IP Library Granted Patent US 12,656,377
Granted Patent B2
US 12,656,377 · App. 18/619,166 · Granted Jun 16, 2026

Current measurement module

Inventor: Taiga Kyosaki (Tokyo, JP)
Assignee: Asahi Kasei Microdevices Corporation
G01R19/0092G01R33/0005G01R33/072
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,656,377
App. No.
18/619,166
Granted
Jun 16, 2026
Kind
B2
Abstract

Solution: Provided is a current measurement module comprising: a conductor comprising two main body portions and two current paths having cross-sectional areas different from each other, wherein the two current paths are disposed between the two main body portions and extend in parallel to each other with a gap provided therebetween; two magnetic field sensing elements which each have a magnetosensitive surface disposed such that magnetic fields generated by currents flowing through the two current paths penetrate through the magnetosensitive surface in opposite directions to each other; and a substrate which supports the two magnetic field sensing elements and is attached to the conductor, wherein the substrate is inserted into the gap, and a distance between the two magnetic field sensing elements and an inner end of a current path of the two current paths having a smaller cross-sectional area is smaller than a distance between the two magnetic field sensing elements and an inner end of a current path of the two current paths having a larger cross-sectional area.

Claims (20)

1 . A current measurement module comprising:

a conductor integrally formed as a single plate body comprising two main body portions and two current paths connected to the main body portions, wherein the two current paths are disposed between the two main body portions and extend in parallel to each other with a gap provided therebetween, the gap surrounded by the two current paths and portions of the two main body portions;

two magnetic field sensing elements which each have a magnetosensitive surface disposed such that magnetic fields generated by currents flowing through the two current paths penetrate through the magnetosensitive surface in opposite directions to each other; and

a substrate which supports the two magnetic field sensing elements and is attached to the conductor, wherein

the substrate is inserted into the gap, and

a distance between the two magnetic field sensing elements and an inner end of a current path of the two current paths having a smaller cross-sectional area is smaller than a distance between the two magnetic field sensing elements and an inner end of a current path of the two current paths having a larger cross-sectional area.

2 . The current measurement module according to claim 1 , wherein each of the two current paths is disposed farther inward than outer edges of the two main body portions in a direction in which the two current paths are aligned.

3 . The current measurement module according to claim 1 , wherein the two main body portions comprise slits, respectively, which extend from the gap and are narrower than the gap.

4 . The current measurement module according to claim 3 , wherein each of the slits have a tapered portion tapering from a side adjacent to the two current paths to a side adjacent to the two main body portions.

5 . The current measurement module according to claim 3 , wherein the substrate is inserted into the gap and the slits.

6 . The current measurement module according to claim 3 , wherein the substrate is inserted into the gap and the slits, and at least a part of the substrate contacts with an edge of each of the slits.

7 . The current measurement module according to claim 3 , wherein the slits are disposed farther inward than outer edges of the gap in a direction in which the two current paths are aligned.

8 . The current measurement module according to claim 3 , wherein the gap and the slits constitute an opening having a T-shape.

9 . The current measurement module according to claim 1 , wherein the two magnetic field sensing elements are arranged on a surface on the substrate facing the current path having the smaller cross-sectional area.

10 . The current measurement module according to claim 1 , wherein each of the two main body portions comprises a first extending portion extending in a direction orthogonal to a direction in which currents flow through the two current paths.

11 . The current measurement module according to claim 10 , wherein the first extending portion of each of the two main body portions extends in opposite directions to each other.

12 . The current measurement module according to claim 10 , wherein at least one of the two main body portions further comprises a second extending portion further extending from the first extending portions, and the second extending portion extends in a direction orthogonal to a plane in which the two main body portions are arranged.

13 . The current measurement module according to claim 1 , wherein the two current paths have same thicknesses and different widths.

14 . The current measurement module according to claim 1 , wherein a ratio of the distance between the two magnetic field sensing elements and the inner end of the current path having the smaller cross-sectional area to the distance between the two magnetic field sensing elements and the inner end of the current path having the larger cross-sectional area is within a range from 6:7 to 6:11.

15 . The current measurement module according to claim 1 , wherein a ratio of a cross-sectional area of the current path having the smaller cross-sectional area to a cross-sectional area of the current path having the larger cross-sectional area is within a range from 5:6 to 5:11.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 1, 2024
From: KYOSAKI, TAIGA
To: ASAHI KASEI MICRODEVICES CORPORATION
Reel/Frame 066967/0463 →
Priority Claims (1)
JP 2023-059252 · Mar 31, 2023 · national
Continuity (1)
Related Publication 20240345140A1 · Oct 17, 2024
References Cited (46)
US 6459255B1 · Tamai · 2002 [cited by examiner]
US 6512359B1 · Tamai · 2003 [cited by examiner]
US 8330453B2 · Hotz · 2012 [cited by examiner]
US 10215780B2 · Shimizu · 2019 [cited by examiner]
US 10267825B2 · Sakaguchi · 2019 [cited by examiner]
US 11366141B1 · Daubert · 2022 [cited by examiner]
US 11402409B1 · McNally · 2022 [cited by examiner]
US 20070279053A1 · Taylor · 2007 [cited by examiner]
US 20080094060A1 · Muraki · 2008 [cited by applicant]
US 20080186021A1 · Hashio · 2008 [cited by applicant]
US 20100045286A1 · Hotz · 2010 [cited by examiner]
US 20110221430A1 · Ito · 2011 [cited by applicant]
US 20130187633A1 · Yasui · 2013 [cited by applicant]
US 20130214593A1 · Ohashi · 2013 [cited by applicant]
US 20130320968A1 · Sakamoto · 2013 [cited by applicant]
US 20140097826A1 · Hebiguchi · 2014 [cited by examiner]
US 20140103918A1 · Nomura · 2014 [cited by applicant]
US 20140320122A1 · Fukui · 2014 [cited by examiner]
US 20150123650A1 · Matsue · 2015 [cited by examiner]
US 20150204916A1 · Akimoto · 2015 [cited by applicant]
US 20150204919A1 · Akimoto · 2015 [cited by examiner]
US 20150245534A1 · Seo · 2015 [cited by applicant]
US 20170003323A1 · Nakayama · 2017 [cited by applicant]
US 20170082659A1 · Harada · 2017 [cited by applicant]
US 20170212153A1 · Tsujimoto · 2017 [cited by applicant]
US 20170343584A1 · Abe · 2017 [cited by applicant]
US 20180306842A1 · Fukunaka · 2018 [cited by examiner]
US 20190187183A1 · Okuyama · 2019 [cited by examiner]
US 20190293733A1 · Esaka · 2019 [cited by applicant]
US 20200011902A1 · Shimizu · 2020 [cited by applicant]
US 20200256897A1 · Fujimori · 2020 [cited by applicant]
US 20210080489A1 · Koizumi · 2021 [cited by examiner]
US 20210285794A1 · Briano · 2021 [cited by examiner]
US 20210311136A1 · Augendre · 2021 [cited by applicant]
US 20220091161A1 · Houis · 2022 [cited by applicant]
US 20220163571A1 · Ito · 2022 [cited by examiner]
US 20230092098A1 · Tamura · 2023 [cited by examiner]
DE 102021119837A1 · 2023 [cited by applicant]
JP 2002277491A · 2002 [cited by applicant]
JP 2005283451A · 2005 [cited by applicant]
JP 2008216230A · 2008 [cited by applicant]
JP 2013170878A · 2013 [cited by applicant]
JP 2014055790A · 2014 [cited by applicant]
JP 2016121960A · 2016 [cited by applicant]
JP 2018185225A · 2018 [cited by applicant]
JP 2022158768A · 2022 [cited by applicant]