IP Library › Granted Patent US 4,685,998
Granted Patent Utility
US 4,685,998 · App. 06/917,040

Process of forming integrated circuits with contact pads in a standard array

Patented Case View Patent ↗
Granted: Aug 11, 1987 Filed: Oct 9, 1986
Assignee (at issue)
Thomson Components-Moster Corporation

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Quick Facts
Patent No.
US 4,685,998
App. No.
06/917,040
Filed
1986-10-09
Granted
1987-08-11
Kind
A