IP Library Granted Patent US 12,640,352
Granted Patent B2
US 12,640,352 · App. 18/770,520 · Granted May 26, 2026

Microwave resonator array for plasma diagnostics

Inventors: David John Peterson (San Jose, CA); Chuang-Chia Lin (San Ramon, CA)
Assignee: Applied Materials, Inc.
H01J37/32917H01J37/3222H01J37/32899H01J2237/24507H01J2237/24585
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,640,352
App. No.
18/770,520
Granted
May 26, 2026
Kind
B2
Abstract

Embodiments disclosed herein include sensor devices and methods of using the sensor devices. In an embodiment, a sensor device comprises a substrate, a support extending up from the substrate, and a resonator mechanically coupled to the support. In an embodiment, the sensor device further comprises an antenna that is configured to electromagnetically couple with the resonator, wherein the antenna is connected to a transmission line in the substrate.

Claims (24)

1 . A sensor device, comprising:

a substrate;

a support extending up from the substrate;

a resonator mechanically coupled to the support; and

an antenna vertically overlapping with the resonator, wherein the antenna is connected to a transmission line in the substrate.

2 . The sensor device of claim 1 , wherein the resonator is a hairpin resonator with a pair of tines.

3 . The sensor device of claim 2 , wherein a resonant frequency of the resonator is approximately 1 GHz or greater.

4 . The sensor device of claim 1 , wherein a distance between the resonator and the substrate is greater than a Debye length of a plasma.

5 . The sensor device of claim 1 , wherein the antenna is embedded in the substrate.

6 . The sensor device of claim 1 , wherein the antenna is above the substrate and coupled to the support.

7 . The sensor device of claim 1 , wherein the antenna is a spiral antenna.

8 . The sensor device of claim 1 , wherein the resonator is an RF resonator.

9 . The sensor device of claim 1 , wherein the support is removably mounted to the substrate.

10 . The sensor device of claim 1 , wherein the sensor device is configured to wirelessly communicate with an external device.

11 . A sensor device, comprising:

a substrate;

a plurality of supports extending up from the substrate;

a plurality of resonators, wherein individual ones of the plurality of resonators are coupled to an individual ones of the plurality of supports; and

a plurality of antennas, wherein individual ones of the plurality of antennas are vertically overlapping an individual one of the plurality of resonators, and wherein the plurality of antennas are connected to a single transmission line.

12 . The sensor device of claim 11 , wherein the plurality of supports have non-uniform heights.

13 . The sensor device of claim 11 , wherein individual ones of the plurality of resonators comprise a pair of tines, and wherein the pairs of tines have a non-uniform length or a non-uniform width.

14 . The sensor device of claim 11 , further comprising:

circuitry for communicatively coupling the single transmission line to an external device with a wireless or wired connection, wherein the circuitry comprises:

passive RF circuit elements and/or active RF circuit elements.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 12, 2024
From: PETERSON, DAVID JOHN; LIN, CHUANG-CHIA
To: APPLIED MATERIALS, INC.
Reel/Frame 067981/0377 →
Continuity (2)
Continuation 17395351 · Aug 5, 2021
Related Publication 20240371615A1 · Nov 7, 2024
References Cited (22)
US 20050034812A1 · Roche et al. · 2005 [cited by applicant]
US 20170023511A1 · Wilkinson · 2017 [cited by examiner]
US 20170221775A1 · Tedeschi et al. · 2017 [cited by applicant]
US 20190113400A1 · Pillars et al. · 2019 [cited by applicant]
US 20190187105A1 · Ram · 2019 [cited by examiner]
US 20190385875A1 · WVu · 2019 [cited by applicant]
US 20230003598A1 · Lin · 2023 [cited by examiner]
JP 2010232110 · 2010 [cited by applicant]
JP 2013518370A · 2013 [cited by applicant]
JP 2017069212A · 2017 [cited by applicant]
JP 2024525450A · 2024 [cited by applicant]
KR 1020190133926 · 2019 [cited by applicant]
KR 20190133926A · 2019 [cited by applicant]
Official Letter from Taiwan Patent Application No. 111128483 dated Sep. 10, 2025, 6 pgs. [cited by applicant]
Official Letter from Taiwan Patent Application No. 111128483 dated Aug. 29, 2024, 12 pgs. [cited by applicant]
Office Action from Taiwan Patent Application No. 111128483 dated May 29, 2025, 8 pgs. [cited by applicant]
Notice to File a Response for Korean Patent Application No. 10-2024-7006899 dated Mar. 29, 2025, 6 pgs. [cited by applicant]
Notice of Reasons for Rejection for Japanese Patent Application No. 2024-506680 dated Feb. 12, 2025, 8 pgs. [cited by applicant]
“Electron temperature measurements with a hairpin resonator probe in a pulsed low pressure capacitively coupled plasma,” D. Peterson, et al., Plasma Sources Science and Technology, Jun. 17, 2021, 17 pgs. [cited by applicant]
International Search Report and Written Opinion from PCT/US2022/037626 dated Nov. 7, 2022, 11 pgs. [cited by applicant]
Non-Final Office Action from U.S. Appl. No. 17/395,351 dated Dec. 13, 2023, 10 pgs. [cited by applicant]
International Preliminary Report on Patentability from PCT/US2022/037626 dated Feb. 15, 2024, 7 pgs. [cited by applicant]