Light-emitting diode circuit substrate and manufacturing method thereof
A light-emitting diode circuit substrate including multiple light-emitting diode chips, a redistribution structure, and multiple bonding pads is provided. The light-emitting diode chips include multiple contacts. The redistribution structure is disposed on the light-emitting diode chips and in direct contact with the plurality of contacts. The plurality of bonding pads are disposed on the redistribution structure and electrically connected to the plurality of contacts of the light-emitting diode chips via the redistribution structure. A manufacturing method of the light-emitting diode circuit substrate is also provided.
1 . A manufacturing method of a light emitting diode (LED) circuit substrate, comprising:
forming a peelable layer on a carrier plate;
forming a color conversion layer on the peelable layer, wherein the color conversion layer is configured to convert a light with a short wavelength into a light with a long wavelength;
disposing a plurality of LED chips on the color conversion layer after forming the color conversion layer on the peelable layer, wherein the plurality of LED chips are configured to provide at least one color light, and a plurality of contacts of the plurality of LED chips are away from the peelable layer;
measuring positions of the plurality of contacts of the plurality of LED chips disposed on the peelable layer to obtain contact position data;
providing an exposure circuit diagram according to the contact position data; and
sequentially forming a redistribution structure and a plurality of bonding pads on the plurality of LED chips according to the exposure circuit diagram, wherein the plurality of bonding pads are electrically connected with the plurality of contacts of the plurality of LED chips via the redistribution structure.
2 . The manufacturing method of the LED circuit substrate as claimed in claim 1 , wherein the peelable layer comprises a light debonding layer, a heat debonding layer, or a cold debonding layer.
3 . The manufacturing method of the LED circuit substrate as claimed in claim 1 , wherein the plurality of LED chips comprise a plurality of red LED chips, a plurality of green LED chips, and a plurality of blue LED chips.
4 . The manufacturing method of the LED circuit substrate as claimed in claim 1 , wherein the plurality of LED chips are a plurality of blue LED chips.
5 . The manufacturing method of the LED circuit substrate as claimed in claim 1 , wherein the redistribution structure and the plurality of bonding pads are formed on the plurality of LED chips by a maskless photolithography process.
6 . The manufacturing method of the LED circuit substrate as claimed in claim 1 , further comprising:
conducting an electrical test on the plurality of LED chips after the contact position data is obtained and before the redistribution structure and the plurality of bonding pads are formed.
7 . The manufacturing method of the LED circuit substrate as claimed in claim 1 , wherein the redistribution structure comprises a plurality of insulating layers, and a material of the insulating layers comprises photosensitive polyimide.