Granted Patent
Utility
US 4,331,970 · App. 06/201,143
Use of dispersed solids as fillers in polymeric materials to provide material for semiconductor junction passivation
Inventor:
Alexander J. Yerman
Patented Case
View Patent ↗
Granted: May 25, 1982
Filed: Oct 27, 1980
Inventor
Alexander J. Yerman
Assignee (at issue)
General Electric Company
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.