Granted Patent
Utility
US 4,485,958 · App. 06/478,691
Tool for removing soldered IC packages
Inventor:
Zeev Lipkes
Patented Case
View Patent ↗
Granted: Dec 4, 1984
Filed: Mar 25, 1983
Inventor
Zeev Lipkes
Assignee (at issue)
Burroughs, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.