to positioning columns of the base.
9 . The electronic device of claim 8 , wherein an arc opening is disposed on the positioning columns for dispensing the adhesive to attach the base, the laminate substrate, and the core.
10 . An electronic device comprising:
an electrical component;
a base having a first side and a second side opposite the first side, the electrical component coupled to the first side of the base, the base having one or more terminals on the second side to electrically connect to a laminate substrate and configured for surface mounting to the laminate substrate.
11 . The electronic device of claim 10 , wherein the electrical component is comprised of a core and the laminate substrate, the core comprising a top core section and a bottom core section.
12 . The electronic device of claim 11 , wherein the laminate substrate has conductive traces, the laminate substrate containing a void to allow for the top and bottom core sections to attach to one another through the void.
13 . The electronic device of claim 10 , wherein the notch comprises a semi-circular cutout in the laminate substrate comprising conductive material.
14 . The electronic device of claim 10 , wherein the electrical component is disposed into and attached by an adhesive to position columns of the base.
15 . A method of manufacturing an electronic device, the method comprising:
fitting a top core section and a bottom core section of a core through a void of a laminate substrate and around a periphery of the laminate substrate;
mounting at least one of the core and laminate substrate on a first side of a base;
connecting one or more pins on a second side of the base to an external device, the one or more pins comprising a terminal on the second side opposite the first side of the base;
connecting the laminate substrate to at least one vertical terminal lead of the base; and
wherein the laminate substrate has a notch for connecting the at least one vertical terminal lead of the base to the laminate substrate.
16 . The method of claim 15 , further comprising connecting the laminate substrate to the vertical terminal leads of the base by a conductive adhesive.
17 . The method of claim 15 , further comprising securing the core and laminate substrate to the base with an adhesive.