Sensor module with calibration information

1 . A sensor module with calibration information, comprising:

a sensing unit;

a tail circuit with a first end and a second end, wherein the first end of the tail circuit is electrically coupled to the sensing unit;

a first circuit board with a first end and a second end, wherein the first end of the first circuit board is electrically coupled to the second end of the tail circuit; and

a memory located directly on the first circuit board or directly on the sensing unit.

2 . The sensor module of claim 1 , wherein the memory contains at least one information selected from a group consisting of: calibration information, production information, and client information.

3 . The sensor module of claim 1 , further comprising:

a first interface, located at the second end of the first circuit board, for quick connect and disconnect to an external element.

4 . The sensor module of claim 3 , further comprising:

a first scanning circuit box electrically coupled to the sensor module.

5 . The sensor module of claim 4 , further comprising:

a first cable with a first end and a second end, wherein the first end of the first cable is electrically coupled to the sensor module, and the second end of the first cable is electrically coupled to the first scanning circuit box.

6 . The sensor module of claim 5 , further comprising:

an information processing unit electrically coupled to the first scanning circuit box.

7 . The sensor module of claim 6 , wherein the information processing unit is selected from a device group consisting of: personal computer, mobile communication device, remote server, and another microcontroller.

8 . The sensor module of claim 7 , further comprising:

a second cable with a first end and a second end, wherein

the first end of the second cable is electrically coupled to the first scanning circuit box, and

the second end of the second cable is electrically coupled to the information processing unit.

9 . The sensor module of claim 4 , wherein the scanning circuit box further comprises:

a microcontroller unit electrically coupled to the memory for reading the calibration information from the memory.

10 . The sensor module of claim 9 , wherein the scanning circuit box further comprises:

a second circuit board, with the microcontroller unit mounted on the second circuit board, and

the microcontroller unit is electrically coupled to the second circuit board.

11 . The sensor module of claim 10 , further comprising:

an information processing unit, wherein the first scanning circuit box is electrically coupled to the information processing unit, and

the microcontroller unit, after integrating data from the sensor module and the memory, transmits the information to the information processing unit.

12 . The sensor module of claim 11 , wherein

the information processing unit receives information from the microcontroller unit and performs corresponding calculations and notifications, and

the information processing unit also sends instructions to the microcontroller unit to initiate corresponding actions.

13 . The sensor module of claim 12 , wherein the memory is a non-volatile memory selected from a group consisting of:

Programmable Read-Only Memory (PROM), Erasable Programmable Read-Only Memory (EPROM), Electrically Erasable Programmable Read-Only Memory (EEPROM), Flash memory, and Radio-Frequency Identification (RFID) memory.

14 . The sensor module of claim 13 , wherein the interface is one selected from a group consisting of: RS232, SPI, I2C, RS485, Ethernet, WIFI, BLE (Bluetooth Low Energy), and Zigbee.

15 . The sensor module of claim 4 , wherein the memory contains production information or client information; the scanning circuit box further comprises a microcontroller unit, wherein the microcontroller unit is electrically coupled to a remote server, and the microcontroller unit is configured to:

search for the corresponding calibration information,

download the calibration information, and

store the calibration information in the memory for backup.

16 . The sensor module of claim 15 , further comprises a calibration procedure before leaving factory, the calibration procedure comprises:

(1) preparing a sensor signal calibration instrument;

(2) preparing a sensor module with a memory which stores production information or client information;

(3) electrically coupling the sensor module to the signal calibration instrument;

(4) the signal calibration instrument applying a standard physical input to the sensor module, causing the sensor module to generate a corresponding sensor signal;

(5) the signal calibration instrument scanning and reading the sensor signal;

(6) the signal calibration instrument comparing the sensor signal to the standard physical input and calculating a calibration information; and

(7) the signal calibration instrument storing the calibration information, production information, or client information into the manufacturer's server for backup.

17 . The sensor module of claim 16 , further comprising a client-side procedure for obtaining calibration information:

(1) a microcontroller unit MCU reading the production information or client information from the memory;

(2) the microcontroller unit MCU transmitting the production information or client information to the manufacturer's server;

(3) the manufacturer's server searching for the calibration information of the sensor module based on the production information or the client information;

(4) the manufacturer's server transmitting the calibration information to the microcontroller unit MCU; and

(5) the microcontroller unit MCU storing the received calibration information into the memory for backup.

18 . The sensor module of claim 17 , further comprising a procedure for testing physical inputs on client-side, including:

(1) the sensor module generating a corresponding sensor signal when the sensor module detecting a specific physical input;

(2) the microcontroller unit MCU reading the sensor signal and comparing it to the calibration information stored in the memory; and

(3) the microcontroller unit MCU transmitting the calibrated sensor signal to an information processing unit for further processing.

19 . The sensor module of claim 1 , wherein the sensor module is one selected from a group consisting of: a force sensor module, a temperature sensor module, and a humidity sensor module.

20 . The sensor module of claim 1 , further comprising a calibration procedure before leaving factory, which comprises:

(1) preparing a sensor signal calibration instrument;

(2) preparing a sensor module with a memory; (wherein the memory is prepared to store calibration information);

(3) electrically coupling the sensor module to the sensor signal calibration instrument;

(4) the signal calibration instrument applying a standard physical input to the sensor, causing the sensor to generate a corresponding sensor signal;

(5) the signal calibration instrument scanning and reading the sensor signal;

(6) the signal calibration instrument comparing the sensor signal to the standard physical input and calculating a calibration information; and

(7) the signal calibration instrument storing the calibration information in memory for future use.

21 . The sensor module of claim 20 , further comprising a client-side procedure for testing physical inputs, which comprises:

(1) preparing the sensor module with the memory storing the calibration information;

(2) the sensor module detecting a physical input and generating a corresponding sensor signal;

(3) a microcontroller unit MCU reading the sensor signal;

(4) the microcontroller unit MCU comparing the sensor signal with the calibration information in the memory; and

(5) the microcontroller unit MCU transmitting the calibrated sensor signal to an information processing unit for further processing.

22 . The sensor module of claim 1 , wherein a first set of multiple metal pads is positioned at the second end of the first circuit board to facilitate electrical coupling of the sensor module to external devices.

23 . The sensor module of claim 1 , wherein the memory is located directly on the first circuit board.

24 . The sensor module of claim 1 , wherein the memory is located directly on the sensing unit.

25 . A sensor system, comprising:

a first sensor module and a second sensor module, wherein each of the first sensor module and the second sensor module comprises:

a sensing unit;

a tail circuit with a first end and a second end, wherein the first end of the tail circuit is electrically coupled to the sensing unit;

a first circuit board with a first end and a second end, wherein the first end of the first circuit board is electrically coupled to the second end of the tail circuit; and

a memory located on one site selected from a group consisting of: the first circuit board, the tail circuit, and the sensing unit;

a first scanning circuit box electrically coupled to the first sensor module;

a first cable with a first end and a second end, wherein

the first end of the first cable is electrically coupled to the first sensor module, and

the second end of the first cable is electrically coupled to the first scanning circuit box;

an information processing unit electrically coupled to the first scanning circuit box;

a second cable with a first end and a second end, wherein

the first end of the second cable is electrically coupled to the first scanning circuit box, and

the second end of the second cable is electrically coupled to the information processing unit; and

a second scanning circuit box with a first end and a second end, wherein

the first end of the second scanning circuit box is electrically coupled to the second sensor module, and

the second end of the second scanning circuit box is electrically coupled to the first scanning circuit box.

26 . The sensor system of claim 25 , further comprising:

a third cable with a first end and a second end, wherein

the first end of the third cable is electrically coupled to the second sensor module, and

the second end of the third cable is electrically coupled to the second scanning circuit box.

27 . The sensor system of claim 26 , further comprising:

a fourth cable with a first end and a second end, wherein

the first end of the fourth cable is electrically coupled to the first scanning circuit box, and

the second end of the fourth cable is electrically coupled to the second scanning circuit box.

28 . The sensor system of claim 27 , further comprising:

a third sensor module; and

a third scanning circuit box with a first end and a second end, wherein:

the first end of the third scanning circuit box is electrically coupled to the third sensor module, and

the second end of the third scanning circuit box is electrically coupled to the second scanning circuit box.

29 . The sensor system of claim 28 , further comprising:

a fifth cable with a first end and a second end, wherein

the first end of the fifth cable is electrically coupled to the third sensor module, and

the second end of the fifth cable is electrically coupled to the third scanning circuit box.

30 . The sensor system of claim 29 , further comprising:

a sixth cable with a first end and a second end, wherein

the first end of the sixth cable is electrically coupled to the third scanning circuit box, and

the second end of the sixth cable is electrically coupled to the second scanning circuit box.

31 . A sensor system, comprising:

a sensor module, comprising:

a sensing unit;

a tail circuit with a first end and a second end, wherein the first end of the tail circuit is electrically coupled to the sensing unit;

a first circuit board with a first end and a second end, wherein the first end of the first circuit board is electrically coupled to the second end of the tail circuit; and

a memory located on one site selected from the group consisting of: the first circuit board, the tail circuit, and the sensing unit,

wherein a first set of multiple metal pads is positioned at the second end of the first circuit board to facilitate electrical coupling of the sensor module to external devices; and

a scanning circuit box electrically coupled to the sensor module, the scanning circuit box having:

a second circuit board;

a second set of multiple metal pads positioned at a first end of the second circuit board, the first end of the second circuit board extending to a side of the scanning circuit box; and

an opening configured in the side of the scanning circuit box that, when the first circuit board is inserted, facilitates electrical coupling of the second set of multiple metal pads to the first set of multiple metal pads.