Granted Patent
Utility
US 4,544,577 · App. 06/604,076
Process for metallization of dielectric substrate through holes
Inventor:
Ruth A. May
Patented Case
View Patent ↗
Granted: Oct 1, 1985
Filed: Apr 26, 1984
Inventor
Ruth A. May
Assignee (at issue)
E.F. Johnson Company
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.