Granted Patent B2

US 12,701,660 · App. 17/588,630 · Granted Aug 4, 2026

Inventors: Daocheng Huang (Santa Clara, CA); Zhao Yuan (San Jose, CA); Yishi Su (Hangzhou, CN); Wenyang Huang (Hangzhou, CN); Xintong Lyu (San Jose, CA)

Assignee: Monolithic Power Systems, Inc.

H05K1/181H01F27/24H01F27/28H05K1/111H05K1/14H05K2201/1003

Abstract

Claims (44)

1 . A sandwich structure power supply module, comprising:

an inductor pack having a magnetic core, a first winding and a second winding;

a top PCB (Printed Circuit Board) on top of the inductor pack;

a first power device chip and a second power device chip on top of the top PCB, wherein the first power device chip has a power pin, a ground reference pin, and at least one pin electrically connected to the first winding via the top PCB, and the second power device chip has a power pin, a ground reference pin, and at least one pin electrically connected to the second winding via the top PCB;

a first metal layer electrically connected to the ground reference pin of the first power device chip, wherein the first metal layer covers a first side surface of the magnetic core, and wherein the first side surface is perpendicular to the top PCB;

a second metal layer electrically connected to the power pin of the first power device chip and the power pin of the second power device chip, wherein the second metal layer covers a second side surface of the magnetic core, and the second side surface is perpendicular to the first side surface and the top PCB; and

a third metal layer electrically connected to the ground reference pin of the second power device chip, wherein the third metal layer covers a third side surface of the magnetic core, and the third side surface is parallel to the first side surface; wherein

the first winding and the second winding each has a first end and a second end, and wherein at least one of the first end and the second end is bent to and extended at a plane perpendicular to an axis along a length of the winding.

2 . The sandwich structure power supply module of claim 1 , further comprising:

a bottom PCB at bottom of the sandwich structure power supply module; and

a connector, connected between the bottom PCB and the top PCB, wherein the connector has a plurality of metal pillars respectively and electrically connecting solder pads on the bottom PCB to solder pads on the top PCB.

3 . The sandwich structure power supply module of claim 1 , wherein the

magnetic core comprises first magnetic core part, a second magnetic core part and a third magnetic core part, wherein the first magnetic core part has trenches respectively at two opposite side surfaces, and the second magnetic core part and the third magnetic core part are fit into the trenches, and leave two passageways along the two trenches of the first magnetic core part; and

wherein the two windings respectively pass through the two passageways between the first magnetic core part, the second magnetic core part and the third magnetic core part.

4 . The sandwich structure power supply module of claim 1 , wherein the

magnetic core comprises a first magnetic core part, a second magnetic core part and a third magnetic core part, wherein the first magnetic core part has an “H” shape from top view, and has trenches respectively at two opposite side surfaces, and wherein the second magnetic core part and the third magnetic core part are fit into the trenches, and leave two passageways along the two trenches of the first magnetic core part; and

wherein the two windings respectively pass through the two passageways between the first magnetic core part, the second magnetic core part and the third magnetic core part.

5 . The sandwich structure power supply module of claim 1 , wherein the

magnetic core, having a symmetrical shape from top view, has two passageways passing through the magnetic core from top to bottom, and symmetrically located on two sides of a central axis of a top surface of the symmetrical magnetic core; and

wherein the two windings respectively pass through the two passageways.

6 . The sandwich structure power supply module of claim 1 , wherein the

magnetic core, having a symmetrical shape from top view, has two passageways passing through the magnetic core from top to bottom, and symmetrically located on two sides of a central axis of a top surface of the symmetrical magnetic core, wherein two air gaps are respectively distributed along the passageways, passing through two arms of the magnetic core; and

wherein the two windings respectively pass through the two passageways.

7 . The sandwich structure power supply module of claim 1 , wherein at least one of the first metal layer, and the second metal layer has a C-shape from side view, and has a first end bent to be extended along and soldered to a bottom surface of the top PCB, and a second end bent to be extended along a bottom surface of the inductor pack.

8 . The sandwich structure power supply module of claim 1 , wherein at least one of the first metal layer, and the second metal layer has an L-shape and has a first end bent to be extended along and soldered to a bottom surface of the top PCB.

9 . A power supply module, comprising:

an inductor pack having a magnetic core, a first winding and a second winding;

a top PCB (Printed Circuit Board) on top of the inductor pack;

a first power device chip and a second power device chip on top of the top PCB, wherein each of the first power device chip and the second power device chip has a first pin, a second pin and a third pin, the first pin of the first power device chip is electrically connected to the first winding via the top PCB, the first pin of the second power device chip is electrically connected to the second winding via the top PCB;

a first metal layer electrically connected to the second pin of the first power device chip, wherein the first metal layer at least partially covers a first side surface of the magnetic core, and wherein the first side surface is perpendicular to the top PCB;

a second metal layer electrically connected to the second pin of the second power device chip, wherein the second metal layer at least partially covers a second side surface of the magnetic core, and the second side surface is parallel to the first side surface; and

a third metal layer electrically connected to the third pin of the first power device chip and the third pin of the second power device chip, wherein the third metal layer at least partially covers a third side surface of the magnetic core, and the third side surface is perpendicular to the first side surface and the top PCB; wherein

each of the first winding and the second winding has a first end and a second end, and wherein at least one of the first end and the second end is bent to and extended at a plane perpendicular to an axis along a length of the winding.

10 . The power supply module of claim 9 , further comprising:

a bottom PCB at bottom of the power supply module; and

a connector, connected between the bottom PCB and the top PCB, wherein the connector has a plurality of metal pillars respectively and electrically connecting solder pads on the bottom PCB to solder pads on the top PCB.

11 . The power supply module of claim 9 , wherein the magnetic core comprises a first magnetic core part, a second magnetic core part and a third magnetic core part, wherein the first magnetic core part has trenches respectively at two opposite side surfaces, and the second magnetic core part and the third magnetic core part are fit into the trenches, and leave two passageways along the two trenches of the first magnetic core part; and

wherein the two windings respectively pass through the two passageways between the first magnetic core part, the second magnetic core part and the third magnetic core part.

12 . The power supply module of claim 9 , wherein the magnetic core comprises a first magnetic core part, a second magnetic core part and a third magnetic core part, wherein the first magnetic core part has an “H” shape from top view, and has trenches respectively at two opposite side surfaces, and wherein the second magnetic core part and the third magnetic core part are fit into the trenches, and leave two passageways along the two trenches of the first magnetic core part; and

wherein the two windings respectively pass through the two passageways between the first magnetic core part, the second magnetic core part and the third magnetic core part.

13 . The power supply module of claim 9 , wherein the magnetic core, having a symmetrical shape from top view, has two passageways passing through the magnetic core from top to bottom, and symmetrically located on two sides of a central axis of a top surface of the symmetrical magnetic coFre; and

wherein the two windings respectively pass through the two passageways.

14 . The power supply module of claim 9 , wherein the second pin is one of a ground reference pin and a power pin, and the third pin is the other one of the ground reference pin and the power pin.

15 . The power supply module of claim 9 , wherein at least one of the first metal layer, the second metal layer, and the third metal layer has a C-shape from side view, and has a first end bent to be extended along and soldered to a bottom surface of the top PCB, and a second end bent to be extended along a bottom surface of the inductor pack.

Assignments (1)

Continuity (2)

References Cited (38)